CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide a curable resin composition that allows reduced adhesion between its resultant cured products that are stacked and stored.SOLUTION: A curable resin composition contains (A) an alkali-soluble polyimide resin, (B) a cellulose derivative, (C) a thermosetting compound, and (D) a photo-base ge...

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Bibliographische Detailangaben
Hauptverfasser:	KOIKE NAOYUKI, YONEDA KAZUYOSHI, YOKOYAMA YUTAKA, MIYABE HIDEKAZU, ODAGIRI YUTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a curable resin composition that allows reduced adhesion between its resultant cured products that are stacked and stored.SOLUTION: A curable resin composition contains (A) an alkali-soluble polyimide resin, (B) a cellulose derivative, (C) a thermosetting compound, and (D) a photo-base generator. Cured products of the curable resin composition show reduced adhesion between them when stored in a stacked manner.SELECTED DRAWING: None 【課題】得られた硬化物を積み重ねて保管した場合に貼り付きが小さい特性を有する硬化性樹脂組成物を提供すること【解決手段】（Ａ）アルカリ溶解性のポリイミド樹脂と、（Ｂ）セルロース誘導体と、（Ｃ）熱硬化性化合物と、（Ｄ）光塩基発生剤とを含有する硬化性樹脂組成物である。本発明の硬化性組成物により得られた硬化物は、積み重ねて保管した場合に貼り付きが小さい特性を有する。【選択図】なし