SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
To provide a substrate treatment apparatus and a substrate treatment method that can use a low melting material as a target.SOLUTION: A substrate treatment apparatus includes: a tray provided in a vacuum treatment vessel and having a recess for accommodating a target of a low melting material; a ref...
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| creator | HATANO TATSUO WATANABE NAOKI |
| description | To provide a substrate treatment apparatus and a substrate treatment method that can use a low melting material as a target.SOLUTION: A substrate treatment apparatus includes: a tray provided in a vacuum treatment vessel and having a recess for accommodating a target of a low melting material; a refrigerator for cooling the tray; a substrate holding unit for holding the substrate: an inversion drive unit for inverting the substrate holding unit upside down; and a rotation drive unit for rotating the substrate holding unit in a circumferential direction of the substrate.SELECTED DRAWING: Figure 1
【課題】低融点材料をターゲットとして用いることができる基板処理装置及び基板処理方法を提供する。【解決手段】真空処理容器内に設けられ、低融点材料のターゲットを収容する凹部を有するトレイと、前記トレイを冷却する冷凍機と、基板を保持する基板保持部と、前記基板保持部の上下を反転させる反転駆動部と、前記基板の周方向に前記基板保持部を回転させる回転駆動部と、を備える、基板処理装置。【選択図】図１ |
| format | Patent |
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【課題】低融点材料をターゲットとして用いることができる基板処理装置及び基板処理方法を提供する。【解決手段】真空処理容器内に設けられ、低融点材料のターゲットを収容する凹部を有するトレイと、前記トレイを冷却する冷凍機と、基板を保持する基板保持部と、前記基板保持部の上下を反転させる反転駆動部と、前記基板の周方向に前記基板保持部を回転させる回転駆動部と、を備える、基板処理装置。【選択図】図１</description><language>eng ; jpn</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230626&DB=EPODOC&CC=JP&NR=2023088160A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230626&DB=EPODOC&CC=JP&NR=2023088160A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HATANO TATSUO</creatorcontrib><creatorcontrib>WATANABE NAOKI</creatorcontrib><title>SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD</title><description>To provide a substrate treatment apparatus and a substrate treatment method that can use a low melting material as a target.SOLUTION: A substrate treatment apparatus includes: a tray provided in a vacuum treatment vessel and having a recess for accommodating a target of a low melting material; a refrigerator for cooling the tray; a substrate holding unit for holding the substrate: an inversion drive unit for inverting the substrate holding unit upside down; and a rotation drive unit for rotating the substrate holding unit in a circumferential direction of the substrate.SELECTED DRAWING: Figure 1
【課題】低融点材料をターゲットとして用いることができる基板処理装置及び基板処理方法を提供する。【解決手段】真空処理容器内に設けられ、低融点材料のターゲットを収容する凹部を有するトレイと、前記トレイを冷却する冷凍機と、基板を保持する基板保持部と、前記基板保持部の上下を反転させる反転駆動部と、前記基板の周方向に前記基板保持部を回転させる回転駆動部と、を備える、基板処理装置。【選択図】図１</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAJDnUKDglyDHFVCAlydQzxdfULUXAMCHAECoUGKzj6uShgU-HrGuLh78LDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMjIwNLCwMzQwcjYlSBACWACp6</recordid><startdate>20230626</startdate><enddate>20230626</enddate><creator>HATANO TATSUO</creator><creator>WATANABE NAOKI</creator><scope>EVB</scope></search><sort><creationdate>20230626</creationdate><title>SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD</title><author>HATANO TATSUO ; WATANABE NAOKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023088160A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>HATANO TATSUO</creatorcontrib><creatorcontrib>WATANABE NAOKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HATANO TATSUO</au><au>WATANABE NAOKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD</title><date>2023-06-26</date><risdate>2023</risdate><abstract>To provide a substrate treatment apparatus and a substrate treatment method that can use a low melting material as a target.SOLUTION: A substrate treatment apparatus includes: a tray provided in a vacuum treatment vessel and having a recess for accommodating a target of a low melting material; a refrigerator for cooling the tray; a substrate holding unit for holding the substrate: an inversion drive unit for inverting the substrate holding unit upside down; and a rotation drive unit for rotating the substrate holding unit in a circumferential direction of the substrate.SELECTED DRAWING: Figure 1
【課題】低融点材料をターゲットとして用いることができる基板処理装置及び基板処理方法を提供する。【解決手段】真空処理容器内に設けられ、低融点材料のターゲットを収容する凹部を有するトレイと、前記トレイを冷却する冷凍機と、基板を保持する基板保持部と、前記基板保持部の上下を反転させる反転駆動部と、前記基板の周方向に前記基板保持部を回転させる回転駆動部と、を備える、基板処理装置。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD |
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