COPPER POWDER AND CONDUCTIVE COMPOSITION COMPRISING THE SAME, AND WIRING STRUCTURE COMPRISING THE SAME AND METHOD FOR PRODUCING CONDUCTIVE MEMBER USING THE SAME
To provide copper powder having superior low-temperature sinterability.SOLUTION: Copper powder comprises aggregate of copper particles predominantly composed of copper and comprising a second element, which is at least one of nickel element and cobalt element. A1/S1 is 0.05 atom%/(m2/g) or more, whi...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide copper powder having superior low-temperature sinterability.SOLUTION: Copper powder comprises aggregate of copper particles predominantly composed of copper and comprising a second element, which is at least one of nickel element and cobalt element. A1/S1 is 0.05 atom%/(m2/g) or more, which is the ratio of the content A1 of the second element measured by X-ray photoelectron spectroscopy to a BET specific surface area S1 of copper powder. The content T1 of the second element measured by ICP emission spectroscopy is 0.001 mass% or more and 0.30 mass% or less. There is also provided a conductive composition containing the copper powder as well as a dispersion medium.SELECTED DRAWING: None
【課題】低温焼結性に優れる銅粉末を提供すること。【解決手段】銅粉末は、銅元素を主体として含み、且つニッケル元素及びコバルト元素のうち少なくとも一種から選ばれる第2元素を含む銅粒子の集合体からなる。銅粉末のBET比表面積S1に対する、X線光電子分光分析によって測定された第2元素の含有量A1の比(A1/S1)が0.05原子%/(m2/g)以上である。ICP発光分光分析によって測定された第2元素の含有量T1が0.001質量%以上0.30質量%以下である。銅粉末と分散媒とを含む導電性組成物も提供する。【選択図】なし |
---|