CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4...
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| creator | SHIMAMURA MITSUYOSHI SHIRAKAWA TETSUYUKI MATSUDA KAZUYA KAWABATA YASUNORI TATEZAWA TAKASHI TSUCHIDA YUTAKA SEKI TAKASHI SHINOHARA KENGO MATSUMOTO SATORU |
| description | To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4 and a plurality of conductive adhesive film pieces 5 provided on the peeling film 4. The plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the peeling film 4 and spaced apart in the longitudinal direction X of the peeling film 4. The adhesive film pieces 5 contain conductive particles, and the adhesive film piece 5 has a hole 5a.SELECTED DRAWING: Figure 2
【課題】多様な形状の接着面に対して接着剤フィルムを貼り付けることができるともに、接着剤フィルムを有効に利用できる導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法を提供する。【解決手段】導電性フィルム２は、長尺の剥離フィルム４と、剥離フィルム４上に設けられた導電性を有する複数の接着剤フィルム片５と、を備える。そして、複数の接着剤フィルム片５は、剥離フィルム４の長手方向Ｘに配列されて剥離フィルム４の長手方向Ｘに離間しており、接着剤フィルム片５は、導電粒子を含み、接着剤フィルム片５は、穴５ａを有する。【選択図】図２ |
| format | Patent |
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【課題】多様な形状の接着面に対して接着剤フィルムを貼り付けることができるともに、接着剤フィルムを有効に利用できる導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法を提供する。【解決手段】導電性フィルム２は、長尺の剥離フィルム４と、剥離フィルム４上に設けられた導電性を有する複数の接着剤フィルム片５と、を備える。そして、複数の接着剤フィルム片５は、剥離フィルム４の長手方向Ｘに配列されて剥離フィルム４の長手方向Ｘに離間しており、接着剤フィルム片５は、導電粒子を含み、接着剤フィルム片５は、穴５ａを有する。【選択図】図２</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; CURRENT COLLECTORS ; DYES ; ELECTRICITY ; INSULATORS ; LINE CONNECTORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230720&DB=EPODOC&CC=JP&NR=2023101416A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230720&DB=EPODOC&CC=JP&NR=2023101416A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMAMURA MITSUYOSHI</creatorcontrib><creatorcontrib>SHIRAKAWA TETSUYUKI</creatorcontrib><creatorcontrib>MATSUDA KAZUYA</creatorcontrib><creatorcontrib>KAWABATA YASUNORI</creatorcontrib><creatorcontrib>TATEZAWA TAKASHI</creatorcontrib><creatorcontrib>TSUCHIDA YUTAKA</creatorcontrib><creatorcontrib>SEKI TAKASHI</creatorcontrib><creatorcontrib>SHINOHARA KENGO</creatorcontrib><creatorcontrib>MATSUMOTO SATORU</creatorcontrib><title>CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE</title><description>To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4 and a plurality of conductive adhesive film pieces 5 provided on the peeling film 4. The plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the peeling film 4 and spaced apart in the longitudinal direction X of the peeling film 4. The adhesive film pieces 5 contain conductive particles, and the adhesive film piece 5 has a hole 5a.SELECTED DRAWING: Figure 2
【課題】多様な形状の接着面に対して接着剤フィルムを貼り付けることができるともに、接着剤フィルムを有効に利用できる導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法を提供する。【解決手段】導電性フィルム２は、長尺の剥離フィルム４と、剥離フィルム４上に設けられた導電性を有する複数の接着剤フィルム片５と、を備える。そして、複数の接着剤フィルム片５は、剥離フィルム４の長手方向Ｘに配列されて剥離フィルム４の長手方向Ｘに離間しており、接着剤フィルム片５は、導電粒子を含み、接着剤フィルム片５は、穴５ａを有する。【選択図】図２</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEhx9vdzCXUO8QxzVXDz9PHVUQj3D_VzUXDyd4nUUQBK-rkCJf39FIJDgoDKQoNcdRQcgfK-riEe_i4Kbv5BCr6OfqFujiA5Tz93rFp4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgZGxoYGhiaGZozFRigDSGTUz</recordid><startdate>20230720</startdate><enddate>20230720</enddate><creator>SHIMAMURA MITSUYOSHI</creator><creator>SHIRAKAWA TETSUYUKI</creator><creator>MATSUDA KAZUYA</creator><creator>KAWABATA YASUNORI</creator><creator>TATEZAWA TAKASHI</creator><creator>TSUCHIDA YUTAKA</creator><creator>SEKI TAKASHI</creator><creator>SHINOHARA KENGO</creator><creator>MATSUMOTO SATORU</creator><scope>EVB</scope></search><sort><creationdate>20230720</creationdate><title>CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE</title><author>SHIMAMURA MITSUYOSHI ; SHIRAKAWA TETSUYUKI ; MATSUDA KAZUYA ; KAWABATA YASUNORI ; TATEZAWA TAKASHI ; TSUCHIDA YUTAKA ; SEKI TAKASHI ; SHINOHARA KENGO ; MATSUMOTO SATORU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023101416A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMAMURA MITSUYOSHI</creatorcontrib><creatorcontrib>SHIRAKAWA TETSUYUKI</creatorcontrib><creatorcontrib>MATSUDA KAZUYA</creatorcontrib><creatorcontrib>KAWABATA YASUNORI</creatorcontrib><creatorcontrib>TATEZAWA TAKASHI</creatorcontrib><creatorcontrib>TSUCHIDA YUTAKA</creatorcontrib><creatorcontrib>SEKI TAKASHI</creatorcontrib><creatorcontrib>SHINOHARA KENGO</creatorcontrib><creatorcontrib>MATSUMOTO SATORU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMAMURA MITSUYOSHI</au><au>SHIRAKAWA TETSUYUKI</au><au>MATSUDA KAZUYA</au><au>KAWABATA YASUNORI</au><au>TATEZAWA TAKASHI</au><au>TSUCHIDA YUTAKA</au><au>SEKI TAKASHI</au><au>SHINOHARA KENGO</au><au>MATSUMOTO SATORU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE</title><date>2023-07-20</date><risdate>2023</risdate><abstract>To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4 and a plurality of conductive adhesive film pieces 5 provided on the peeling film 4. The plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the peeling film 4 and spaced apart in the longitudinal direction X of the peeling film 4. The adhesive film pieces 5 contain conductive particles, and the adhesive film piece 5 has a hole 5a.SELECTED DRAWING: Figure 2
【課題】多様な形状の接着面に対して接着剤フィルムを貼り付けることができるともに、接着剤フィルムを有効に利用できる導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法を提供する。【解決手段】導電性フィルム２は、長尺の剥離フィルム４と、剥離フィルム４上に設けられた導電性を有する複数の接着剤フィルム片５と、を備える。そして、複数の接着剤フィルム片５は、剥離フィルム４の長手方向Ｘに配列されて剥離フィルム４の長手方向Ｘに離間しており、接着剤フィルム片５は、導電粒子を含み、接着剤フィルム片５は、穴５ａを有する。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE |
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