SUBSTRATE SUPPORT DEVICE AND SUBSTRATE PROCESSING DEVICE

To suppress damage of a warped substrate.SOLUTION: A substrate support device of an embodiment for supporting a substrate in a processing container of a substrate processing device comprises: a placement plate configured including a ceramic and having a placement surface on which a substrate is placed; a feeding plate built into the placement plate and statically sucking the substrate to the placement plate; a plurality of protrusions including a conductive member inside, arranged in a center region and an outer edge region of at least the placement plate, and protruding from the placement surface; and a plurality of elastic members embedded into the placement plate corresponding to the plurality of protrusions, projecting and supporting the plurality of protrusions from the placement surface, and electrically connecting the feeding plate and the conductive member.SELECTED DRAWING: Figure 3 【課題】反りのある基板の損傷を抑制すること。【解決手段】実施形態の基板支持装置は、基板処理装置の処理容器内で基板を支持する基板支持装置であって、セラミックを含んで構成され、基板が載置される載置面を有する載置板と、載置板に内蔵され、載置板に基板を静電的に吸着させる給電板と、内部に導電部材を含んで、少なくとも載置板の中央領域と外縁領域とに配置され、載置面から突出する複数の突起部と、複数の突起部に対応して載置板に埋め込まれ、複数の突起部を載置面から突出させつつ支持するとともに、給電板と導電部材とを電気的に接続する複数の弾性部材と、を備える。【選択図】図３