CUTTING DEVICE AND CUTTING METHOD
To provide a new technique for enabling a cutting blade to be accurately set up, by removing chips adhering onto an inspection piece.SOLUTION: A cutting device 2 comprises: a holding table 16 on which a work-piece is held; a cutting unit 26 having a spindle 48 to which a cutting blade 50 that cuts t...
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| creator | KOMATSU ATSUSHI MINATO KOKICHI |
| description | To provide a new technique for enabling a cutting blade to be accurately set up, by removing chips adhering onto an inspection piece.SOLUTION: A cutting device 2 comprises: a holding table 16 on which a work-piece is held; a cutting unit 26 having a spindle 48 to which a cutting blade 50 that cuts the work-piece held on the holding table 16 is attached; an inspection-piece table 70 which holds an inspection piece 78 that forms a notched/cut trace 75 using the cutting blade 50; a photographing camera 29 that photographs the cut trace 75 formed in the inspection piece 78; and a cleaning liquid supply nozzle 74 that supplies cleaning liquid to the inspection piece 78 held on the inspection-piece table 70.SELECTED DRAWING: Figure 2
【課題】 検査片上に付着する切削屑を除去することで、切削ブレードのセットアップを正確に行うことを可能とするための新規な技術を提供する。【解決手段】被加工物を保持する保持テーブル１６と、該保持テーブル１６で保持された被加工物を切削する切削ブレード５０が装着されるスピンドル４８を有した切削ユニット２６と、該切削ブレード５０で切り込み切削痕７５を形成する検査片７８を保持する検査片用テーブル７０と、該検査片７８に形成された該切削痕７５を撮像する撮像カメラ２９と、を備えた切削装置２であって、該検査片用テーブル７０で保持された検査片７８に洗浄液を供給する洗浄液供給ノズル７４を備えた切削装置とする。【選択図】図２ |
| format | Patent |
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【課題】 検査片上に付着する切削屑を除去することで、切削ブレードのセットアップを正確に行うことを可能とするための新規な技術を提供する。【解決手段】被加工物を保持する保持テーブル１６と、該保持テーブル１６で保持された被加工物を切削する切削ブレード５０が装着されるスピンドル４８を有した切削ユニット２６と、該切削ブレード５０で切り込み切削痕７５を形成する検査片７８を保持する検査片用テーブル７０と、該検査片７８に形成された該切削痕７５を撮像する撮像カメラ２９と、を備えた切削装置２であって、該検査片用テーブル７０で保持された検査片７８に洗浄液を供給する洗浄液供給ノズル７４を備えた切削装置とする。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221206&DB=EPODOC&CC=JP&NR=2022180024A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221206&DB=EPODOC&CC=JP&NR=2022180024A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOMATSU ATSUSHI</creatorcontrib><creatorcontrib>MINATO KOKICHI</creatorcontrib><title>CUTTING DEVICE AND CUTTING METHOD</title><description>To provide a new technique for enabling a cutting blade to be accurately set up, by removing chips adhering onto an inspection piece.SOLUTION: A cutting device 2 comprises: a holding table 16 on which a work-piece is held; a cutting unit 26 having a spindle 48 to which a cutting blade 50 that cuts the work-piece held on the holding table 16 is attached; an inspection-piece table 70 which holds an inspection piece 78 that forms a notched/cut trace 75 using the cutting blade 50; a photographing camera 29 that photographs the cut trace 75 formed in the inspection piece 78; and a cleaning liquid supply nozzle 74 that supplies cleaning liquid to the inspection piece 78 held on the inspection-piece table 70.SELECTED DRAWING: Figure 2
【課題】 検査片上に付着する切削屑を除去することで、切削ブレードのセットアップを正確に行うことを可能とするための新規な技術を提供する。【解決手段】被加工物を保持する保持テーブル１６と、該保持テーブル１６で保持された被加工物を切削する切削ブレード５０が装着されるスピンドル４８を有した切削ユニット２６と、該切削ブレード５０で切り込み切削痕７５を形成する検査片７８を保持する検査片用テーブル７０と、該検査片７８に形成された該切削痕７５を撮像する撮像カメラ２９と、を備えた切削装置２であって、該検査片用テーブル７０で保持された検査片７８に洗浄液を供給する洗浄液供給ノズル７４を備えた切削装置とする。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB0Dg0J8fRzV3BxDfN0dlVw9HNRgAn5uoZ4-LvwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyMjQwsDAyMTR2OiFAEASpsiZg</recordid><startdate>20221206</startdate><enddate>20221206</enddate><creator>KOMATSU ATSUSHI</creator><creator>MINATO KOKICHI</creator><scope>EVB</scope></search><sort><creationdate>20221206</creationdate><title>CUTTING DEVICE AND CUTTING METHOD</title><author>KOMATSU ATSUSHI ; MINATO KOKICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022180024A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KOMATSU ATSUSHI</creatorcontrib><creatorcontrib>MINATO KOKICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOMATSU ATSUSHI</au><au>MINATO KOKICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CUTTING DEVICE AND CUTTING METHOD</title><date>2022-12-06</date><risdate>2022</risdate><abstract>To provide a new technique for enabling a cutting blade to be accurately set up, by removing chips adhering onto an inspection piece.SOLUTION: A cutting device 2 comprises: a holding table 16 on which a work-piece is held; a cutting unit 26 having a spindle 48 to which a cutting blade 50 that cuts the work-piece held on the holding table 16 is attached; an inspection-piece table 70 which holds an inspection piece 78 that forms a notched/cut trace 75 using the cutting blade 50; a photographing camera 29 that photographs the cut trace 75 formed in the inspection piece 78; and a cleaning liquid supply nozzle 74 that supplies cleaning liquid to the inspection piece 78 held on the inspection-piece table 70.SELECTED DRAWING: Figure 2
【課題】 検査片上に付着する切削屑を除去することで、切削ブレードのセットアップを正確に行うことを可能とするための新規な技術を提供する。【解決手段】被加工物を保持する保持テーブル１６と、該保持テーブル１６で保持された被加工物を切削する切削ブレード５０が装着されるスピンドル４８を有した切削ユニット２６と、該切削ブレード５０で切り込み切削痕７５を形成する検査片７８を保持する検査片用テーブル７０と、該検査片７８に形成された該切削痕７５を撮像する撮像カメラ２９と、を備えた切削装置２であって、該検査片用テーブル７０で保持された検査片７８に洗浄液を供給する洗浄液供給ノズル７４を備えた切削装置とする。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | CUTTING DEVICE AND CUTTING METHOD |
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