NOVEL CROSSLINKER, CURABLE COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE AND CIRCUIT BOARD
To provide a crosslinker that is suitable for a curable composition and is capable of giving a (semi)cured product having a dielectric loss tangent (Df) effectively reduced under high frequency conditions, having a sufficiently low thermal expansion coefficient (CTE), and having a sufficiently high...
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| creator | USUDA TSUKASA HASHIMOTO KAZUMI MORISAWA YOSHITOMI |
| description | To provide a crosslinker that is suitable for a curable composition and is capable of giving a (semi)cured product having a dielectric loss tangent (Df) effectively reduced under high frequency conditions, having a sufficiently low thermal expansion coefficient (CTE), and having a sufficiently high glass transition temperature (Tg).SOLUTION: A crosslinker is represented by the formula (X) (where A is a Group 14 element selected from the group consisting of Ge, Sn, and Pb, L is a single bond, an aromatic ring, a C1-20 alkylene group, or a combination of a C1-20 alkylene group and an aromatic ring. n is an integer of 2-4. R is a hydrogen atom, a hydroxy group, or an organic group, and if R is an organic group, the atom bound to A is C).SELECTED DRAWING: Figure 1
【課題】硬化性組成物に用いて好適で、高周波条件における誘電正接（Ｄｆ）が効果的に低減され、熱膨張係数（ＣＴＥ）が充分に低く、ガラス転移温度（Ｔｇ）が充分に高い（半）硬化物を得ることが可能な架橋剤。【解決手段】下式（Ｘ）で表される架橋剤。TIFF2023105332000015.tif56127（上式中、Ａは、Ｇｅ、ＳｎおよびＰｂからなる群より選ばれる１４族元素、Ｌは単結合、芳香環、炭素数１～２０のアルキレン基、または、炭素数１～２０のアルキレン基と芳香環との組合せ。ｎは２～４の整数。Ｒは水素原子、水酸基または有機基であり、Ｒが有機基であるとき、Ａと結合した原子はＣ。）【選択図】図１ |
| format | Patent |
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【課題】硬化性組成物に用いて好適で、高周波条件における誘電正接（Ｄｆ）が効果的に低減され、熱膨張係数（ＣＴＥ）が充分に低く、ガラス転移温度（Ｔｇ）が充分に高い（半）硬化物を得ることが可能な架橋剤。【解決手段】下式（Ｘ）で表される架橋剤。TIFF2023105332000015.tif56127（上式中、Ａは、Ｇｅ、ＳｎおよびＰｂからなる群より選ばれる１４族元素、Ｌは単結合、芳香環、炭素数１～２０のアルキレン基、または、炭素数１～２０のアルキレン基と芳香環との組合せ。ｎは２～４の整数。Ｒは水素原子、水酸基または有機基であり、Ｒが有機基であるとき、Ａと結合した原子はＣ。）【選択図】図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230731&DB=EPODOC&CC=JP&NR=2023105332A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76304</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230731&DB=EPODOC&CC=JP&NR=2023105332A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USUDA TSUKASA</creatorcontrib><creatorcontrib>HASHIMOTO KAZUMI</creatorcontrib><creatorcontrib>MORISAWA YOSHITOMI</creatorcontrib><title>NOVEL CROSSLINKER, CURABLE COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE AND CIRCUIT BOARD</title><description>To provide a crosslinker that is suitable for a curable composition and is capable of giving a (semi)cured product having a dielectric loss tangent (Df) effectively reduced under high frequency conditions, having a sufficiently low thermal expansion coefficient (CTE), and having a sufficiently high glass transition temperature (Tg).SOLUTION: A crosslinker is represented by the formula (X) (where A is a Group 14 element selected from the group consisting of Ge, Sn, and Pb, L is a single bond, an aromatic ring, a C1-20 alkylene group, or a combination of a C1-20 alkylene group and an aromatic ring. n is an integer of 2-4. R is a hydrogen atom, a hydroxy group, or an organic group, and if R is an organic group, the atom bound to A is C).SELECTED DRAWING: Figure 1
【課題】硬化性組成物に用いて好適で、高周波条件における誘電正接（Ｄｆ）が効果的に低減され、熱膨張係数（ＣＴＥ）が充分に低く、ガラス転移温度（Ｔｇ）が充分に高い（半）硬化物を得ることが可能な架橋剤。【解決手段】下式（Ｘ）で表される架橋剤。TIFF2023105332000015.tif56127（上式中、Ａは、Ｇｅ、ＳｎおよびＰｂからなる群より選ばれる１４族元素、Ｌは単結合、芳香環、炭素数１～２０のアルキレン基、または、炭素数１～２０のアルキレン基と芳香環との組合せ。ｎは２～４の整数。Ｒは水素原子、水酸基または有機基であり、Ｒが有機基であるとき、Ａと結合した原子はＣ。）【選択図】図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHvxIOofFs8p1AQfsN2sGk2TkqRea5F4Ei3U_6MH8SwMDAwzLy7On9kCBR-jNe7EQQB1AWvLQL5pfTTJeCegDfxhL8BiYxwmFtBwQluSRf2LgE4DmUCdSVB7DHpZzG7DfcqrrxfFeseJDmUen32exuGaH_nVH1tZSbWptkpJVH9Nb8EPM2c</recordid><startdate>20230731</startdate><enddate>20230731</enddate><creator>USUDA TSUKASA</creator><creator>HASHIMOTO KAZUMI</creator><creator>MORISAWA YOSHITOMI</creator><scope>EVB</scope></search><sort><creationdate>20230731</creationdate><title>NOVEL CROSSLINKER, CURABLE COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE AND CIRCUIT BOARD</title><author>USUDA TSUKASA ; HASHIMOTO KAZUMI ; MORISAWA YOSHITOMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023105332A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>USUDA TSUKASA</creatorcontrib><creatorcontrib>HASHIMOTO KAZUMI</creatorcontrib><creatorcontrib>MORISAWA YOSHITOMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USUDA TSUKASA</au><au>HASHIMOTO KAZUMI</au><au>MORISAWA YOSHITOMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>NOVEL CROSSLINKER, CURABLE COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE AND CIRCUIT BOARD</title><date>2023-07-31</date><risdate>2023</risdate><abstract>To provide a crosslinker that is suitable for a curable composition and is capable of giving a (semi)cured product having a dielectric loss tangent (Df) effectively reduced under high frequency conditions, having a sufficiently low thermal expansion coefficient (CTE), and having a sufficiently high glass transition temperature (Tg).SOLUTION: A crosslinker is represented by the formula (X) (where A is a Group 14 element selected from the group consisting of Ge, Sn, and Pb, L is a single bond, an aromatic ring, a C1-20 alkylene group, or a combination of a C1-20 alkylene group and an aromatic ring. n is an integer of 2-4. R is a hydrogen atom, a hydroxy group, or an organic group, and if R is an organic group, the atom bound to A is C).SELECTED DRAWING: Figure 1
【課題】硬化性組成物に用いて好適で、高周波条件における誘電正接（Ｄｆ）が効果的に低減され、熱膨張係数（ＣＴＥ）が充分に低く、ガラス転移温度（Ｔｇ）が充分に高い（半）硬化物を得ることが可能な架橋剤。【解決手段】下式（Ｘ）で表される架橋剤。TIFF2023105332000015.tif56127（上式中、Ａは、Ｇｅ、ＳｎおよびＰｂからなる群より選ばれる１４族元素、Ｌは単結合、芳香環、炭素数１～２０のアルキレン基、または、炭素数１～２０のアルキレン基と芳香環との組合せ。ｎは２～４の整数。Ｒは水素原子、水酸基または有機基であり、Ｒが有機基であるとき、Ａと結合した原子はＣ。）【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | NOVEL CROSSLINKER, CURABLE COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE AND CIRCUIT BOARD |
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