SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

To provide a semiconductor device that can easily achieve improvement of breakdown voltage and miniaturization and a manufacturing method for the same.SOLUTION: A semiconductor substrate SB has a surface SU and a convex part CON protruding upwardly from the surface SU. An n-type drift area DF has a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKASHIBA YASUTAKA, KOSHIMIZU AKIRA, KAWAI TORU
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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