ROTARY CATHODE UNIT FOR SPUTTERING DEVICE
To provide a rotary cathode unit for sputtering device that has a structure capable of determining that a refrigerant securely circulates over the whole refrigerant circulation path.SOLUTION: A rotary cathode unit for sputtering device that comprises a cylindrical target Tg arranged in a vacuum atmo...
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| creator | TACHIKAWA SHINSUKE NISHINOBO YASUKI SAITO KAZUHIKO HAKOMORI MUNEHITO KIMURA KO ORII YUICHI |
| description | To provide a rotary cathode unit for sputtering device that has a structure capable of determining that a refrigerant securely circulates over the whole refrigerant circulation path.SOLUTION: A rotary cathode unit for sputtering device that comprises a cylindrical target Tg arranged in a vacuum atmosphere, a drive block Db driving the target to rotate, and a support block Sb supporting the target rotatably comprises a refrigerant circulation path having a first path Fp1 reaching one of the drive block and support block from the other of the drive block and support block via a radially inner side of the cylindrical target, and a second path Fp2 reaching the other of the drive block and support block from the one of the drive block and support block via a further radially inner side of the first path, and is also provided with detection means Ws which detects a refrigerant flowing from a terminal end Fp1e of the first path to a starting end Fp2s of the second path.SELECTED DRAWING: Figure 2
【課題】冷媒循環通路をその全体に亘って確実に冷媒が循環していることを判断できる構造を持つスパッタリング装置用の回転式カソードユニットを提供する。【解決手段】真空雰囲気中に配置される筒状のターゲットＴｇと、ターゲットを回転駆動する駆動ブロックＤｂと、ターゲットを回転自在に支持する支持ブロックＳｂとを備えるスパッタリング装置用の回転式カソードユニットは、駆動ブロックと支持ブロックのいずれか一方から筒状のターゲットの径方向内側を通って駆動ブロックと支持ブロックのいずれか他方に達する第１通路Ｆｐ１と、駆動ブロックと支持ブロックのいずれか他方から第１通路の更に径方向内側を通って駆動ブロックと支持ブロックのいずれか一方に達する第２通路Ｆｐ２とを有する冷媒循環通路を備え、第１通路の終端Ｆｐ１ｅから第２通路の始端Ｆｐ２ｓに向かって流れる冷媒を検知する検知手段Ｗｓを設けたことを特徴とする。【選択図】図２ |
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【課題】冷媒循環通路をその全体に亘って確実に冷媒が循環していることを判断できる構造を持つスパッタリング装置用の回転式カソードユニットを提供する。【解決手段】真空雰囲気中に配置される筒状のターゲットＴｇと、ターゲットを回転駆動する駆動ブロックＤｂと、ターゲットを回転自在に支持する支持ブロックＳｂとを備えるスパッタリング装置用の回転式カソードユニットは、駆動ブロックと支持ブロックのいずれか一方から筒状のターゲットの径方向内側を通って駆動ブロックと支持ブロックのいずれか他方に達する第１通路Ｆｐ１と、駆動ブロックと支持ブロックのいずれか他方から第１通路の更に径方向内側を通って駆動ブロックと支持ブロックのいずれか一方に達する第２通路Ｆｐ２とを有する冷媒循環通路を備え、第１通路の終端Ｆｐ１ｅから第２通路の始端Ｆｐ２ｓに向かって流れる冷媒を検知する検知手段Ｗｓを設けたことを特徴とする。【選択図】図２</description><language>eng ; jpn</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=JP&NR=2023018812A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=JP&NR=2023018812A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TACHIKAWA SHINSUKE</creatorcontrib><creatorcontrib>NISHINOBO YASUKI</creatorcontrib><creatorcontrib>SAITO KAZUHIKO</creatorcontrib><creatorcontrib>HAKOMORI MUNEHITO</creatorcontrib><creatorcontrib>KIMURA KO</creatorcontrib><creatorcontrib>ORII YUICHI</creatorcontrib><title>ROTARY CATHODE UNIT FOR SPUTTERING DEVICE</title><description>To provide a rotary cathode unit for sputtering device that has a structure capable of determining that a refrigerant securely circulates over the whole refrigerant circulation path.SOLUTION: A rotary cathode unit for sputtering device that comprises a cylindrical target Tg arranged in a vacuum atmosphere, a drive block Db driving the target to rotate, and a support block Sb supporting the target rotatably comprises a refrigerant circulation path having a first path Fp1 reaching one of the drive block and support block from the other of the drive block and support block via a radially inner side of the cylindrical target, and a second path Fp2 reaching the other of the drive block and support block from the one of the drive block and support block via a further radially inner side of the first path, and is also provided with detection means Ws which detects a refrigerant flowing from a terminal end Fp1e of the first path to a starting end Fp2s of the second path.SELECTED DRAWING: Figure 2
【課題】冷媒循環通路をその全体に亘って確実に冷媒が循環していることを判断できる構造を持つスパッタリング装置用の回転式カソードユニットを提供する。【解決手段】真空雰囲気中に配置される筒状のターゲットＴｇと、ターゲットを回転駆動する駆動ブロックＤｂと、ターゲットを回転自在に支持する支持ブロックＳｂとを備えるスパッタリング装置用の回転式カソードユニットは、駆動ブロックと支持ブロックのいずれか一方から筒状のターゲットの径方向内側を通って駆動ブロックと支持ブロックのいずれか他方に達する第１通路Ｆｐ１と、駆動ブロックと支持ブロックのいずれか他方から第１通路の更に径方向内側を通って駆動ブロックと支持ブロックのいずれか一方に達する第２通路Ｆｐ２とを有する冷媒循環通路を備え、第１通路の終端Ｆｐ１ｅから第２通路の始端Ｆｐ２ｓに向かって流れる冷媒を検知する検知手段Ｗｓを設けたことを特徴とする。【選択図】図２</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAM8g9xDIpUcHYM8fB3cVUI9fMMUXDzD1IIDggNCXEN8vRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsYGhhYWhkaOxkQpAgB_sCTf</recordid><startdate>20230209</startdate><enddate>20230209</enddate><creator>TACHIKAWA SHINSUKE</creator><creator>NISHINOBO YASUKI</creator><creator>SAITO KAZUHIKO</creator><creator>HAKOMORI MUNEHITO</creator><creator>KIMURA KO</creator><creator>ORII YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20230209</creationdate><title>ROTARY CATHODE UNIT FOR SPUTTERING DEVICE</title><author>TACHIKAWA SHINSUKE ; NISHINOBO YASUKI ; SAITO KAZUHIKO ; HAKOMORI MUNEHITO ; KIMURA KO ; ORII YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023018812A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>TACHIKAWA SHINSUKE</creatorcontrib><creatorcontrib>NISHINOBO YASUKI</creatorcontrib><creatorcontrib>SAITO KAZUHIKO</creatorcontrib><creatorcontrib>HAKOMORI MUNEHITO</creatorcontrib><creatorcontrib>KIMURA KO</creatorcontrib><creatorcontrib>ORII YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TACHIKAWA SHINSUKE</au><au>NISHINOBO YASUKI</au><au>SAITO KAZUHIKO</au><au>HAKOMORI MUNEHITO</au><au>KIMURA KO</au><au>ORII YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ROTARY CATHODE UNIT FOR SPUTTERING DEVICE</title><date>2023-02-09</date><risdate>2023</risdate><abstract>To provide a rotary cathode unit for sputtering device that has a structure capable of determining that a refrigerant securely circulates over the whole refrigerant circulation path.SOLUTION: A rotary cathode unit for sputtering device that comprises a cylindrical target Tg arranged in a vacuum atmosphere, a drive block Db driving the target to rotate, and a support block Sb supporting the target rotatably comprises a refrigerant circulation path having a first path Fp1 reaching one of the drive block and support block from the other of the drive block and support block via a radially inner side of the cylindrical target, and a second path Fp2 reaching the other of the drive block and support block from the one of the drive block and support block via a further radially inner side of the first path, and is also provided with detection means Ws which detects a refrigerant flowing from a terminal end Fp1e of the first path to a starting end Fp2s of the second path.SELECTED DRAWING: Figure 2
【課題】冷媒循環通路をその全体に亘って確実に冷媒が循環していることを判断できる構造を持つスパッタリング装置用の回転式カソードユニットを提供する。【解決手段】真空雰囲気中に配置される筒状のターゲットＴｇと、ターゲットを回転駆動する駆動ブロックＤｂと、ターゲットを回転自在に支持する支持ブロックＳｂとを備えるスパッタリング装置用の回転式カソードユニットは、駆動ブロックと支持ブロックのいずれか一方から筒状のターゲットの径方向内側を通って駆動ブロックと支持ブロックのいずれか他方に達する第１通路Ｆｐ１と、駆動ブロックと支持ブロックのいずれか他方から第１通路の更に径方向内側を通って駆動ブロックと支持ブロックのいずれか一方に達する第２通路Ｆｐ２とを有する冷媒循環通路を備え、第１通路の終端Ｆｐ１ｅから第２通路の始端Ｆｐ２ｓに向かって流れる冷媒を検知する検知手段Ｗｓを設けたことを特徴とする。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | ROTARY CATHODE UNIT FOR SPUTTERING DEVICE |
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