SPACE-SAVING PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE
To provide a substrate processing system that includes a vacuum transfer module (VTM) for a substrate processing tool.SOLUTION: A substrate processing tool 200-1 includes a first side that connects with at least one loading station 220, a transfer robot 232 arranged in a VTM 212, and a second side (...
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| creator | RICHARD BLANK RICHARD H GOULD |
| description | To provide a substrate processing system that includes a vacuum transfer module (VTM) for a substrate processing tool.SOLUTION: A substrate processing tool 200-1 includes a first side that connects with at least one loading station 220, a transfer robot 232 arranged in a VTM 212, and a second side (rear wall 224) opposite the first side. The transfer robot transfers substrates between at least one loading station and at least one loadlock 208 located between the improver front end module (EFEM) and the VTM. The second side is connected with the at least one loadlock. The transfer robot is positioned adjacent to the second side and the at least one load lock extends through the second side into the interior of the EFEM.SELECTED DRAWING: Figure 2A
【課題】基板処理ツールのための真空搬送モジュール（ＶＴＭ）を備える基板処理システムを提供する。【解決手段】基板処理ツール２００－１は、少なくとも１つのローディングステーション２２０と接続する第１の側と、ＶＴＭ２１２内に配置された搬送ロボット２３２と、第１の側に対向する第２の側（後壁２２４）と、を備える。搬送ロボットは、少なくとも１つのローディングステーションと、改良装置フロントエンドモジュール（ＥＦＥＭ）とＶＴＭとの間に配置された少なくとも１つのロードロック２０８との間で基板を搬送する。第２の側は、少なくとも１つのロードロックと接続する。搬送ロボットは、第２の側に隣接して配置され、少なくとも１つのロードロックは、第２の側を通ってＥＦＥＭの内部に延びる。【選択図】図２Ａ |
| format | Patent |
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【課題】基板処理ツールのための真空搬送モジュール（ＶＴＭ）を備える基板処理システムを提供する。【解決手段】基板処理ツール２００－１は、少なくとも１つのローディングステーション２２０と接続する第１の側と、ＶＴＭ２１２内に配置された搬送ロボット２３２と、第１の側に対向する第２の側（後壁２２４）と、を備える。搬送ロボットは、少なくとも１つのローディングステーションと、改良装置フロントエンドモジュール（ＥＦＥＭ）とＶＴＭとの間に配置された少なくとも１つのロードロック２０８との間で基板を搬送する。第２の側は、少なくとも１つのロードロックと接続する。搬送ロボットは、第２の側に隣接して配置され、少なくとも１つのロードロックは、第２の側を通ってＥＦＥＭの内部に延びる。【選択図】図２Ａ</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230711&DB=EPODOC&CC=JP&NR=2023099172A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230711&DB=EPODOC&CC=JP&NR=2023099172A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RICHARD BLANK</creatorcontrib><creatorcontrib>RICHARD H GOULD</creatorcontrib><title>SPACE-SAVING PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE</title><description>To provide a substrate processing system that includes a vacuum transfer module (VTM) for a substrate processing tool.SOLUTION: A substrate processing tool 200-1 includes a first side that connects with at least one loading station 220, a transfer robot 232 arranged in a VTM 212, and a second side (rear wall 224) opposite the first side. The transfer robot transfers substrates between at least one loading station and at least one loadlock 208 located between the improver front end module (EFEM) and the VTM. The second side is connected with the at least one loadlock. The transfer robot is positioned adjacent to the second side and the at least one load lock extends through the second side into the interior of the EFEM.SELECTED DRAWING: Figure 2A
【課題】基板処理ツールのための真空搬送モジュール（ＶＴＭ）を備える基板処理システムを提供する。【解決手段】基板処理ツール２００－１は、少なくとも１つのローディングステーション２２０と接続する第１の側と、ＶＴＭ２１２内に配置された搬送ロボット２３２と、第１の側に対向する第２の側（後壁２２４）と、を備える。搬送ロボットは、少なくとも１つのローディングステーションと、改良装置フロントエンドモジュール（ＥＦＥＭ）とＶＴＭとの間に配置された少なくとも１つのロードロック２０８との間で基板を搬送する。第２の側は、少なくとも１つのロードロックと接続する。搬送ロボットは、第２の側に隣接して配置され、少なくとも１つのロードロックは、第２の側を通ってＥＦＥＭの内部に延びる。【選択図】図２Ａ</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHANDnB0dtUNdgzz9HNXCPBxDHHzD_JVcAxy9vAMcXUOCQ1yVQj3DPFQ8PH0c3UMUghzdA4N9VUICXL0C3ZzDVLw9XcJ9XHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkbGBpaWhuZGjsZEKQIA-k0swg</recordid><startdate>20230711</startdate><enddate>20230711</enddate><creator>RICHARD BLANK</creator><creator>RICHARD H GOULD</creator><scope>EVB</scope></search><sort><creationdate>20230711</creationdate><title>SPACE-SAVING PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE</title><author>RICHARD BLANK ; RICHARD H GOULD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023099172A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>RICHARD BLANK</creatorcontrib><creatorcontrib>RICHARD H GOULD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RICHARD BLANK</au><au>RICHARD H GOULD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SPACE-SAVING PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE</title><date>2023-07-11</date><risdate>2023</risdate><abstract>To provide a substrate processing system that includes a vacuum transfer module (VTM) for a substrate processing tool.SOLUTION: A substrate processing tool 200-1 includes a first side that connects with at least one loading station 220, a transfer robot 232 arranged in a VTM 212, and a second side (rear wall 224) opposite the first side. The transfer robot transfers substrates between at least one loading station and at least one loadlock 208 located between the improver front end module (EFEM) and the VTM. The second side is connected with the at least one loadlock. The transfer robot is positioned adjacent to the second side and the at least one load lock extends through the second side into the interior of the EFEM.SELECTED DRAWING: Figure 2A
【課題】基板処理ツールのための真空搬送モジュール（ＶＴＭ）を備える基板処理システムを提供する。【解決手段】基板処理ツール２００－１は、少なくとも１つのローディングステーション２２０と接続する第１の側と、ＶＴＭ２１２内に配置された搬送ロボット２３２と、第１の側に対向する第２の側（後壁２２４）と、を備える。搬送ロボットは、少なくとも１つのローディングステーションと、改良装置フロントエンドモジュール（ＥＦＥＭ）とＶＴＭとの間に配置された少なくとも１つのロードロック２０８との間で基板を搬送する。第２の側は、少なくとも１つのロードロックと接続する。搬送ロボットは、第２の側に隣接して配置され、少なくとも１つのロードロックは、第２の側を通ってＥＦＥＭの内部に延びる。【選択図】図２Ａ</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SPACE-SAVING PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE |
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