LASER CUTTING DEVICE, LASER CUTTING METHOD, AND DISPLAY MANUFACTURING METHOD

To provide a laser cutting device which performs cutting process efficiently, and to provide a manufacturing method of a display.SOLUTION: A laser cutting device 1 according to an embodiment includes: a stage 20 which suctions and holds a workpiece W; an optical system 30 which guides a laser beam f...

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Bibliographische Detailangaben
Hauptverfasser:	ODAJIMA TAMOTSU, KOBAYASHI NAOYUKI, SHIMOJI TERUAKI, ITO DAISUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a laser cutting device which performs cutting process efficiently, and to provide a manufacturing method of a display.SOLUTION: A laser cutting device 1 according to an embodiment includes: a stage 20 which suctions and holds a workpiece W; an optical system 30 which guides a laser beam for cutting the workpiece W to the workpiece W; a guide mechanism which movably holds the optical system 30 in a first direction in a top view; a first drive mechanism which moves the optical system along the guide mechanism; and a second drive mechanism which moves the guide mechanism in a second direction different from the first direction in the top view.SELECTED DRAWING: Figure 1 【課題】効率的に切断プロセスを行うことができるレーザ切断装置、及びディスプレイの製造方法を提供する。【解決手段】本実施形態にかかるレーザ切断装置１は、ワークＷを吸着保持するステージ２０と、ワークＷを切断するためのレーザ光をワークに導く光学系３０と、上面視において、第１の方向に光学系３０を移動可能に保持するガイド機構と、ガイド機構に沿って前記光学系を移動させる第１駆動機構と、上面視において、ガイド機構を第１の方向と異なる第２の方向に移動させる第２駆動機構と、を備えている。【選択図】図１