ACOUSTIC WAVE DEVICE, MODULE INCLUDING ACOUSTIC WAVE DEVICE, AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE

To provide an acoustic wave device capable of reducing a mounting area, a module including the acoustic wave device, and a method for manufacturing the acoustic wave device.SOLUTION: An acoustic wave device 1 includes a wiring board 3, a first device chip 5a electrically connected to the wiring board via a first conductive member 15 (bump), and a second device chip 5b electrically connected to the wiring board through a second conductive member 16 (pillar). The second conductive member is higher than the lamination height of the first conductive member and the first device chip.SELECTED DRAWING: Figure 2 【課題】実装面積を小さくすることができる弾性波デバイス、弾性波デバイスを備えるモジュール及び弾性波デバイスの製造方法を提供する。【解決手段】弾性波デバイス１は、配線基板３と、配線基板と第１導電性部材１５（バンプ）を介して電気的に接続された第１デバイスチップ５ａと、配線基板と第２導電性部材１６（ピラー）を介して電気的に接続された第２デバイスチップ５ｂと、を備える。第２導電性部材は、第１導電性部材と第１デバイスチップとの積層高さよりも高い。【選択図】図２