JOINING DEVICE AND JOINING METHOD
To provide a technique capable of improving precision of positioning between substrates to be joined together.SOLUTION: A joining device has: a first holding part which holds a first substrate; a second holding part which holds a second substrate; and a moving part which moves at least one of the fi...
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| creator | INAMASU HISASHI |
| description | To provide a technique capable of improving precision of positioning between substrates to be joined together.SOLUTION: A joining device has: a first holding part which holds a first substrate; a second holding part which holds a second substrate; and a moving part which moves at least one of the first holding part and second holding part relatively to the other. The joining device further comprises: an imaging unit which images both a first mark formed on the substrate and a second mark formed on the second substrate using light transmitted through the first substrate; and a control part which places the moving part in operation based upon imaging information obtained by the imaging unit.SELECTED DRAWING: Figure 7
【課題】接合する基板同士の位置合わせの精度を向上させることできる技術を提供する。【解決手段】接合装置は、第１基板を保持する第１保持部と、第２基板を保持する第２保持部と、第１保持部と第２保持部のうち少なくとも一方を他方に対して相対移動させる移動部と、を有する。また、接合装置は、第１基板を透過する光を用いて、第１基板に形成された第１マークと、第２基板に形成された第２マークとの両方を撮像する撮像ユニットと、撮像ユニットが撮像した撮像情報に基づき移動部を動作させる制御部と、を備える。【選択図】図７ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2023008587A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2023008587A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2023008587A3</originalsourceid><addsrcrecordid>eNrjZFD08vf08_RzV3BxDfN0dlVw9HNRgAn5uoZ4-LvwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjAwMLUwtzR2OiFAEAPzMiYg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JOINING DEVICE AND JOINING METHOD</title><source>esp@cenet</source><creator>INAMASU HISASHI</creator><creatorcontrib>INAMASU HISASHI</creatorcontrib><description>To provide a technique capable of improving precision of positioning between substrates to be joined together.SOLUTION: A joining device has: a first holding part which holds a first substrate; a second holding part which holds a second substrate; and a moving part which moves at least one of the first holding part and second holding part relatively to the other. The joining device further comprises: an imaging unit which images both a first mark formed on the substrate and a second mark formed on the second substrate using light transmitted through the first substrate; and a control part which places the moving part in operation based upon imaging information obtained by the imaging unit.SELECTED DRAWING: Figure 7
【課題】接合する基板同士の位置合わせの精度を向上させることできる技術を提供する。【解決手段】接合装置は、第１基板を保持する第１保持部と、第２基板を保持する第２保持部と、第１保持部と第２保持部のうち少なくとも一方を他方に対して相対移動させる移動部と、を有する。また、接合装置は、第１基板を透過する光を用いて、第１基板に形成された第１マークと、第２基板に形成された第２マークとの両方を撮像する撮像ユニットと、撮像ユニットが撮像した撮像情報に基づき移動部を動作させる制御部と、を備える。【選択図】図７</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230119&DB=EPODOC&CC=JP&NR=2023008587A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230119&DB=EPODOC&CC=JP&NR=2023008587A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INAMASU HISASHI</creatorcontrib><title>JOINING DEVICE AND JOINING METHOD</title><description>To provide a technique capable of improving precision of positioning between substrates to be joined together.SOLUTION: A joining device has: a first holding part which holds a first substrate; a second holding part which holds a second substrate; and a moving part which moves at least one of the first holding part and second holding part relatively to the other. The joining device further comprises: an imaging unit which images both a first mark formed on the substrate and a second mark formed on the second substrate using light transmitted through the first substrate; and a control part which places the moving part in operation based upon imaging information obtained by the imaging unit.SELECTED DRAWING: Figure 7
【課題】接合する基板同士の位置合わせの精度を向上させることできる技術を提供する。【解決手段】接合装置は、第１基板を保持する第１保持部と、第２基板を保持する第２保持部と、第１保持部と第２保持部のうち少なくとも一方を他方に対して相対移動させる移動部と、を有する。また、接合装置は、第１基板を透過する光を用いて、第１基板に形成された第１マークと、第２基板に形成された第２マークとの両方を撮像する撮像ユニットと、撮像ユニットが撮像した撮像情報に基づき移動部を動作させる制御部と、を備える。【選択図】図７</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD08vf08_RzV3BxDfN0dlVw9HNRgAn5uoZ4-LvwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjAwMLUwtzR2OiFAEAPzMiYg</recordid><startdate>20230119</startdate><enddate>20230119</enddate><creator>INAMASU HISASHI</creator><scope>EVB</scope></search><sort><creationdate>20230119</creationdate><title>JOINING DEVICE AND JOINING METHOD</title><author>INAMASU HISASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023008587A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>INAMASU HISASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INAMASU HISASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JOINING DEVICE AND JOINING METHOD</title><date>2023-01-19</date><risdate>2023</risdate><abstract>To provide a technique capable of improving precision of positioning between substrates to be joined together.SOLUTION: A joining device has: a first holding part which holds a first substrate; a second holding part which holds a second substrate; and a moving part which moves at least one of the first holding part and second holding part relatively to the other. The joining device further comprises: an imaging unit which images both a first mark formed on the substrate and a second mark formed on the second substrate using light transmitted through the first substrate; and a control part which places the moving part in operation based upon imaging information obtained by the imaging unit.SELECTED DRAWING: Figure 7
【課題】接合する基板同士の位置合わせの精度を向上させることできる技術を提供する。【解決手段】接合装置は、第１基板を保持する第１保持部と、第２基板を保持する第２保持部と、第１保持部と第２保持部のうち少なくとも一方を他方に対して相対移動させる移動部と、を有する。また、接合装置は、第１基板を透過する光を用いて、第１基板に形成された第１マークと、第２基板に形成された第２マークとの両方を撮像する撮像ユニットと、撮像ユニットが撮像した撮像情報に基づき移動部を動作させる制御部と、を備える。【選択図】図７</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | JOINING DEVICE AND JOINING METHOD |
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