SUBSTRATE PROCESSING APPARATUS AND POSITIONAL DIFFERENCE CORRECTION METHOD

To provide a technique for suppressing misalignment.SOLUTION: A mounting plate is positioned by a first positioning mechanism in the expansion and contraction direction in which a processing container expands and contracts due to expansion and contraction due to temperature changes with respect to a...

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Bibliographische Detailangaben
1. Verfasser:	KOBAYASHI TAMIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a technique for suppressing misalignment.SOLUTION: A mounting plate is positioned by a first positioning mechanism in the expansion and contraction direction in which a processing container expands and contracts due to expansion and contraction due to temperature changes with respect to a predetermined reference position that is used as a reference for measuring positional deviation within the processing container, and is attached to the processing container. A mounting table is positioned in the processing container by a second positioning mechanism at a position opposite to the position of the first positioning mechanism with respect to the reference position, and is placed in the processing container via a support mechanism attached to the mounting plate to mount a substrate.SELECTED DRAWING: Figure 3 【課題】位置ずれを抑制する技術を提供すること。【解決手段】取付プレートは、処理容器内の位置ずれを計測する基準となる所定の基準位置に対して、温度変化による膨張、収縮により処理容器が伸縮する伸縮方向に第１位置決め機構により位置決めして処理容器に取り付けられている。載置台は、基準位置に対して、第１位置決め機構の位置の反対側となる位置に第２位置決め機構により位置決めして取付プレートに取り付けられた支持機構を介して処理容器内に配置され、基板が載置される。【選択図】図３