METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
To provide a method for manufacturing wiring circuit boards that enables efficient manufacturing of wiring circuit boards.SOLUTION: In a method for manufacturing a wiring circuit board 11 by the subtractive method, a preparation process is performed to prepare a metal clad laminate 1 with a metal la...
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| creator | OSUMI YUKI NISHINO KOTA |
| description | To provide a method for manufacturing wiring circuit boards that enables efficient manufacturing of wiring circuit boards.SOLUTION: In a method for manufacturing a wiring circuit board 11 by the subtractive method, a preparation process is performed to prepare a metal clad laminate 1 with a metal layer 2 for forming a metal support substrate 12 of the wiring circuit board 11 and a photosensitive resin layer 3, which is a precursor of a first insulation layer 13 of the wiring circuit board 11 and is placed over the metal layer 2, and a development process for exposing and developing the photosensitive resin layer 3.SELECTED DRAWING: Figure 3
【課題】配線回路基板を効率よく製造できる配線回路基板の製造方法を提供する。【解決手段】サブトラクティブ法による配線回路基板１１の製造方法において、配線回路基板１１の金属支持基板１２を形成するための金属層２と、配線回路基板１１の第１絶縁層１３の前駆体であり、金属層２の上に配置される感光性樹脂層３とを備える金属張積層板１を準備する準備工程と、感光性樹脂層３を露光および現像する現像工程とを実行する。【選択図】図３ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2023129114A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2023129114A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2023129114A3</originalsourceid><addsrcrecordid>eNrjZND1dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCPcEU86eQc6hniEKTv6OQS48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMjY0MjS0NDE0ZgoRQAKfyXh</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD</title><source>esp@cenet</source><creator>OSUMI YUKI ; NISHINO KOTA</creator><creatorcontrib>OSUMI YUKI ; NISHINO KOTA</creatorcontrib><description>To provide a method for manufacturing wiring circuit boards that enables efficient manufacturing of wiring circuit boards.SOLUTION: In a method for manufacturing a wiring circuit board 11 by the subtractive method, a preparation process is performed to prepare a metal clad laminate 1 with a metal layer 2 for forming a metal support substrate 12 of the wiring circuit board 11 and a photosensitive resin layer 3, which is a precursor of a first insulation layer 13 of the wiring circuit board 11 and is placed over the metal layer 2, and a development process for exposing and developing the photosensitive resin layer 3.SELECTED DRAWING: Figure 3
【課題】配線回路基板を効率よく製造できる配線回路基板の製造方法を提供する。【解決手段】サブトラクティブ法による配線回路基板１１の製造方法において、配線回路基板１１の金属支持基板１２を形成するための金属層２と、配線回路基板１１の第１絶縁層１３の前駆体であり、金属層２の上に配置される感光性樹脂層３とを備える金属張積層板１を準備する準備工程と、感光性樹脂層３を露光および現像する現像工程とを実行する。【選択図】図３</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230914&DB=EPODOC&CC=JP&NR=2023129114A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230914&DB=EPODOC&CC=JP&NR=2023129114A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OSUMI YUKI</creatorcontrib><creatorcontrib>NISHINO KOTA</creatorcontrib><title>METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD</title><description>To provide a method for manufacturing wiring circuit boards that enables efficient manufacturing of wiring circuit boards.SOLUTION: In a method for manufacturing a wiring circuit board 11 by the subtractive method, a preparation process is performed to prepare a metal clad laminate 1 with a metal layer 2 for forming a metal support substrate 12 of the wiring circuit board 11 and a photosensitive resin layer 3, which is a precursor of a first insulation layer 13 of the wiring circuit board 11 and is placed over the metal layer 2, and a development process for exposing and developing the photosensitive resin layer 3.SELECTED DRAWING: Figure 3
【課題】配線回路基板を効率よく製造できる配線回路基板の製造方法を提供する。【解決手段】サブトラクティブ法による配線回路基板１１の製造方法において、配線回路基板１１の金属支持基板１２を形成するための金属層２と、配線回路基板１１の第１絶縁層１３の前駆体であり、金属層２の上に配置される感光性樹脂層３とを備える金属張積層板１を準備する準備工程と、感光性樹脂層３を露光および現像する現像工程とを実行する。【選択図】図３</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1dQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCPcEU86eQc6hniEKTv6OQS48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMjY0MjS0NDE0ZgoRQAKfyXh</recordid><startdate>20230914</startdate><enddate>20230914</enddate><creator>OSUMI YUKI</creator><creator>NISHINO KOTA</creator><scope>EVB</scope></search><sort><creationdate>20230914</creationdate><title>METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD</title><author>OSUMI YUKI ; NISHINO KOTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023129114A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>OSUMI YUKI</creatorcontrib><creatorcontrib>NISHINO KOTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OSUMI YUKI</au><au>NISHINO KOTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD</title><date>2023-09-14</date><risdate>2023</risdate><abstract>To provide a method for manufacturing wiring circuit boards that enables efficient manufacturing of wiring circuit boards.SOLUTION: In a method for manufacturing a wiring circuit board 11 by the subtractive method, a preparation process is performed to prepare a metal clad laminate 1 with a metal layer 2 for forming a metal support substrate 12 of the wiring circuit board 11 and a photosensitive resin layer 3, which is a precursor of a first insulation layer 13 of the wiring circuit board 11 and is placed over the metal layer 2, and a development process for exposing and developing the photosensitive resin layer 3.SELECTED DRAWING: Figure 3
【課題】配線回路基板を効率よく製造できる配線回路基板の製造方法を提供する。【解決手段】サブトラクティブ法による配線回路基板１１の製造方法において、配線回路基板１１の金属支持基板１２を形成するための金属層２と、配線回路基板１１の第１絶縁層１３の前駆体であり、金属層２の上に配置される感光性樹脂層３とを備える金属張積層板１を準備する準備工程と、感光性樹脂層３を露光および現像する現像工程とを実行する。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD |
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