METHOD FOR MANUFACTURING CONDUCTIVE FILM LAMINATE AND CONDUCTIVE FILM LAMINATE
To provide a method for manufacturing a conductive film laminate having stable film quality and a conductive film laminate.SOLUTION: There is provided a method for manufacturing a conductive film laminate 1 comprising a base material to be laminated 10, an adhesive layer 20 formed on the surface of...
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| creator | KO SHINJI KUROMATSU SHO ENDO KAZUYUKI WATANABE TSUYOSHI |
| description | To provide a method for manufacturing a conductive film laminate having stable film quality and a conductive film laminate.SOLUTION: There is provided a method for manufacturing a conductive film laminate 1 comprising a base material to be laminated 10, an adhesive layer 20 formed on the surface of the base material to be laminated 10 and a carbon conductive film 30 formed on the surface of the adhesive layer 20, which comprises: a first laminate preparation step of preparing a first laminate 110 comprising a substrate 40 for forming a carbon conductive film 30 on the surface, a carbon conductive film 30 formed on the surface of the substrate 40 and an adhesive layer 20 formed on the surface of the carbon conductive film 30; a heat pressing step of bringing the adhesive layer 20 of the first laminate 110 and the base material to be laminated 10 into contact with each other, followed by heating and pressing to prepare a second laminate 120; and an etching step of etching a substrate 40 for forming the second laminate 120 to prepare a conductive film laminate 1.SELECTED DRAWING: Figure 9
【課題】安定した膜質の導電膜積層体の製造方法及び導電膜積層体を提供する。【解決手段】導電膜積層体１の製造方法は、被積層基材１０と被積層基材１０の表面に形成された粘着層２０と粘着層２０の表面に形成された炭素導電膜３０とを備える導電膜積層体１の製造方法であって、表面に炭素導電膜３０を形成するための形成用基板４０と、形成用基板４０の表面に形成された炭素導電膜３０と、炭素導電膜３０の表面に形成された粘着層２０と、を備える第１の積層体１１０を作製する第１の積層体作製工程と、第１の積層体１１０の粘着層２０と、被積層基材１０とを接触させた後、加熱圧着を行って第２の積層体１２０を作製する熱圧着工程と、第２の積層体１２０の形成用基板４０をエッチングして、導電膜積層体１を作製するエッチング工程とを備える。【選択図】図９ |
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【課題】安定した膜質の導電膜積層体の製造方法及び導電膜積層体を提供する。【解決手段】導電膜積層体１の製造方法は、被積層基材１０と被積層基材１０の表面に形成された粘着層２０と粘着層２０の表面に形成された炭素導電膜３０とを備える導電膜積層体１の製造方法であって、表面に炭素導電膜３０を形成するための形成用基板４０と、形成用基板４０の表面に形成された炭素導電膜３０と、炭素導電膜３０の表面に形成された粘着層２０と、を備える第１の積層体１１０を作製する第１の積層体作製工程と、第１の積層体１１０の粘着層２０と、被積層基材１０とを接触させた後、加熱圧着を行って第２の積層体１２０を作製する熱圧着工程と、第２の積層体１２０の形成用基板４０をエッチングして、導電膜積層体１を作製するエッチング工程とを備える。【選択図】図９</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230905&DB=EPODOC&CC=JP&NR=2023123049A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230905&DB=EPODOC&CC=JP&NR=2023123049A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO SHINJI</creatorcontrib><creatorcontrib>KUROMATSU SHO</creatorcontrib><creatorcontrib>ENDO KAZUYUKI</creatorcontrib><creatorcontrib>WATANABE TSUYOSHI</creatorcontrib><title>METHOD FOR MANUFACTURING CONDUCTIVE FILM LAMINATE AND CONDUCTIVE FILM LAMINATE</title><description>To provide a method for manufacturing a conductive film laminate having stable film quality and a conductive film laminate.SOLUTION: There is provided a method for manufacturing a conductive film laminate 1 comprising a base material to be laminated 10, an adhesive layer 20 formed on the surface of the base material to be laminated 10 and a carbon conductive film 30 formed on the surface of the adhesive layer 20, which comprises: a first laminate preparation step of preparing a first laminate 110 comprising a substrate 40 for forming a carbon conductive film 30 on the surface, a carbon conductive film 30 formed on the surface of the substrate 40 and an adhesive layer 20 formed on the surface of the carbon conductive film 30; a heat pressing step of bringing the adhesive layer 20 of the first laminate 110 and the base material to be laminated 10 into contact with each other, followed by heating and pressing to prepare a second laminate 120; and an etching step of etching a substrate 40 for forming the second laminate 120 to prepare a conductive film laminate 1.SELECTED DRAWING: Figure 9
【課題】安定した膜質の導電膜積層体の製造方法及び導電膜積層体を提供する。【解決手段】導電膜積層体１の製造方法は、被積層基材１０と被積層基材１０の表面に形成された粘着層２０と粘着層２０の表面に形成された炭素導電膜３０とを備える導電膜積層体１の製造方法であって、表面に炭素導電膜３０を形成するための形成用基板４０と、形成用基板４０の表面に形成された炭素導電膜３０と、炭素導電膜３０の表面に形成された粘着層２０と、を備える第１の積層体１１０を作製する第１の積層体作製工程と、第１の積層体１１０の粘着層２０と、被積層基材１０とを接触させた後、加熱圧着を行って第２の積層体１２０を作製する熱圧着工程と、第２の積層体１２０の形成用基板４０をエッチングして、導電膜積層体１を作製するエッチング工程とを備える。【選択図】図９</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDzdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPb3cwl1DvEMc1Vw8_TxVfBx9PX0cwxxVXD0c8EpycPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4r0CjAyMjA2NjA1MLB2NiVIEAG_WLto</recordid><startdate>20230905</startdate><enddate>20230905</enddate><creator>KO SHINJI</creator><creator>KUROMATSU SHO</creator><creator>ENDO KAZUYUKI</creator><creator>WATANABE TSUYOSHI</creator><scope>EVB</scope></search><sort><creationdate>20230905</creationdate><title>METHOD FOR MANUFACTURING CONDUCTIVE FILM LAMINATE AND CONDUCTIVE FILM LAMINATE</title><author>KO SHINJI ; KUROMATSU SHO ; ENDO KAZUYUKI ; WATANABE TSUYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023123049A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KO SHINJI</creatorcontrib><creatorcontrib>KUROMATSU SHO</creatorcontrib><creatorcontrib>ENDO KAZUYUKI</creatorcontrib><creatorcontrib>WATANABE TSUYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KO SHINJI</au><au>KUROMATSU SHO</au><au>ENDO KAZUYUKI</au><au>WATANABE TSUYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING CONDUCTIVE FILM LAMINATE AND CONDUCTIVE FILM LAMINATE</title><date>2023-09-05</date><risdate>2023</risdate><abstract>To provide a method for manufacturing a conductive film laminate having stable film quality and a conductive film laminate.SOLUTION: There is provided a method for manufacturing a conductive film laminate 1 comprising a base material to be laminated 10, an adhesive layer 20 formed on the surface of the base material to be laminated 10 and a carbon conductive film 30 formed on the surface of the adhesive layer 20, which comprises: a first laminate preparation step of preparing a first laminate 110 comprising a substrate 40 for forming a carbon conductive film 30 on the surface, a carbon conductive film 30 formed on the surface of the substrate 40 and an adhesive layer 20 formed on the surface of the carbon conductive film 30; a heat pressing step of bringing the adhesive layer 20 of the first laminate 110 and the base material to be laminated 10 into contact with each other, followed by heating and pressing to prepare a second laminate 120; and an etching step of etching a substrate 40 for forming the second laminate 120 to prepare a conductive film laminate 1.SELECTED DRAWING: Figure 9
【課題】安定した膜質の導電膜積層体の製造方法及び導電膜積層体を提供する。【解決手段】導電膜積層体１の製造方法は、被積層基材１０と被積層基材１０の表面に形成された粘着層２０と粘着層２０の表面に形成された炭素導電膜３０とを備える導電膜積層体１の製造方法であって、表面に炭素導電膜３０を形成するための形成用基板４０と、形成用基板４０の表面に形成された炭素導電膜３０と、炭素導電膜３０の表面に形成された粘着層２０と、を備える第１の積層体１１０を作製する第１の積層体作製工程と、第１の積層体１１０の粘着層２０と、被積層基材１０とを接触させた後、加熱圧着を行って第２の積層体１２０を作製する熱圧着工程と、第２の積層体１２０の形成用基板４０をエッチングして、導電膜積層体１を作製するエッチング工程とを備える。【選択図】図９</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | METHOD FOR MANUFACTURING CONDUCTIVE FILM LAMINATE AND CONDUCTIVE FILM LAMINATE |
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