PROTECTIVE FILM FORMATION DEVICE

To provide a protective film formation device which can form a protective film having a flat surface without exerting a load on an element.SOLUTION: A protective film formation device includes: a resin supply part for supplying a liquid curable resin R to a surface where an element of a substrate is mounted; a substrate holding part 33 for holding the substrate to which the curable resin R is supplied; a backup part 34 provided so as to face the substrate holding part 33; a tape supply part for supplying an adhesion preventive tape T between the substrate holding part 33 and the backup part 34; a pressing part 36 for pressing the substrate toward the backup part 34, pushing the curable resin R supplied to the substrate against the adhesion preventive tape T, and spreading the curable resin R onto the substrate; a curable part 37 for curing the curable resin R expanded onto the substrate; and a curable control part for controlling to increase the speed at which the curable part 37 cures the curable resin R while the pressing part 36 presses the substrate, the pressing part 36 pushes the curable resin R against the adhesion preventive tape T, and the curable resin R is spread onto the substrate.SELECTED DRAWING: Figure 6 【課題】本発明は、素子に負担を掛けず、表面が平坦な保護膜を形成することができる保護膜形成装置を提供する。【解決手段】基板の素子が搭載された面に液状の硬化性樹脂Ｒを供給する樹脂供給部と、硬化性樹脂Ｒが供給された基板を保持する基板保持部３３と、基板保持部３３に対向して設けられるバックアップ部３４と、基板保持部３３とバックアップ部３４との間に付着防止テープＴを供給するテープ供給部と、バックアップ部３４に向けて基板を押圧し、付着防止テープＴに基板に供給された硬化性樹脂Ｒを押し当て、硬化性樹脂Ｒを基板上に延展させる押圧部３６と、基板上に延展した硬化性樹脂Ｒを硬化させる硬化部３７と、押圧部３６により基板を押圧して、押圧部３６により硬化性樹脂Ｒが付着防止テープＴに押し当てられ、基板上に延展する間に、硬化部３７が硬化性樹脂Ｒを硬化させる速度を上げるように制御する硬化制御部と、を備える。【選択図】図６