HEATING OBSERVATION DEVICE OF ELECTRONIC COMPONENT AND THE LIKE
To provide a heating observation device of an electronic component and the like which controls radiation heat such that a temperature of a heated electronic component falls within a range of a temperature profile management reference without attaching a temperature sensor to the electronic component...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HANEDA MAKOTO NAKAYA SUSUMU |
| description | To provide a heating observation device of an electronic component and the like which controls radiation heat such that a temperature of a heated electronic component falls within a range of a temperature profile management reference without attaching a temperature sensor to the electronic component.SOLUTION: Heating observation of an observation sample BW in such a state that a thermocouple is not attached thereto can be realized since power amounts of a lower heater 4a and an upper heater 4b are controlled on the basis of the dummy temperature of a dummy heating member heated simultaneously with the observation sample BW.SELECTED DRAWING: Figure 1
【課題】電子部品に温度センサを取り付けることなく、加熱されている電子部品の温度が温度プロファイル管理基準の範囲内に入るように放射熱を制御する、電子部品等の加熱観察装置の提供。【解決手段】観察試料ＢＷと同時に加熱されるダミー加熱部材のダミー温度にもとづいて、下部ヒーター４ａと上部ヒーター４ｂの電力量を制御するので、熱電対を取付けない状態の観察試料ＢＷの加熱観察を実現する。【選択図】図１ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2023128119A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2023128119A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2023128119A3</originalsourceid><addsrcrecordid>eNrjZLD3cHUM8fRzV_B3CnYNCgOy_f0UXFzDPJ1dFfzdFFx9XJ1Dgvz9PJ0VnP19A_z9XP1CFBz9XBRCPFwVfDy9XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkbGhkYWhoaWjMVGKAMI-Kpk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEATING OBSERVATION DEVICE OF ELECTRONIC COMPONENT AND THE LIKE</title><source>esp@cenet</source><creator>HANEDA MAKOTO ; NAKAYA SUSUMU</creator><creatorcontrib>HANEDA MAKOTO ; NAKAYA SUSUMU</creatorcontrib><description>To provide a heating observation device of an electronic component and the like which controls radiation heat such that a temperature of a heated electronic component falls within a range of a temperature profile management reference without attaching a temperature sensor to the electronic component.SOLUTION: Heating observation of an observation sample BW in such a state that a thermocouple is not attached thereto can be realized since power amounts of a lower heater 4a and an upper heater 4b are controlled on the basis of the dummy temperature of a dummy heating member heated simultaneously with the observation sample BW.SELECTED DRAWING: Figure 1
【課題】電子部品に温度センサを取り付けることなく、加熱されている電子部品の温度が温度プロファイル管理基準の範囲内に入るように放射熱を制御する、電子部品等の加熱観察装置の提供。【解決手段】観察試料ＢＷと同時に加熱されるダミー加熱部材のダミー温度にもとづいて、下部ヒーター４ａと上部ヒーター４ｂの電力量を制御するので、熱電対を取付けない状態の観察試料ＢＷの加熱観察を実現する。【選択図】図１</description><language>eng ; jpn</language><subject>ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230914&DB=EPODOC&CC=JP&NR=2023128119A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230914&DB=EPODOC&CC=JP&NR=2023128119A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANEDA MAKOTO</creatorcontrib><creatorcontrib>NAKAYA SUSUMU</creatorcontrib><title>HEATING OBSERVATION DEVICE OF ELECTRONIC COMPONENT AND THE LIKE</title><description>To provide a heating observation device of an electronic component and the like which controls radiation heat such that a temperature of a heated electronic component falls within a range of a temperature profile management reference without attaching a temperature sensor to the electronic component.SOLUTION: Heating observation of an observation sample BW in such a state that a thermocouple is not attached thereto can be realized since power amounts of a lower heater 4a and an upper heater 4b are controlled on the basis of the dummy temperature of a dummy heating member heated simultaneously with the observation sample BW.SELECTED DRAWING: Figure 1
【課題】電子部品に温度センサを取り付けることなく、加熱されている電子部品の温度が温度プロファイル管理基準の範囲内に入るように放射熱を制御する、電子部品等の加熱観察装置の提供。【解決手段】観察試料ＢＷと同時に加熱されるダミー加熱部材のダミー温度にもとづいて、下部ヒーター４ａと上部ヒーター４ｂの電力量を制御するので、熱電対を取付けない状態の観察試料ＢＷの加熱観察を実現する。【選択図】図１</description><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3cHUM8fRzV_B3CnYNCgOy_f0UXFzDPJ1dFfzdFFx9XJ1Dgvz9PJ0VnP19A_z9XP1CFBz9XBRCPFwVfDy9XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkbGhkYWhoaWjMVGKAMI-Kpk</recordid><startdate>20230914</startdate><enddate>20230914</enddate><creator>HANEDA MAKOTO</creator><creator>NAKAYA SUSUMU</creator><scope>EVB</scope></search><sort><creationdate>20230914</creationdate><title>HEATING OBSERVATION DEVICE OF ELECTRONIC COMPONENT AND THE LIKE</title><author>HANEDA MAKOTO ; NAKAYA SUSUMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023128119A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HANEDA MAKOTO</creatorcontrib><creatorcontrib>NAKAYA SUSUMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANEDA MAKOTO</au><au>NAKAYA SUSUMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEATING OBSERVATION DEVICE OF ELECTRONIC COMPONENT AND THE LIKE</title><date>2023-09-14</date><risdate>2023</risdate><abstract>To provide a heating observation device of an electronic component and the like which controls radiation heat such that a temperature of a heated electronic component falls within a range of a temperature profile management reference without attaching a temperature sensor to the electronic component.SOLUTION: Heating observation of an observation sample BW in such a state that a thermocouple is not attached thereto can be realized since power amounts of a lower heater 4a and an upper heater 4b are controlled on the basis of the dummy temperature of a dummy heating member heated simultaneously with the observation sample BW.SELECTED DRAWING: Figure 1
【課題】電子部品に温度センサを取り付けることなく、加熱されている電子部品の温度が温度プロファイル管理基準の範囲内に入るように放射熱を制御する、電子部品等の加熱観察装置の提供。【解決手段】観察試料ＢＷと同時に加熱されるダミー加熱部材のダミー温度にもとづいて、下部ヒーター４ａと上部ヒーター４ｂの電力量を制御するので、熱電対を取付けない状態の観察試料ＢＷの加熱観察を実現する。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2023128119A |
| source | esp@cenet |
| subjects | ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING |
| title | HEATING OBSERVATION DEVICE OF ELECTRONIC COMPONENT AND THE LIKE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T06%3A44%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HANEDA%20MAKOTO&rft.date=2023-09-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2023128119A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |