SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
To provide a sealing resin composition which is excellent in concealment property and visibility of printing by a laser marking method.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler and a coloring agent, wherein the coloring agent contains a surfac...
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| creator | FUSUMADA MITSUAKI NEGORO SHUHEI SAITO TAKESHI KAMIMURA KAZUYA |
| description | To provide a sealing resin composition which is excellent in concealment property and visibility of printing by a laser marking method.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler and a coloring agent, wherein the coloring agent contains a surface-treated coloring agent.SELECTED DRAWING: None
【課題】隠蔽性及びレーザーマーキング法による印字の視認性に優れる封止樹脂組成物を提供すること。【解決手段】封止樹脂組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、着色剤とを含有し、前記着色剤が、表面処理された着色剤を含む。【選択図】なし |
| format | Patent |
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【課題】隠蔽性及びレーザーマーキング法による印字の視認性に優れる封止樹脂組成物を提供すること。【解決手段】封止樹脂組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、着色剤とを含有し、前記着色剤が、表面処理された着色剤を含む。【選択図】なし</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=JP&NR=2023012946A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=JP&NR=2023012946A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUSUMADA MITSUAKI</creatorcontrib><creatorcontrib>NEGORO SHUHEI</creatorcontrib><creatorcontrib>SAITO TAKESHI</creatorcontrib><creatorcontrib>KAMIMURA KAZUYA</creatorcontrib><title>SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE</title><description>To provide a sealing resin composition which is excellent in concealment property and visibility of printing by a laser marking method.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler and a coloring agent, wherein the coloring agent contains a surface-treated coloring agent.SELECTED DRAWING: None
【課題】隠蔽性及びレーザーマーキング法による印字の視認性に優れる封止樹脂組成物を提供すること。【解決手段】封止樹脂組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、着色剤とを含有し、前記着色剤が、表面処理された着色剤を含む。【選択図】なし</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKdnX08fRzVwhyDfb0U3D29w3wD_YM8fT3U3D0c1EIdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsYGhkaWJmaOxkQpAgDUmSdh</recordid><startdate>20230126</startdate><enddate>20230126</enddate><creator>FUSUMADA MITSUAKI</creator><creator>NEGORO SHUHEI</creator><creator>SAITO TAKESHI</creator><creator>KAMIMURA KAZUYA</creator><scope>EVB</scope></search><sort><creationdate>20230126</creationdate><title>SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE</title><author>FUSUMADA MITSUAKI ; NEGORO SHUHEI ; SAITO TAKESHI ; KAMIMURA KAZUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023012946A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUSUMADA MITSUAKI</creatorcontrib><creatorcontrib>NEGORO SHUHEI</creatorcontrib><creatorcontrib>SAITO TAKESHI</creatorcontrib><creatorcontrib>KAMIMURA KAZUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUSUMADA MITSUAKI</au><au>NEGORO SHUHEI</au><au>SAITO TAKESHI</au><au>KAMIMURA KAZUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE</title><date>2023-01-26</date><risdate>2023</risdate><abstract>To provide a sealing resin composition which is excellent in concealment property and visibility of printing by a laser marking method.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler and a coloring agent, wherein the coloring agent contains a surface-treated coloring agent.SELECTED DRAWING: None
【課題】隠蔽性及びレーザーマーキング法による印字の視認性に優れる封止樹脂組成物を提供すること。【解決手段】封止樹脂組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、着色剤とを含有し、前記着色剤が、表面処理された着色剤を含む。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
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