DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
To provide a double-sided flexible circuit board.SOLUTION: A double-sided flexible circuit board 100 includes a flexible substrate 110, a first circuit layer, a second circuit layer, an insulating protection layer 140, and a plurality of through circuit lines 150. The first circuit layer is located...
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| creator | PENG CHIH-MING LEE CHUN-TE HUANG HUI-YU LIN YINN |
| description | To provide a double-sided flexible circuit board.SOLUTION: A double-sided flexible circuit board 100 includes a flexible substrate 110, a first circuit layer, a second circuit layer, an insulating protection layer 140, and a plurality of through circuit lines 150. The first circuit layer is located on a top surface of the flexible substrate. The second circuit layer is located on a bottom surface of the flexible substrate. The insulating protection layer covers a support line 132 of the second circuit layer. The support line is located between the flexible substrate and the insulating protection layer. The insulating protection layer is used for isolating and protecting the support line of the second circuit layer to avoid the occurrence of short-circuit of the double-sided flexible circuit board during test.SELECTED DRAWING: Figure 3
【課題】両面フレキシブル回路基板を提供する。【解決手段】両面フレキシブル回路基板１００は、フレキシブル基板１１０、第一回路層、第二回路層、絶縁保護層１４０及び複数の貫通用回路１５０を含む。第一回路層は、フレキシブル基板の上面に位置する。第二回路層は、フレキシブル基板の下面に位置する。絶縁保護層は、第二回路層の支持ライン１３２を被覆する。支持ラインは、フレキシブル基板と絶縁保護層との間に位置している。絶縁保護層は、第二回路層の支持ラインを絶縁し保護するために用いられ、両面フレキシブル回路基板がテスト時にショートが発生するのを回避している。【選択図】図３ |
| format | Patent |
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【課題】両面フレキシブル回路基板を提供する。【解決手段】両面フレキシブル回路基板１００は、フレキシブル基板１１０、第一回路層、第二回路層、絶縁保護層１４０及び複数の貫通用回路１５０を含む。第一回路層は、フレキシブル基板の上面に位置する。第二回路層は、フレキシブル基板の下面に位置する。絶縁保護層は、第二回路層の支持ライン１３２を被覆する。支持ラインは、フレキシブル基板と絶縁保護層との間に位置している。絶縁保護層は、第二回路層の支持ラインを絶縁し保護するために用いられ、両面フレキシブル回路基板がテスト時にショートが発生するのを回避している。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230221&DB=EPODOC&CC=JP&NR=2023024939A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230221&DB=EPODOC&CC=JP&NR=2023024939A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PENG CHIH-MING</creatorcontrib><creatorcontrib>LEE CHUN-TE</creatorcontrib><creatorcontrib>HUANG HUI-YU</creatorcontrib><creatorcontrib>LIN YINN</creatorcontrib><title>DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD</title><description>To provide a double-sided flexible circuit board.SOLUTION: A double-sided flexible circuit board 100 includes a flexible substrate 110, a first circuit layer, a second circuit layer, an insulating protection layer 140, and a plurality of through circuit lines 150. The first circuit layer is located on a top surface of the flexible substrate. The second circuit layer is located on a bottom surface of the flexible substrate. The insulating protection layer covers a support line 132 of the second circuit layer. The support line is located between the flexible substrate and the insulating protection layer. The insulating protection layer is used for isolating and protecting the support line of the second circuit layer to avoid the occurrence of short-circuit of the double-sided flexible circuit board during test.SELECTED DRAWING: Figure 3
【課題】両面フレキシブル回路基板を提供する。【解決手段】両面フレキシブル回路基板１００は、フレキシブル基板１１０、第一回路層、第二回路層、絶縁保護層１４０及び複数の貫通用回路１５０を含む。第一回路層は、フレキシブル基板の上面に位置する。第二回路層は、フレキシブル基板の下面に位置する。絶縁保護層は、第二回路層の支持ライン１３２を被覆する。支持ラインは、フレキシブル基板と絶縁保護層との間に位置している。絶縁保護層は、第二回路層の支持ラインを絶縁し保護するために用いられ、両面フレキシブル回路基板がテスト時にショートが発生するのを回避している。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB28Q918nHVDfZ0cXVRcPNxjfAEchWcPYOcQz1DFJz8HYNceBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGRsYGRiaWxpaMxUYoAiUwi-Q</recordid><startdate>20230221</startdate><enddate>20230221</enddate><creator>PENG CHIH-MING</creator><creator>LEE CHUN-TE</creator><creator>HUANG HUI-YU</creator><creator>LIN YINN</creator><scope>EVB</scope></search><sort><creationdate>20230221</creationdate><title>DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD</title><author>PENG CHIH-MING ; LEE CHUN-TE ; HUANG HUI-YU ; LIN YINN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023024939A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PENG CHIH-MING</creatorcontrib><creatorcontrib>LEE CHUN-TE</creatorcontrib><creatorcontrib>HUANG HUI-YU</creatorcontrib><creatorcontrib>LIN YINN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PENG CHIH-MING</au><au>LEE CHUN-TE</au><au>HUANG HUI-YU</au><au>LIN YINN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD</title><date>2023-02-21</date><risdate>2023</risdate><abstract>To provide a double-sided flexible circuit board.SOLUTION: A double-sided flexible circuit board 100 includes a flexible substrate 110, a first circuit layer, a second circuit layer, an insulating protection layer 140, and a plurality of through circuit lines 150. The first circuit layer is located on a top surface of the flexible substrate. The second circuit layer is located on a bottom surface of the flexible substrate. The insulating protection layer covers a support line 132 of the second circuit layer. The support line is located between the flexible substrate and the insulating protection layer. The insulating protection layer is used for isolating and protecting the support line of the second circuit layer to avoid the occurrence of short-circuit of the double-sided flexible circuit board during test.SELECTED DRAWING: Figure 3
【課題】両面フレキシブル回路基板を提供する。【解決手段】両面フレキシブル回路基板１００は、フレキシブル基板１１０、第一回路層、第二回路層、絶縁保護層１４０及び複数の貫通用回路１５０を含む。第一回路層は、フレキシブル基板の上面に位置する。第二回路層は、フレキシブル基板の下面に位置する。絶縁保護層は、第二回路層の支持ライン１３２を被覆する。支持ラインは、フレキシブル基板と絶縁保護層との間に位置している。絶縁保護層は、第二回路層の支持ラインを絶縁し保護するために用いられ、両面フレキシブル回路基板がテスト時にショートが発生するのを回避している。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD |
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