COOLING DEVICE
To provide a cooling device with improved cooling efficiency.SOLUTION: A cooling device 100 that cools a semiconductor component 2 mounted on the surface of a substrate 1 includes a base 10 attached to the back surface of the substrate 1, and a bottom plate 12 spaced apart from the base 10. A recess...
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| creator | MATSUDA HIROTERU KAWAMIZU TSUTOMU |
| description | To provide a cooling device with improved cooling efficiency.SOLUTION: A cooling device 100 that cools a semiconductor component 2 mounted on the surface of a substrate 1 includes a base 10 attached to the back surface of the substrate 1, and a bottom plate 12 spaced apart from the base 10. A recess 10r recessed toward the substrate 1 side is formed in a region corresponding to the semiconductor component 2 on the surface of the base 10 facing the bottom plate 12 side.SELECTED DRAWING: Figure 1
【課題】さらに冷却効率が向上した冷却装置を提供する。【解決手段】基板１の表面に実装された半導体部品２を冷却する冷却装置１００であって、基板１の裏面に取り付けられたベース１０と、ベース１０から離間して配置された底板１２と、を備える。ベース１０における底板１２側を向く面であって、半導体部品２に対応する領域には、基板１側に向かって凹む凹部１０ｒが形成されている。【選択図】図１ |
| format | Patent |
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【課題】さらに冷却効率が向上した冷却装置を提供する。【解決手段】基板１の表面に実装された半導体部品２を冷却する冷却装置１００であって、基板１の裏面に取り付けられたベース１０と、ベース１０から離間して配置された底板１２と、を備える。ベース１０における底板１２側を向く面であって、半導体部品２に対応する領域には、基板１側に向かって凹む凹部１０ｒが形成されている。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230117&DB=EPODOC&CC=JP&NR=2023004080A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230117&DB=EPODOC&CC=JP&NR=2023004080A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUDA HIROTERU</creatorcontrib><creatorcontrib>KAWAMIZU TSUTOMU</creatorcontrib><title>COOLING DEVICE</title><description>To provide a cooling device with improved cooling efficiency.SOLUTION: A cooling device 100 that cools a semiconductor component 2 mounted on the surface of a substrate 1 includes a base 10 attached to the back surface of the substrate 1, and a bottom plate 12 spaced apart from the base 10. A recess 10r recessed toward the substrate 1 side is formed in a region corresponding to the semiconductor component 2 on the surface of the base 10 facing the bottom plate 12 side.SELECTED DRAWING: Figure 1
【課題】さらに冷却効率が向上した冷却装置を提供する。【解決手段】基板１の表面に実装された半導体部品２を冷却する冷却装置１００であって、基板１の裏面に取り付けられたベース１０と、ベース１０から離間して配置された底板１２と、を備える。ベース１０における底板１２側を向く面であって、半導体部品２に対応する領域には、基板１側に向かって凹む凹部１０ｒが形成されている。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBz9vf38fRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsYGBiYGFgaOxkQpAgDzzB0q</recordid><startdate>20230117</startdate><enddate>20230117</enddate><creator>MATSUDA HIROTERU</creator><creator>KAWAMIZU TSUTOMU</creator><scope>EVB</scope></search><sort><creationdate>20230117</creationdate><title>COOLING DEVICE</title><author>MATSUDA HIROTERU ; KAWAMIZU TSUTOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023004080A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUDA HIROTERU</creatorcontrib><creatorcontrib>KAWAMIZU TSUTOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUDA HIROTERU</au><au>KAWAMIZU TSUTOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING DEVICE</title><date>2023-01-17</date><risdate>2023</risdate><abstract>To provide a cooling device with improved cooling efficiency.SOLUTION: A cooling device 100 that cools a semiconductor component 2 mounted on the surface of a substrate 1 includes a base 10 attached to the back surface of the substrate 1, and a bottom plate 12 spaced apart from the base 10. A recess 10r recessed toward the substrate 1 side is formed in a region corresponding to the semiconductor component 2 on the surface of the base 10 facing the bottom plate 12 side.SELECTED DRAWING: Figure 1
【課題】さらに冷却効率が向上した冷却装置を提供する。【解決手段】基板１の表面に実装された半導体部品２を冷却する冷却装置１００であって、基板１の裏面に取り付けられたベース１０と、ベース１０から離間して配置された底板１２と、を備える。ベース１０における底板１２側を向く面であって、半導体部品２に対応する領域には、基板１側に向かって凹む凹部１０ｒが形成されている。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COOLING DEVICE |
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