SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
To provide a solder composition which hardly acts on an insulating coat and is excellent in solder spreadability.SOLUTION: A solder composition contains: a flux composition containing an (A) rosin resin, an (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which th...
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| creator | TANAKA SUMIRE MUNEKAWA YURIKA ICHIKAWA DAIGO |
| description | To provide a solder composition which hardly acts on an insulating coat and is excellent in solder spreadability.SOLUTION: A solder composition contains: a flux composition containing an (A) rosin resin, an (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which the (B) component contains a (B1) dicarboxylic acid having 3 to 8 carbon atoms, the (C) component contains at least one selected from the group consisting of a (C1) amide thixotropic agent having a hydroxy group in one molecule and a (C2) glycerol thixotropic agent having a hydroxy group in one molecule, and the solder composition satisfies a condition represented by Numerical Formula (F1) below provided that a total of contents of the (C1) component and the (C2) component is defined as X and a content of the (B1) component is defined as Y. X/2≤Y≤5X...(F1).SELECTED DRAWING: None
【課題】絶縁被膜に作用しにくく、はんだの広がり性に優れるはんだ組成物を提供すること。【解決手段】（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）チクソ剤、および（Ｄ）溶剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、前記（Ｂ）成分が、（Ｂ１）炭素数が３以上８以下であるジカルボン酸を含有し、前記（Ｃ）成分が、（Ｃ１）１分子中にヒドロキシ基を有するアマイド系チクソ剤、および（Ｃ２）１分子中にヒドロキシ基を有するグリセロール系チクソ剤からなる群から選択される少なくとも１つを含有し、前記（Ｃ１）成分および前記（Ｃ２）成分の合計配合量をＸとし、前記（Ｂ１）成分の配合量をＹとしたとき、下記数式（Ｆ１）で示される条件を満たす、はんだ組成物。Ｘ／２≦Ｙ≦５Ｘ・・・（Ｆ１）【選択図】なし |
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【課題】絶縁被膜に作用しにくく、はんだの広がり性に優れるはんだ組成物を提供すること。【解決手段】（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）チクソ剤、および（Ｄ）溶剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、前記（Ｂ）成分が、（Ｂ１）炭素数が３以上８以下であるジカルボン酸を含有し、前記（Ｃ）成分が、（Ｃ１）１分子中にヒドロキシ基を有するアマイド系チクソ剤、および（Ｃ２）１分子中にヒドロキシ基を有するグリセロール系チクソ剤からなる群から選択される少なくとも１つを含有し、前記（Ｃ１）成分および前記（Ｃ２）成分の合計配合量をＸとし、前記（Ｂ１）成分の配合量をＹとしたとき、下記数式（Ｆ１）で示される条件を満たす、はんだ組成物。Ｘ／２≦Ｙ≦５Ｘ・・・（Ｆ１）【選択図】なし</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230329&DB=EPODOC&CC=JP&NR=2023043354A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230329&DB=EPODOC&CC=JP&NR=2023043354A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANAKA SUMIRE</creatorcontrib><creatorcontrib>MUNEKAWA YURIKA</creatorcontrib><creatorcontrib>ICHIKAWA DAIGO</creatorcontrib><title>SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD</title><description>To provide a solder composition which hardly acts on an insulating coat and is excellent in solder spreadability.SOLUTION: A solder composition contains: a flux composition containing an (A) rosin resin, an (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which the (B) component contains a (B1) dicarboxylic acid having 3 to 8 carbon atoms, the (C) component contains at least one selected from the group consisting of a (C1) amide thixotropic agent having a hydroxy group in one molecule and a (C2) glycerol thixotropic agent having a hydroxy group in one molecule, and the solder composition satisfies a condition represented by Numerical Formula (F1) below provided that a total of contents of the (C1) component and the (C2) component is defined as X and a content of the (B1) component is defined as Y. X/2≤Y≤5X...(F1).SELECTED DRAWING: None
【課題】絶縁被膜に作用しにくく、はんだの広がり性に優れるはんだ組成物を提供すること。【解決手段】（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）チクソ剤、および（Ｄ）溶剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、前記（Ｂ）成分が、（Ｂ１）炭素数が３以上８以下であるジカルボン酸を含有し、前記（Ｃ）成分が、（Ｃ１）１分子中にヒドロキシ基を有するアマイド系チクソ剤、および（Ｃ２）１分子中にヒドロキシ基を有するグリセロール系チクソ剤からなる群から選択される少なくとも１つを含有し、前記（Ｃ１）成分および前記（Ｃ２）成分の合計配合量をＸとし、前記（Ｂ１）成分の配合量をＹとしたとき、下記数式（Ｆ１）で示される条件を満たす、はんだ組成物。Ｘ／２≦Ｙ≦５Ｘ・・・（Ｆ１）【選択図】なし</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAL9vdxcQ1ScPb3DfAP9gzx9PdTcPRzUfB1DfHwd1Fw8w9S8HX0C3VzdA4JDfL0c1dw83GN8HTycVVw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGxgYmxsamJo7GRCkCABLHLMc</recordid><startdate>20230329</startdate><enddate>20230329</enddate><creator>TANAKA SUMIRE</creator><creator>MUNEKAWA YURIKA</creator><creator>ICHIKAWA DAIGO</creator><scope>EVB</scope></search><sort><creationdate>20230329</creationdate><title>SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD</title><author>TANAKA SUMIRE ; MUNEKAWA YURIKA ; ICHIKAWA DAIGO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023043354A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA SUMIRE</creatorcontrib><creatorcontrib>MUNEKAWA YURIKA</creatorcontrib><creatorcontrib>ICHIKAWA DAIGO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA SUMIRE</au><au>MUNEKAWA YURIKA</au><au>ICHIKAWA DAIGO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD</title><date>2023-03-29</date><risdate>2023</risdate><abstract>To provide a solder composition which hardly acts on an insulating coat and is excellent in solder spreadability.SOLUTION: A solder composition contains: a flux composition containing an (A) rosin resin, an (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which the (B) component contains a (B1) dicarboxylic acid having 3 to 8 carbon atoms, the (C) component contains at least one selected from the group consisting of a (C1) amide thixotropic agent having a hydroxy group in one molecule and a (C2) glycerol thixotropic agent having a hydroxy group in one molecule, and the solder composition satisfies a condition represented by Numerical Formula (F1) below provided that a total of contents of the (C1) component and the (C2) component is defined as X and a content of the (B1) component is defined as Y. X/2≤Y≤5X...(F1).SELECTED DRAWING: None
【課題】絶縁被膜に作用しにくく、はんだの広がり性に優れるはんだ組成物を提供すること。【解決手段】（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）チクソ剤、および（Ｄ）溶剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、前記（Ｂ）成分が、（Ｂ１）炭素数が３以上８以下であるジカルボン酸を含有し、前記（Ｃ）成分が、（Ｃ１）１分子中にヒドロキシ基を有するアマイド系チクソ剤、および（Ｃ２）１分子中にヒドロキシ基を有するグリセロール系チクソ剤からなる群から選択される少なくとも１つを含有し、前記（Ｃ１）成分および前記（Ｃ２）成分の合計配合量をＸとし、前記（Ｂ１）成分の配合量をＹとしたとき、下記数式（Ｆ１）で示される条件を満たす、はんだ組成物。Ｘ／２≦Ｙ≦５Ｘ・・・（Ｆ１）【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD |
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