COOLING DEVICE
To provide a cooling device that exhibits a higher cooling effect.SOLUTION: A cooling device that cools a semiconductor component mounted on the surface of a substrate, includes a base attached to the back side of the substrate, and a bottom plate spaced from the base, and at a position correspondin...
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| creator | MATSUDA HIROTERU KAWAMIZU TSUTOMU |
| description | To provide a cooling device that exhibits a higher cooling effect.SOLUTION: A cooling device that cools a semiconductor component mounted on the surface of a substrate, includes a base attached to the back side of the substrate, and a bottom plate spaced from the base, and at a position corresponding to the semiconductor component on the bottom plate, an introduction port is formed to guide a coolant from the direction facing the back surface.SELECTED DRAWING: Figure 1
【課題】さらに高い冷却効果を発揮する冷却装置を提供する。【解決手段】基板の表面に実装された半導体部品を冷却する冷却装置であって、基板の裏面に取り付けられたベースと、ベースに離間して配置された底板と、を備え、底板における半導体部品に対応する位置には、裏面に対向する方向から冷媒を導く導入口が形成されている。【選択図】図１ |
| format | Patent |
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【課題】さらに高い冷却効果を発揮する冷却装置を提供する。【解決手段】基板の表面に実装された半導体部品を冷却する冷却装置であって、基板の裏面に取り付けられたベースと、ベースに離間して配置された底板と、を備え、底板における半導体部品に対応する位置には、裏面に対向する方向から冷媒を導く導入口が形成されている。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230118&DB=EPODOC&CC=JP&NR=2023006511A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230118&DB=EPODOC&CC=JP&NR=2023006511A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUDA HIROTERU</creatorcontrib><creatorcontrib>KAWAMIZU TSUTOMU</creatorcontrib><title>COOLING DEVICE</title><description>To provide a cooling device that exhibits a higher cooling effect.SOLUTION: A cooling device that cools a semiconductor component mounted on the surface of a substrate, includes a base attached to the back side of the substrate, and a bottom plate spaced from the base, and at a position corresponding to the semiconductor component on the bottom plate, an introduction port is formed to guide a coolant from the direction facing the back surface.SELECTED DRAWING: Figure 1
【課題】さらに高い冷却効果を発揮する冷却装置を提供する。【解決手段】基板の表面に実装された半導体部品を冷却する冷却装置であって、基板の裏面に取り付けられたベースと、ベースに離間して配置された底板と、を備え、底板における半導体部品に対応する位置には、裏面に対向する方向から冷媒を導く導入口が形成されている。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBz9vf38fRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsYGBmamhoaOxkQpAgD0CR0s</recordid><startdate>20230118</startdate><enddate>20230118</enddate><creator>MATSUDA HIROTERU</creator><creator>KAWAMIZU TSUTOMU</creator><scope>EVB</scope></search><sort><creationdate>20230118</creationdate><title>COOLING DEVICE</title><author>MATSUDA HIROTERU ; KAWAMIZU TSUTOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023006511A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUDA HIROTERU</creatorcontrib><creatorcontrib>KAWAMIZU TSUTOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUDA HIROTERU</au><au>KAWAMIZU TSUTOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING DEVICE</title><date>2023-01-18</date><risdate>2023</risdate><abstract>To provide a cooling device that exhibits a higher cooling effect.SOLUTION: A cooling device that cools a semiconductor component mounted on the surface of a substrate, includes a base attached to the back side of the substrate, and a bottom plate spaced from the base, and at a position corresponding to the semiconductor component on the bottom plate, an introduction port is formed to guide a coolant from the direction facing the back surface.SELECTED DRAWING: Figure 1
【課題】さらに高い冷却効果を発揮する冷却装置を提供する。【解決手段】基板の表面に実装された半導体部品を冷却する冷却装置であって、基板の裏面に取り付けられたベースと、ベースに離間して配置された底板と、を備え、底板における半導体部品に対応する位置には、裏面に対向する方向から冷媒を導く導入口が形成されている。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COOLING DEVICE |
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