THERMALLY CONDUCTIVE SHEET
To provide a thermally conductive sheet which has low thermal resistance and high reworkability.SOLUTION: There is provided a thermally conductive sheet which has at least two thermal conductive layers containing an acrylic adhesive and a thermally conductive filler on a graphite sheet, wherein the...
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| creator | YOSHIKI TAKENOBU |
| description | To provide a thermally conductive sheet which has low thermal resistance and high reworkability.SOLUTION: There is provided a thermally conductive sheet which has at least two thermal conductive layers containing an acrylic adhesive and a thermally conductive filler on a graphite sheet, wherein the volume ratio occupied by the thermally conductive filler in the first thermal conductive layer on the side closest to the graphite sheet is smaller than the volume ratio occupied by the thermally conductive filler in the second thermal conductive layer on the side farthest from the graphite sheet, the volume ratio occupied by the thermally conductive filler in the first thermal conductive layer is 30 vol% or less and the total thickness of the first thermal conductive layer and the second thermal conductive layer is 25 μm or less.SELECTED DRAWING: Figure 1
【課題】熱抵抗が低く、かつリワーク性の高い熱伝導性シートを提供する。【解決手段】グラファイトシート上に、アクリル粘着剤および熱伝導性フィラーを含有する熱伝導層を少なくとも２層有する熱伝導性シートであり、該グラファイトシートに最も近い側の第一の熱伝導層における熱伝導性フィラーの占める体積割合が、該グラファイトシートから最も遠い側の第二の熱伝導層における熱伝導性フィラーの占める体積割合より小さく、且つ、該第一の熱伝導層における熱伝導性フィラーの占める体積割合が３０体積％以下であり、さらに該第一の熱伝導層と該第二の熱伝導層の合計厚みが２５μｍ以下である。【選択図】図１ |
| format | Patent |
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【課題】熱抵抗が低く、かつリワーク性の高い熱伝導性シートを提供する。【解決手段】グラファイトシート上に、アクリル粘着剤および熱伝導性フィラーを含有する熱伝導層を少なくとも２層有する熱伝導性シートであり、該グラファイトシートに最も近い側の第一の熱伝導層における熱伝導性フィラーの占める体積割合が、該グラファイトシートから最も遠い側の第二の熱伝導層における熱伝導性フィラーの占める体積割合より小さく、且つ、該第一の熱伝導層における熱伝導性フィラーの占める体積割合が３０体積％以下であり、さらに該第一の熱伝導層と該第二の熱伝導層の合計厚みが２５μｍ以下である。【選択図】図１</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221110&DB=EPODOC&CC=JP&NR=2022169994A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221110&DB=EPODOC&CC=JP&NR=2022169994A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIKI TAKENOBU</creatorcontrib><title>THERMALLY CONDUCTIVE SHEET</title><description>To provide a thermally conductive sheet which has low thermal resistance and high reworkability.SOLUTION: There is provided a thermally conductive sheet which has at least two thermal conductive layers containing an acrylic adhesive and a thermally conductive filler on a graphite sheet, wherein the volume ratio occupied by the thermally conductive filler in the first thermal conductive layer on the side closest to the graphite sheet is smaller than the volume ratio occupied by the thermally conductive filler in the second thermal conductive layer on the side farthest from the graphite sheet, the volume ratio occupied by the thermally conductive filler in the first thermal conductive layer is 30 vol% or less and the total thickness of the first thermal conductive layer and the second thermal conductive layer is 25 μm or less.SELECTED DRAWING: Figure 1
【課題】熱抵抗が低く、かつリワーク性の高い熱伝導性シートを提供する。【解決手段】グラファイトシート上に、アクリル粘着剤および熱伝導性フィラーを含有する熱伝導層を少なくとも２層有する熱伝導性シートであり、該グラファイトシートに最も近い側の第一の熱伝導層における熱伝導性フィラーの占める体積割合が、該グラファイトシートから最も遠い側の第二の熱伝導層における熱伝導性フィラーの占める体積割合より小さく、且つ、該第一の熱伝導層における熱伝導性フィラーの占める体積割合が３０体積％以下であり、さらに該第一の熱伝導層と該第二の熱伝導層の合計厚みが２５μｍ以下である。【選択図】図１</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAK8XAN8nX08YlUcPb3cwl1DvEMc1UI9nB1DeFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRkaGZpaWliaOxkQpAgCCnCDs</recordid><startdate>20221110</startdate><enddate>20221110</enddate><creator>YOSHIKI TAKENOBU</creator><scope>EVB</scope></search><sort><creationdate>20221110</creationdate><title>THERMALLY CONDUCTIVE SHEET</title><author>YOSHIKI TAKENOBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022169994A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIKI TAKENOBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIKI TAKENOBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMALLY CONDUCTIVE SHEET</title><date>2022-11-10</date><risdate>2022</risdate><abstract>To provide a thermally conductive sheet which has low thermal resistance and high reworkability.SOLUTION: There is provided a thermally conductive sheet which has at least two thermal conductive layers containing an acrylic adhesive and a thermally conductive filler on a graphite sheet, wherein the volume ratio occupied by the thermally conductive filler in the first thermal conductive layer on the side closest to the graphite sheet is smaller than the volume ratio occupied by the thermally conductive filler in the second thermal conductive layer on the side farthest from the graphite sheet, the volume ratio occupied by the thermally conductive filler in the first thermal conductive layer is 30 vol% or less and the total thickness of the first thermal conductive layer and the second thermal conductive layer is 25 μm or less.SELECTED DRAWING: Figure 1
【課題】熱抵抗が低く、かつリワーク性の高い熱伝導性シートを提供する。【解決手段】グラファイトシート上に、アクリル粘着剤および熱伝導性フィラーを含有する熱伝導層を少なくとも２層有する熱伝導性シートであり、該グラファイトシートに最も近い側の第一の熱伝導層における熱伝導性フィラーの占める体積割合が、該グラファイトシートから最も遠い側の第二の熱伝導層における熱伝導性フィラーの占める体積割合より小さく、且つ、該第一の熱伝導層における熱伝導性フィラーの占める体積割合が３０体積％以下であり、さらに該第一の熱伝導層と該第二の熱伝導層の合計厚みが２５μｍ以下である。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | THERMALLY CONDUCTIVE SHEET |
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