POLISHING COMPOSITION, METHOD FOR PRODUCING THE SAME, CONCENTRATE OF POLISHING LIQUID, AND POLISHING METHOD

To provide means that reduces faults on a polishing object surface after polishing with a polishing composition.SOLUTION: A polishing composition comprises a basic compound and a water-soluble polymer, the water-soluble polymer being obtained by the steps of (1) preparing a base solution containing...

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Bibliographische Detailangaben
Hauptverfasser:	TSUCHIYA KOSUKE, TANSHO HISANORI, MURASE TAKEHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide means that reduces faults on a polishing object surface after polishing with a polishing composition.SOLUTION: A polishing composition comprises a basic compound and a water-soluble polymer, the water-soluble polymer being obtained by the steps of (1) preparing a base solution containing a base water-soluble polymer and a solvent and (2) bringing the base solution into contact with a hydrophobic resin.SELECTED DRAWING: Figure 1 【課題】本発明は、研磨用組成物による研磨後における、研磨対象物表面の欠陥を低減する手段を提供する。【解決手段】本発明は、塩基性化合物、および水溶性高分子を含み、前記水溶性高分子は、（１）原料水溶性高分子と溶媒を含む原料溶液を得ることと、（２）前記原料溶液を疎水性の樹脂と接触させることと、を経ている、研磨用組成物に関する。【選択図】図１