POWER MODULE, MANUFACTURING METHOD OF POWER MODULE, AND POWER CONVERSION DEVICE
To provide a technique capable of efficiently performing an appearance inspection on an external connection part in a square pole shape protruding upward from a sidewall part of a case in a power module.SOLUTION: A power module 202 comprises: a conductor layer 13 provided on an insulation substrate...
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| creator | FUJINO JUNJI KAWAZOE CHIKA |
| description | To provide a technique capable of efficiently performing an appearance inspection on an external connection part in a square pole shape protruding upward from a sidewall part of a case in a power module.SOLUTION: A power module 202 comprises: a conductor layer 13 provided on an insulation substrate 11; power semiconductor elements 21 and 22 disposed on the conductor layer 13; a case 51 enclosing the insulation substrate 11, the conductor layer 13 and the power semiconductor elements 21 and 22; a plurality of signal terminals 62 disposed along one side of a sidewall part 511 of the case 51; and a sealing resin 7 filling the inside of the case 51 and covering the power semiconductor elements 21 and 22. Each signal terminal 62 includes: an internal connection part 622 protruding to an inner peripheral side of the sidewall part 511 and electrically connected with the power semiconductor element 22; and an external connection part 621 in a square pole shape protruding upward from the sidewall part 511. Each signal terminal 62 is disposed while being rotated in a range from 5° or more to 40° or less with respect to a width direction of the sidewall part 511.SELECTED DRAWING: Figure 1
【課題】パワーモジュールにおいて、ケースの側壁部から上方に突出する四角柱状の外部接続部に対する外観検査を効率よく行うことが可能な技術を提供することを目的とする。【解決手段】パワーモジュール２０２は、絶縁基板１１上に設けられた導体層１３と、導体層１３上に配置されたパワー半導体素子２１，２２と、絶縁基板１１、導体層１３およびパワー半導体素子２１，２２を囲繞するケース５１と、ケース５１の側壁部５１１の一辺に沿って配置された複数の信号端子６２と、ケース５１内に充填され、パワー半導体素子２１，２２を覆う封止樹脂７とを備える。各信号端子６２は、側壁部５１１の内周側に突出しパワー半導体素子２２と電気的に接続される内部接続部６２２と、側壁部５１１から上方に突出する四角柱状の外部接続部６２１とを有する。各信号端子６２は、側壁部５１１の幅方向に対して、５°以上４０°以下の範囲内で回転した状態で配置される。【選択図】図１ |
| format | Patent |
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【課題】パワーモジュールにおいて、ケースの側壁部から上方に突出する四角柱状の外部接続部に対する外観検査を効率よく行うことが可能な技術を提供することを目的とする。【解決手段】パワーモジュール２０２は、絶縁基板１１上に設けられた導体層１３と、導体層１３上に配置されたパワー半導体素子２１，２２と、絶縁基板１１、導体層１３およびパワー半導体素子２１，２２を囲繞するケース５１と、ケース５１の側壁部５１１の一辺に沿って配置された複数の信号端子６２と、ケース５１内に充填され、パワー半導体素子２１，２２を覆う封止樹脂７とを備える。各信号端子６２は、側壁部５１１の内周側に突出しパワー半導体素子２２と電気的に接続される内部接続部６２２と、側壁部５１１から上方に突出する四角柱状の外部接続部６２１とを有する。各信号端子６２は、側壁部５１１の幅方向に対して、５°以上４０°以下の範囲内で回転した状態で配置される。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230606&DB=EPODOC&CC=JP&NR=2023077660A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230606&DB=EPODOC&CC=JP&NR=2023077660A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJINO JUNJI</creatorcontrib><creatorcontrib>KAWAZOE CHIKA</creatorcontrib><title>POWER MODULE, MANUFACTURING METHOD OF POWER MODULE, AND POWER CONVERSION DEVICE</title><description>To provide a technique capable of efficiently performing an appearance inspection on an external connection part in a square pole shape protruding upward from a sidewall part of a case in a power module.SOLUTION: A power module 202 comprises: a conductor layer 13 provided on an insulation substrate 11; power semiconductor elements 21 and 22 disposed on the conductor layer 13; a case 51 enclosing the insulation substrate 11, the conductor layer 13 and the power semiconductor elements 21 and 22; a plurality of signal terminals 62 disposed along one side of a sidewall part 511 of the case 51; and a sealing resin 7 filling the inside of the case 51 and covering the power semiconductor elements 21 and 22. Each signal terminal 62 includes: an internal connection part 622 protruding to an inner peripheral side of the sidewall part 511 and electrically connected with the power semiconductor element 22; and an external connection part 621 in a square pole shape protruding upward from the sidewall part 511. Each signal terminal 62 is disposed while being rotated in a range from 5° or more to 40° or less with respect to a width direction of the sidewall part 511.SELECTED DRAWING: Figure 1
【課題】パワーモジュールにおいて、ケースの側壁部から上方に突出する四角柱状の外部接続部に対する外観検査を効率よく行うことが可能な技術を提供することを目的とする。【解決手段】パワーモジュール２０２は、絶縁基板１１上に設けられた導体層１３と、導体層１３上に配置されたパワー半導体素子２１，２２と、絶縁基板１１、導体層１３およびパワー半導体素子２１，２２を囲繞するケース５１と、ケース５１の側壁部５１１の一辺に沿って配置された複数の信号端子６２と、ケース５１内に充填され、パワー半導体素子２１，２２を覆う封止樹脂７とを備える。各信号端子６２は、側壁部５１１の内周側に突出しパワー半導体素子２２と電気的に接続される内部接続部６２２と、側壁部５１１から上方に突出する四角柱状の外部接続部６２１とを有する。各信号端子６２は、側壁部５１１の幅方向に対して、５°以上４０°以下の範囲内で回転した状態で配置される。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAP8A93DVLw9XcJ9XHVUfB19At1c3QOCQ3y9HNX8HUN8fB3UfB3U0BV5ejnAhVx9vcLcw0K9vT3U3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsYG5uZmZgaOxkQpAgCcVC8q</recordid><startdate>20230606</startdate><enddate>20230606</enddate><creator>FUJINO JUNJI</creator><creator>KAWAZOE CHIKA</creator><scope>EVB</scope></search><sort><creationdate>20230606</creationdate><title>POWER MODULE, MANUFACTURING METHOD OF POWER MODULE, AND POWER CONVERSION DEVICE</title><author>FUJINO JUNJI ; KAWAZOE CHIKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023077660A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJINO JUNJI</creatorcontrib><creatorcontrib>KAWAZOE CHIKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJINO JUNJI</au><au>KAWAZOE CHIKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POWER MODULE, MANUFACTURING METHOD OF POWER MODULE, AND POWER CONVERSION DEVICE</title><date>2023-06-06</date><risdate>2023</risdate><abstract>To provide a technique capable of efficiently performing an appearance inspection on an external connection part in a square pole shape protruding upward from a sidewall part of a case in a power module.SOLUTION: A power module 202 comprises: a conductor layer 13 provided on an insulation substrate 11; power semiconductor elements 21 and 22 disposed on the conductor layer 13; a case 51 enclosing the insulation substrate 11, the conductor layer 13 and the power semiconductor elements 21 and 22; a plurality of signal terminals 62 disposed along one side of a sidewall part 511 of the case 51; and a sealing resin 7 filling the inside of the case 51 and covering the power semiconductor elements 21 and 22. Each signal terminal 62 includes: an internal connection part 622 protruding to an inner peripheral side of the sidewall part 511 and electrically connected with the power semiconductor element 22; and an external connection part 621 in a square pole shape protruding upward from the sidewall part 511. Each signal terminal 62 is disposed while being rotated in a range from 5° or more to 40° or less with respect to a width direction of the sidewall part 511.SELECTED DRAWING: Figure 1
【課題】パワーモジュールにおいて、ケースの側壁部から上方に突出する四角柱状の外部接続部に対する外観検査を効率よく行うことが可能な技術を提供することを目的とする。【解決手段】パワーモジュール２０２は、絶縁基板１１上に設けられた導体層１３と、導体層１３上に配置されたパワー半導体素子２１，２２と、絶縁基板１１、導体層１３およびパワー半導体素子２１，２２を囲繞するケース５１と、ケース５１の側壁部５１１の一辺に沿って配置された複数の信号端子６２と、ケース５１内に充填され、パワー半導体素子２１，２２を覆う封止樹脂７とを備える。各信号端子６２は、側壁部５１１の内周側に突出しパワー半導体素子２２と電気的に接続される内部接続部６２２と、側壁部５１１から上方に突出する四角柱状の外部接続部６２１とを有する。各信号端子６２は、側壁部５１１の幅方向に対して、５°以上４０°以下の範囲内で回転した状態で配置される。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| title | POWER MODULE, MANUFACTURING METHOD OF POWER MODULE, AND POWER CONVERSION DEVICE |
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