FLUX FOR FLUX-COATED SOLDER PREFORM, FLUX-COATED SOLDER PREFORM, AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ON ELECTRONIC SUBSTRATE

To provide a flux for a flux-coated solder preform, a flux-coated solder preform, and a method for mounting an electronic component on an electronic substrate including the flux-coated solder preform, such that good workability is ensured when the flux-coated solder preform is pulled out from a reel...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAOKA MIYUKI, KIMURA SHINJI, MURAOKA MANABU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a flux for a flux-coated solder preform, a flux-coated solder preform, and a method for mounting an electronic component on an electronic substrate including the flux-coated solder preform, such that good workability is ensured when the flux-coated solder preform is pulled out from a reel, and misalignment of an electronic component does not occur during reflow soldering.SOLUTION: A flux for a flux-coated solder preform is provided, the flux having a softening temperature of 80 to 120°C.SELECTED DRAWING: Figure 1 【課題】本発明は、リールからフラックスコートはんだプリフォームを引き出す際の作業性が良好であり、かつリフローソルダリング時に電子部品の位置ずれが発生しない、フラックスコートはんだプリフォーム用フラックス、フラックスコートはんだプリフォーム、及び当該フラックスコートはんだプリフォームを使用した電子基板に電子部品を実装する方法を提供することを目的とする。【解決手段】フラックスコートはんだプリフォーム用フラックスであって、前記フラックスの軟化点が８０～１２０℃である、前記フラックス。【選択図】図１