MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM

MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM

To provide a mount property confirmation device and method of an electronic component.SOLUTION: A mount property confirmation device of an electronic component includes: a model production unit 13 which produces 3D information showing a 3D solder paste model of solder paste which connects an electro...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAOMI YUJI, KASHIMA MASANORI, MATSUURA KOJI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NAOMI YUJI
KASHIMA MASANORI
MATSUURA KOJI
description To provide a mount property confirmation device and method of an electronic component.SOLUTION: A mount property confirmation device of an electronic component includes: a model production unit 13 which produces 3D information showing a 3D solder paste model of solder paste which connects an electrode of the electronic component and an electrode pad in a board from thickness information of the solder paste and a planar shape of the electrode pad obtained from an opening shape of a 2D metal mask which is to be disposed on the board onto which the surface-mount electronic component is to be mounted and is used for printing the solder paste; a model deformation unit 14 which alters the 3D information showing the 3D solder paste model produced by the model production unit into deformed 3D information showing a deformed solder paste model having a 3D shape of the solder paste changed with a volume of the solder paste being constant; and a computation unit 21 which determines whether or not a relation between the electrode of the electronic component and the solder paste according to the deformed 3D information produced by the model deformation unit satisfies a specified range and which determines an error when the specified range is not satisfied.SELECTED DRAWING: Figure 1 【課題】電子部品の実装性確認装置及び方法を提供する。【解決手段】表面実装型の電子部品が実装される基板上に配置され、はんだペーストを印刷するために用いられる二次元のメタルマスクの開口形状から得られた電極用パッドの平面形状とはんだペーストの厚み情報から電子部品の電極と基板における電極用パッドを接続するはんだペーストの三次元はんだペーストモデルを示す三次元情報を生成するモデル生成部１３と、モデル生成部により生成された三次元はんだペーストモデルを示す三次元情報からはんだペーストの体積を一定にしてはんだペーストの三次元形状を変化させた変形はんだペーストモデルを示す変形三次元情報として変更するモデル変形部１４と、電子部品の電極とモデル変形部により生成された変形三次元情報によるはんだペーストとの関係が指定範囲を満足しているか否かを判定し、指定範囲を満足していないとエラーとする演算部２１と、を備える。【選択図】図１
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2023014534A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2023014534A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2023014534A3</originalsourceid><addsrcrecordid>eNqNyz0KwkAQhuE0FqLeYbCOEPNzgGV3kqy4M8uwEaxCkLUSDcTLeFtTWAerDz6ed518HHcUwAt7lHAFzVRbcSpYJjB4sRqBa8Az6iBMVs_CeSakkMJS6zC0bJbN_DaiXAqKDAhqFmOpmVNjO7dNVvfhMcXdbzfJvsag20McX32cxuEWn_Hdn3ye5UV2LKuiVMVf6AvT7kRV</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM</title><source>esp@cenet</source><creator>NAOMI YUJI ; KASHIMA MASANORI ; MATSUURA KOJI</creator><creatorcontrib>NAOMI YUJI ; KASHIMA MASANORI ; MATSUURA KOJI</creatorcontrib><description>To provide a mount property confirmation device and method of an electronic component.SOLUTION: A mount property confirmation device of an electronic component includes: a model production unit 13 which produces 3D information showing a 3D solder paste model of solder paste which connects an electrode of the electronic component and an electrode pad in a board from thickness information of the solder paste and a planar shape of the electrode pad obtained from an opening shape of a 2D metal mask which is to be disposed on the board onto which the surface-mount electronic component is to be mounted and is used for printing the solder paste; a model deformation unit 14 which alters the 3D information showing the 3D solder paste model produced by the model production unit into deformed 3D information showing a deformed solder paste model having a 3D shape of the solder paste changed with a volume of the solder paste being constant; and a computation unit 21 which determines whether or not a relation between the electrode of the electronic component and the solder paste according to the deformed 3D information produced by the model deformation unit satisfies a specified range and which determines an error when the specified range is not satisfied.SELECTED DRAWING: Figure 1 【課題】電子部品の実装性確認装置及び方法を提供する。【解決手段】表面実装型の電子部品が実装される基板上に配置され、はんだペーストを印刷するために用いられる二次元のメタルマスクの開口形状から得られた電極用パッドの平面形状とはんだペーストの厚み情報から電子部品の電極と基板における電極用パッドを接続するはんだペーストの三次元はんだペーストモデルを示す三次元情報を生成するモデル生成部１３と、モデル生成部により生成された三次元はんだペーストモデルを示す三次元情報からはんだペーストの体積を一定にしてはんだペーストの三次元形状を変化させた変形はんだペーストモデルを示す変形三次元情報として変更するモデル変形部１４と、電子部品の電極とモデル変形部により生成された変形三次元情報によるはんだペーストとの関係が指定範囲を満足しているか否かを判定し、指定範囲を満足していないとエラーとする演算部２１と、を備える。【選択図】図１</description><language>eng ; jpn</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230131&amp;DB=EPODOC&amp;CC=JP&amp;NR=2023014534A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230131&amp;DB=EPODOC&amp;CC=JP&amp;NR=2023014534A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAOMI YUJI</creatorcontrib><creatorcontrib>KASHIMA MASANORI</creatorcontrib><creatorcontrib>MATSUURA KOJI</creatorcontrib><title>MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM</title><description>To provide a mount property confirmation device and method of an electronic component.SOLUTION: A mount property confirmation device of an electronic component includes: a model production unit 13 which produces 3D information showing a 3D solder paste model of solder paste which connects an electrode of the electronic component and an electrode pad in a board from thickness information of the solder paste and a planar shape of the electrode pad obtained from an opening shape of a 2D metal mask which is to be disposed on the board onto which the surface-mount electronic component is to be mounted and is used for printing the solder paste; a model deformation unit 14 which alters the 3D information showing the 3D solder paste model produced by the model production unit into deformed 3D information showing a deformed solder paste model having a 3D shape of the solder paste changed with a volume of the solder paste being constant; and a computation unit 21 which determines whether or not a relation between the electrode of the electronic component and the solder paste according to the deformed 3D information produced by the model deformation unit satisfies a specified range and which determines an error when the specified range is not satisfied.SELECTED DRAWING: Figure 1 【課題】電子部品の実装性確認装置及び方法を提供する。【解決手段】表面実装型の電子部品が実装される基板上に配置され、はんだペーストを印刷するために用いられる二次元のメタルマスクの開口形状から得られた電極用パッドの平面形状とはんだペーストの厚み情報から電子部品の電極と基板における電極用パッドを接続するはんだペーストの三次元はんだペーストモデルを示す三次元情報を生成するモデル生成部１３と、モデル生成部により生成された三次元はんだペーストモデルを示す三次元情報からはんだペーストの体積を一定にしてはんだペーストの三次元形状を変化させた変形はんだペーストモデルを示す変形三次元情報として変更するモデル変形部１４と、電子部品の電極とモデル変形部により生成された変形三次元情報によるはんだペーストとの関係が指定範囲を満足しているか否かを判定し、指定範囲を満足していないとエラーとする演算部２１と、を備える。【選択図】図１</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyz0KwkAQhuE0FqLeYbCOEPNzgGV3kqy4M8uwEaxCkLUSDcTLeFtTWAerDz6ed518HHcUwAt7lHAFzVRbcSpYJjB4sRqBa8Az6iBMVs_CeSakkMJS6zC0bJbN_DaiXAqKDAhqFmOpmVNjO7dNVvfhMcXdbzfJvsag20McX32cxuEWn_Hdn3ye5UV2LKuiVMVf6AvT7kRV</recordid><startdate>20230131</startdate><enddate>20230131</enddate><creator>NAOMI YUJI</creator><creator>KASHIMA MASANORI</creator><creator>MATSUURA KOJI</creator><scope>EVB</scope></search><sort><creationdate>20230131</creationdate><title>MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM</title><author>NAOMI YUJI ; KASHIMA MASANORI ; MATSUURA KOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023014534A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAOMI YUJI</creatorcontrib><creatorcontrib>KASHIMA MASANORI</creatorcontrib><creatorcontrib>MATSUURA KOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAOMI YUJI</au><au>KASHIMA MASANORI</au><au>MATSUURA KOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM</title><date>2023-01-31</date><risdate>2023</risdate><abstract>To provide a mount property confirmation device and method of an electronic component.SOLUTION: A mount property confirmation device of an electronic component includes: a model production unit 13 which produces 3D information showing a 3D solder paste model of solder paste which connects an electrode of the electronic component and an electrode pad in a board from thickness information of the solder paste and a planar shape of the electrode pad obtained from an opening shape of a 2D metal mask which is to be disposed on the board onto which the surface-mount electronic component is to be mounted and is used for printing the solder paste; a model deformation unit 14 which alters the 3D information showing the 3D solder paste model produced by the model production unit into deformed 3D information showing a deformed solder paste model having a 3D shape of the solder paste changed with a volume of the solder paste being constant; and a computation unit 21 which determines whether or not a relation between the electrode of the electronic component and the solder paste according to the deformed 3D information produced by the model deformation unit satisfies a specified range and which determines an error when the specified range is not satisfied.SELECTED DRAWING: Figure 1 【課題】電子部品の実装性確認装置及び方法を提供する。【解決手段】表面実装型の電子部品が実装される基板上に配置され、はんだペーストを印刷するために用いられる二次元のメタルマスクの開口形状から得られた電極用パッドの平面形状とはんだペーストの厚み情報から電子部品の電極と基板における電極用パッドを接続するはんだペーストの三次元はんだペーストモデルを示す三次元情報を生成するモデル生成部１３と、モデル生成部により生成された三次元はんだペーストモデルを示す三次元情報からはんだペーストの体積を一定にしてはんだペーストの三次元形状を変化させた変形はんだペーストモデルを示す変形三次元情報として変更するモデル変形部１４と、電子部品の電極とモデル変形部により生成された変形三次元情報によるはんだペーストとの関係が指定範囲を満足しているか否かを判定し、指定範囲を満足していないとエラーとする演算部２１と、を備える。【選択図】図１</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; jpn
recordid cdi_epo_espacenet_JP2023014534A
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title MOUNT PROPERTY CONFIRMATION DEVICE OF ELECTRONIC COMPONENT, MOUNT PROPERTY CONFIRMATION METHOD, MOUNT PROPERTY CONFIRMATION PROGRAM, AND RECORDING MEDIUM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T15%3A01%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAOMI%20YUJI&rft.date=2023-01-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2023014534A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true