MANUFACTURING METHOD OF BLADE WITH BASE
To provide a manufacturing method of a blade with a base which can dispense with, or can reduce an adhesive for integrating the base and the cut blade.SOLUTION: A manufacturing method of a blade with a base for manufacturing the blade with the base by fixing the cut blade having a circular opening t...
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| creator | KAI KEIICHI FUWA TOKUHITO |
| description | To provide a manufacturing method of a blade with a base which can dispense with, or can reduce an adhesive for integrating the base and the cut blade.SOLUTION: A manufacturing method of a blade with a base for manufacturing the blade with the base by fixing the cut blade having a circular opening to the base having an annular protrusion includes: a first step for preparing the base having the protrusion whose outside diameter is larger than a diameter of the opening of the cut blade, and the cut blade; a second step for contracting the base so that the outside diameter of the protrusion becomes smaller than the diameter of the opening of the cut blade by lowering a temperature of the base; a third step for inserting the protrusion into the opening of the cut blade; and a fourth step for expanding the base so that the cut blade is fixed to the base by raising the temperature of the base.SELECTED DRAWING: Figure 1
【課題】基台と切削ブレードとを一体化させるための接着剤を省略又は削減することが可能な基台付きブレードの製造方法を提供する。【解決手段】環状の凸部を有する基台に円形の開口を有する切削ブレードを固定して基台付きブレードを製造する基台付きブレードの製造方法であって、切削ブレードの開口の直径よりも外径が大きい凸部を有する基台と、切削ブレードと、を準備する第１工程と、基台の温度を低下させることにより、凸部の外径が切削ブレードの開口の直径よりも小さくなるように基台を収縮させる第２工程と、凸部を切削ブレードの開口に挿入する第３工程と、基台の温度を上昇させることにより、基台に切削ブレードが固定されるように基台を膨張させる第４工程と、を含む。【選択図】図１ |
| format | Patent |
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【課題】基台と切削ブレードとを一体化させるための接着剤を省略又は削減することが可能な基台付きブレードの製造方法を提供する。【解決手段】環状の凸部を有する基台に円形の開口を有する切削ブレードを固定して基台付きブレードを製造する基台付きブレードの製造方法であって、切削ブレードの開口の直径よりも外径が大きい凸部を有する基台と、切削ブレードと、を準備する第１工程と、基台の温度を低下させることにより、凸部の外径が切削ブレードの開口の直径よりも小さくなるように基台を収縮させる第２工程と、凸部を切削ブレードの開口に挿入する第３工程と、基台の温度を上昇させることにより、基台に切削ブレードが固定されるように基台を膨張させる第４工程と、を含む。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230613&DB=EPODOC&CC=JP&NR=2023081526A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230613&DB=EPODOC&CC=JP&NR=2023081526A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAI KEIICHI</creatorcontrib><creatorcontrib>FUWA TOKUHITO</creatorcontrib><title>MANUFACTURING METHOD OF BLADE WITH BASE</title><description>To provide a manufacturing method of a blade with a base which can dispense with, or can reduce an adhesive for integrating the base and the cut blade.SOLUTION: A manufacturing method of a blade with a base for manufacturing the blade with the base by fixing the cut blade having a circular opening to the base having an annular protrusion includes: a first step for preparing the base having the protrusion whose outside diameter is larger than a diameter of the opening of the cut blade, and the cut blade; a second step for contracting the base so that the outside diameter of the protrusion becomes smaller than the diameter of the opening of the cut blade by lowering a temperature of the base; a third step for inserting the protrusion into the opening of the cut blade; and a fourth step for expanding the base so that the cut blade is fixed to the base by raising the temperature of the base.SELECTED DRAWING: Figure 1
【課題】基台と切削ブレードとを一体化させるための接着剤を省略又は削減することが可能な基台付きブレードの製造方法を提供する。【解決手段】環状の凸部を有する基台に円形の開口を有する切削ブレードを固定して基台付きブレードを製造する基台付きブレードの製造方法であって、切削ブレードの開口の直径よりも外径が大きい凸部を有する基台と、切削ブレードと、を準備する第１工程と、基台の温度を低下させることにより、凸部の外径が切削ブレードの開口の直径よりも小さくなるように基台を収縮させる第２工程と、凸部を切削ブレードの開口に挿入する第３工程と、基台の温度を上昇させることにより、基台に切削ブレードが固定されるように基台を膨張させる第４工程と、を含む。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3dfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1Nw8nF0cVUI9wzxUHByDHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkbGBhaGpkZmjsZEKQIAEhwj9Q</recordid><startdate>20230613</startdate><enddate>20230613</enddate><creator>KAI KEIICHI</creator><creator>FUWA TOKUHITO</creator><scope>EVB</scope></search><sort><creationdate>20230613</creationdate><title>MANUFACTURING METHOD OF BLADE WITH BASE</title><author>KAI KEIICHI ; FUWA TOKUHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023081526A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KAI KEIICHI</creatorcontrib><creatorcontrib>FUWA TOKUHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAI KEIICHI</au><au>FUWA TOKUHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD OF BLADE WITH BASE</title><date>2023-06-13</date><risdate>2023</risdate><abstract>To provide a manufacturing method of a blade with a base which can dispense with, or can reduce an adhesive for integrating the base and the cut blade.SOLUTION: A manufacturing method of a blade with a base for manufacturing the blade with the base by fixing the cut blade having a circular opening to the base having an annular protrusion includes: a first step for preparing the base having the protrusion whose outside diameter is larger than a diameter of the opening of the cut blade, and the cut blade; a second step for contracting the base so that the outside diameter of the protrusion becomes smaller than the diameter of the opening of the cut blade by lowering a temperature of the base; a third step for inserting the protrusion into the opening of the cut blade; and a fourth step for expanding the base so that the cut blade is fixed to the base by raising the temperature of the base.SELECTED DRAWING: Figure 1
【課題】基台と切削ブレードとを一体化させるための接着剤を省略又は削減することが可能な基台付きブレードの製造方法を提供する。【解決手段】環状の凸部を有する基台に円形の開口を有する切削ブレードを固定して基台付きブレードを製造する基台付きブレードの製造方法であって、切削ブレードの開口の直径よりも外径が大きい凸部を有する基台と、切削ブレードと、を準備する第１工程と、基台の温度を低下させることにより、凸部の外径が切削ブレードの開口の直径よりも小さくなるように基台を収縮させる第２工程と、凸部を切削ブレードの開口に挿入する第３工程と、基台の温度を上昇させることにより、基台に切削ブレードが固定されるように基台を膨張させる第４工程と、を含む。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | MANUFACTURING METHOD OF BLADE WITH BASE |
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