LASER BEAM MACHINING METHOD
To provide a laser beam machining method in which a tapered shape is unlikely to be formed when forming a through hole in a printed circuit board.SOLUTION: A laser beam machining method includes: a first drilling step to form a penetrated discharge hole having a smaller diameter than a target hole d...
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| creator | ITO YASUSHI ITAMI KATSUHIRO |
| description | To provide a laser beam machining method in which a tapered shape is unlikely to be formed when forming a through hole in a printed circuit board.SOLUTION: A laser beam machining method includes: a first drilling step to form a penetrated discharge hole having a smaller diameter than a target hole diameter from one surface of a printed circuit board as a workpiece subjected to processing; a diameter-expanding step to expand the diameter of the discharge hole from above-mentioned one surface down to a midway of the printed circuit board in the direction of the board thickness; and a second drilling step to form a through hole having the target hole diameter from the other surface of the printed circuit board, with machining chips being sucked out through the discharge hole from the one surface of the printed circuit board during the second drilling step.SELECTED DRAWING: Figure 4
【課題】プリント基板に貫通穴を形成する際に、テーパを生じさせにくくするレーザ加工方法を提供する。【解決手段】被加工物であるプリント基板の、一方の面から目標穴径よりも小さい径で貫通した排出穴をあける第一穴明け工程と、前記プリント基板の前記一方の面から板厚方向の途中まで、前記排出穴を拡径する拡径工程と、前記プリント基板の他方の面から、目標穴径の貫通穴をあける第二穴明け工程とを備え、前記第二穴あけ工程において、前記プリント基板の前記一方の面から、前記排出穴を通じて加工屑を吸引する。【選択図】図４ |
| format | Patent |
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【課題】プリント基板に貫通穴を形成する際に、テーパを生じさせにくくするレーザ加工方法を提供する。【解決手段】被加工物であるプリント基板の、一方の面から目標穴径よりも小さい径で貫通した排出穴をあける第一穴明け工程と、前記プリント基板の前記一方の面から板厚方向の途中まで、前記排出穴を拡径する拡径工程と、前記プリント基板の他方の面から、目標穴径の貫通穴をあける第二穴明け工程とを備え、前記第二穴あけ工程において、前記プリント基板の前記一方の面から、前記排出穴を通じて加工屑を吸引する。【選択図】図４</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220926&DB=EPODOC&CC=JP&NR=2022139427A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220926&DB=EPODOC&CC=JP&NR=2022139427A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITO YASUSHI</creatorcontrib><creatorcontrib>ITAMI KATSUHIRO</creatorcontrib><title>LASER BEAM MACHINING METHOD</title><description>To provide a laser beam machining method in which a tapered shape is unlikely to be formed when forming a through hole in a printed circuit board.SOLUTION: A laser beam machining method includes: a first drilling step to form a penetrated discharge hole having a smaller diameter than a target hole diameter from one surface of a printed circuit board as a workpiece subjected to processing; a diameter-expanding step to expand the diameter of the discharge hole from above-mentioned one surface down to a midway of the printed circuit board in the direction of the board thickness; and a second drilling step to form a through hole having the target hole diameter from the other surface of the printed circuit board, with machining chips being sucked out through the discharge hole from the one surface of the printed circuit board during the second drilling step.SELECTED DRAWING: Figure 4
【課題】プリント基板に貫通穴を形成する際に、テーパを生じさせにくくするレーザ加工方法を提供する。【解決手段】被加工物であるプリント基板の、一方の面から目標穴径よりも小さい径で貫通した排出穴をあける第一穴明け工程と、前記プリント基板の前記一方の面から板厚方向の途中まで、前記排出穴を拡径する拡径工程と、前記プリント基板の他方の面から、目標穴径の貫通穴をあける第二穴明け工程とを備え、前記第二穴あけ工程において、前記プリント基板の前記一方の面から、前記排出穴を通じて加工屑を吸引する。【選択図】図４</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD2cQx2DVJwcnX0VfB1dPbw9PP0c1fwdQ3x8HfhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkZGhsaWJkbmjsZEKQIAdBUgsQ</recordid><startdate>20220926</startdate><enddate>20220926</enddate><creator>ITO YASUSHI</creator><creator>ITAMI KATSUHIRO</creator><scope>EVB</scope></search><sort><creationdate>20220926</creationdate><title>LASER BEAM MACHINING METHOD</title><author>ITO YASUSHI ; ITAMI KATSUHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022139427A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ITO YASUSHI</creatorcontrib><creatorcontrib>ITAMI KATSUHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITO YASUSHI</au><au>ITAMI KATSUHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER BEAM MACHINING METHOD</title><date>2022-09-26</date><risdate>2022</risdate><abstract>To provide a laser beam machining method in which a tapered shape is unlikely to be formed when forming a through hole in a printed circuit board.SOLUTION: A laser beam machining method includes: a first drilling step to form a penetrated discharge hole having a smaller diameter than a target hole diameter from one surface of a printed circuit board as a workpiece subjected to processing; a diameter-expanding step to expand the diameter of the discharge hole from above-mentioned one surface down to a midway of the printed circuit board in the direction of the board thickness; and a second drilling step to form a through hole having the target hole diameter from the other surface of the printed circuit board, with machining chips being sucked out through the discharge hole from the one surface of the printed circuit board during the second drilling step.SELECTED DRAWING: Figure 4
【課題】プリント基板に貫通穴を形成する際に、テーパを生じさせにくくするレーザ加工方法を提供する。【解決手段】被加工物であるプリント基板の、一方の面から目標穴径よりも小さい径で貫通した排出穴をあける第一穴明け工程と、前記プリント基板の前記一方の面から板厚方向の途中まで、前記排出穴を拡径する拡径工程と、前記プリント基板の他方の面から、目標穴径の貫通穴をあける第二穴明け工程とを備え、前記第二穴あけ工程において、前記プリント基板の前記一方の面から、前記排出穴を通じて加工屑を吸引する。【選択図】図４</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER BEAM MACHINING METHOD |
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