COOLING DEVICE

To provide a cooling device with improved cooling efficiency.SOLUTION: A cooling device 100 that cools a semiconductor component 2 mounted on the surface of a substrate 1 includes a base 10 attached to the back surface of the substrate 1, and a bottom plate 12 spaced apart from the base 10. A recess...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUDA HIROTERU, KAWAMIZU TSUTOMU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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