WIRING BOARD
To provide other technologies for suppressing the generation of cracks in an oxide film layer on a wiring board having a base material made of a metallic material mainly composed of aluminum and an oxide film layer formed on the surface of the base material.SOLUTION: A wiring board has a base materi...
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| creator | SAITO YUKI KITO NAOKI USHIDA TAKAHISA |
| description | To provide other technologies for suppressing the generation of cracks in an oxide film layer on a wiring board having a base material made of a metallic material mainly composed of aluminum and an oxide film layer formed on the surface of the base material.SOLUTION: A wiring board has a base material having a first main surface and made of a metallic material mainly composed of aluminum (Al), an oxide film layer that is an anodic oxide film of the metallic material and formed on the first main surface of the base material, and wiring portion having conductivity and formed on the oxide film layer, and in plan view of the first main surface, the oxide film layer is formed inside the periphery of the first main surface at a distance from the periphery.SELECTED DRAWING: Figure 1
【課題】アルミニウムを主成分とする金属材料から成る基材と、基材表面上に形成された酸化被膜層を有する配線基板において、酸化被膜層のクラックの発生を抑制する他の技術を提供する。【解決手段】配線基板は、第１主面を備え、アルミニウム（Ａｌ）を主成分とする金属材料から成る基材と、金属材料の陽極酸化被膜であり、基材の第１主面上に形成された酸化被膜層と、導電性を有し、酸化被膜層の上に形成された配線部と、を備え、第１主面の平面視で、酸化被膜層は、第１主面の周縁から距離を空けて周縁の内側に形成されている。【選択図】図１ |
| format | Patent |
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【課題】アルミニウムを主成分とする金属材料から成る基材と、基材表面上に形成された酸化被膜層を有する配線基板において、酸化被膜層のクラックの発生を抑制する他の技術を提供する。【解決手段】配線基板は、第１主面を備え、アルミニウム（Ａｌ）を主成分とする金属材料から成る基材と、金属材料の陽極酸化被膜であり、基材の第１主面上に形成された酸化被膜層と、導電性を有し、酸化被膜層の上に形成された配線部と、を備え、第１主面の平面視で、酸化被膜層は、第１主面の周縁から距離を空けて周縁の内側に形成されている。【選択図】図１</description><language>eng ; jpn</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220926&DB=EPODOC&CC=JP&NR=2022139648A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220926&DB=EPODOC&CC=JP&NR=2022139648A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAITO YUKI</creatorcontrib><creatorcontrib>KITO NAOKI</creatorcontrib><creatorcontrib>USHIDA TAKAHISA</creatorcontrib><title>WIRING BOARD</title><description>To provide other technologies for suppressing the generation of cracks in an oxide film layer on a wiring board having a base material made of a metallic material mainly composed of aluminum and an oxide film layer formed on the surface of the base material.SOLUTION: A wiring board has a base material having a first main surface and made of a metallic material mainly composed of aluminum (Al), an oxide film layer that is an anodic oxide film of the metallic material and formed on the first main surface of the base material, and wiring portion having conductivity and formed on the oxide film layer, and in plan view of the first main surface, the oxide film layer is formed inside the periphery of the first main surface at a distance from the periphery.SELECTED DRAWING: Figure 1
【課題】アルミニウムを主成分とする金属材料から成る基材と、基材表面上に形成された酸化被膜層を有する配線基板において、酸化被膜層のクラックの発生を抑制する他の技術を提供する。【解決手段】配線基板は、第１主面を備え、アルミニウム（Ａｌ）を主成分とする金属材料から成る基材と、金属材料の陽極酸化被膜であり、基材の第１主面上に形成された酸化被膜層と、導電性を有し、酸化被膜層の上に形成された配線部と、を備え、第１主面の平面視で、酸化被膜層は、第１主面の周縁から距離を空けて周縁の内側に形成されている。【選択図】図１</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAJ9wzy9HNXcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkZGhsaWZiYWjsZEKQIAwRQcyQ</recordid><startdate>20220926</startdate><enddate>20220926</enddate><creator>SAITO YUKI</creator><creator>KITO NAOKI</creator><creator>USHIDA TAKAHISA</creator><scope>EVB</scope></search><sort><creationdate>20220926</creationdate><title>WIRING BOARD</title><author>SAITO YUKI ; KITO NAOKI ; USHIDA TAKAHISA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022139648A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAITO YUKI</creatorcontrib><creatorcontrib>KITO NAOKI</creatorcontrib><creatorcontrib>USHIDA TAKAHISA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAITO YUKI</au><au>KITO NAOKI</au><au>USHIDA TAKAHISA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING BOARD</title><date>2022-09-26</date><risdate>2022</risdate><abstract>To provide other technologies for suppressing the generation of cracks in an oxide film layer on a wiring board having a base material made of a metallic material mainly composed of aluminum and an oxide film layer formed on the surface of the base material.SOLUTION: A wiring board has a base material having a first main surface and made of a metallic material mainly composed of aluminum (Al), an oxide film layer that is an anodic oxide film of the metallic material and formed on the first main surface of the base material, and wiring portion having conductivity and formed on the oxide film layer, and in plan view of the first main surface, the oxide film layer is formed inside the periphery of the first main surface at a distance from the periphery.SELECTED DRAWING: Figure 1
【課題】アルミニウムを主成分とする金属材料から成る基材と、基材表面上に形成された酸化被膜層を有する配線基板において、酸化被膜層のクラックの発生を抑制する他の技術を提供する。【解決手段】配線基板は、第１主面を備え、アルミニウム（Ａｌ）を主成分とする金属材料から成る基材と、金属材料の陽極酸化被膜であり、基材の第１主面上に形成された酸化被膜層と、導電性を有し、酸化被膜層の上に形成された配線部と、を備え、第１主面の平面視で、酸化被膜層は、第１主面の周縁から距離を空けて周縁の内側に形成されている。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | WIRING BOARD |
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