RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT
To provide a resin molding device and a method for manufacturing a resin molded product, which can prevent molding failure of a resin material and damage to a mold.SOLUTION: A resin molding device according to the present invention includes a conveying path along which a resin molding object is conv...
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| creator | KANAYAMA YUTO KAWAHARA KENTARO |
| description | To provide a resin molding device and a method for manufacturing a resin molded product, which can prevent molding failure of a resin material and damage to a mold.SOLUTION: A resin molding device according to the present invention includes a conveying path along which a resin molding object is conveyed, and an inspection unit that inspects the resin molding object at least a part of which is arranged on the conveying path prior to molding with a resin material, and the inspection unit includes at least two cameras arranged above the conveying path and spaced apart in a direction orthogonal to the conveying direction of the resin molding object, and is configured to use the respective cameras to capture images of different inspection points of the resin molding object on the conveying path.SELECTED DRAWING: Figure 3
【課題】樹脂材料の成形不良や金型の破損を防止することができる、樹脂成形装置及び樹脂成形品の製造方法を提供する。【解決手段】本発明に係る樹脂成形装置は、樹脂成形対象物が搬送される搬送路と、樹脂材料による成形に先立って、前記搬送路に少なくとも一部が配置された樹脂成形対象物を検査する検査部と、を備え、前記検査部は、前記搬送路の上方に配置され、前記樹脂成形対象物の搬送方向と直交する方向に間隔をおいて配置された、少なくとも２つのカメラを備え、前記各カメラにより、前記搬送路上にある前記樹脂成形対象物の異なる検査箇所をそれぞれ撮像するように構成されている。【選択図】図３ |
| format | Patent |
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【課題】樹脂材料の成形不良や金型の破損を防止することができる、樹脂成形装置及び樹脂成形品の製造方法を提供する。【解決手段】本発明に係る樹脂成形装置は、樹脂成形対象物が搬送される搬送路と、樹脂材料による成形に先立って、前記搬送路に少なくとも一部が配置された樹脂成形対象物を検査する検査部と、を備え、前記検査部は、前記搬送路の上方に配置され、前記樹脂成形対象物の搬送方向と直交する方向に間隔をおいて配置された、少なくとも２つのカメラを備え、前記各カメラにより、前記搬送路上にある前記樹脂成形対象物の異なる検査箇所をそれぞれ撮像するように構成されている。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230628&DB=EPODOC&CC=JP&NR=2023089883A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230628&DB=EPODOC&CC=JP&NR=2023089883A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANAYAMA YUTO</creatorcontrib><creatorcontrib>KAWAHARA KENTARO</creatorcontrib><title>RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT</title><description>To provide a resin molding device and a method for manufacturing a resin molded product, which can prevent molding failure of a resin material and damage to a mold.SOLUTION: A resin molding device according to the present invention includes a conveying path along which a resin molding object is conveyed, and an inspection unit that inspects the resin molding object at least a part of which is arranged on the conveying path prior to molding with a resin material, and the inspection unit includes at least two cameras arranged above the conveying path and spaced apart in a direction orthogonal to the conveying direction of the resin molding object, and is configured to use the respective cameras to capture images of different inspection points of the resin molding object on the conveying path.SELECTED DRAWING: Figure 3
【課題】樹脂材料の成形不良や金型の破損を防止することができる、樹脂成形装置及び樹脂成形品の製造方法を提供する。【解決手段】本発明に係る樹脂成形装置は、樹脂成形対象物が搬送される搬送路と、樹脂材料による成形に先立って、前記搬送路に少なくとも一部が配置された樹脂成形対象物を検査する検査部と、を備え、前記検査部は、前記搬送路の上方に配置され、前記樹脂成形対象物の搬送方向と直交する方向に間隔をおいて配置された、少なくとも２つのカメラを備え、前記各カメラにより、前記搬送路上にある前記樹脂成形対象物の異なる検査箇所をそれぞれ撮像するように構成されている。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALcg329FPw9fdx8fRzV3BxDfN0dlVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkNAqlB6HB1UQgI8ncJdQ7hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkbGBhaWFhbGjsZEKQIA9FYsuA</recordid><startdate>20230628</startdate><enddate>20230628</enddate><creator>KANAYAMA YUTO</creator><creator>KAWAHARA KENTARO</creator><scope>EVB</scope></search><sort><creationdate>20230628</creationdate><title>RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT</title><author>KANAYAMA YUTO ; KAWAHARA KENTARO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023089883A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KANAYAMA YUTO</creatorcontrib><creatorcontrib>KAWAHARA KENTARO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANAYAMA YUTO</au><au>KAWAHARA KENTARO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT</title><date>2023-06-28</date><risdate>2023</risdate><abstract>To provide a resin molding device and a method for manufacturing a resin molded product, which can prevent molding failure of a resin material and damage to a mold.SOLUTION: A resin molding device according to the present invention includes a conveying path along which a resin molding object is conveyed, and an inspection unit that inspects the resin molding object at least a part of which is arranged on the conveying path prior to molding with a resin material, and the inspection unit includes at least two cameras arranged above the conveying path and spaced apart in a direction orthogonal to the conveying direction of the resin molding object, and is configured to use the respective cameras to capture images of different inspection points of the resin molding object on the conveying path.SELECTED DRAWING: Figure 3
【課題】樹脂材料の成形不良や金型の破損を防止することができる、樹脂成形装置及び樹脂成形品の製造方法を提供する。【解決手段】本発明に係る樹脂成形装置は、樹脂成形対象物が搬送される搬送路と、樹脂材料による成形に先立って、前記搬送路に少なくとも一部が配置された樹脂成形対象物を検査する検査部と、を備え、前記検査部は、前記搬送路の上方に配置され、前記樹脂成形対象物の搬送方向と直交する方向に間隔をおいて配置された、少なくとも２つのカメラを備え、前記各カメラにより、前記搬送路上にある前記樹脂成形対象物の異なる検査箇所をそれぞれ撮像するように構成されている。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT |
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