CRACK DETECTION DEVICE AND METHOD
To provide a crack detection device and method with which it is possible to accurately detect the position of an underside of a workpiece even when the position is where a crack exists.SOLUTION: A crack detection device 10 for detecting the crack depth of a crack formed inside a workpiece, comprises...
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| creator | NAGAI RYUTARO |
| description | To provide a crack detection device and method with which it is possible to accurately detect the position of an underside of a workpiece even when the position is where a crack exists.SOLUTION: A crack detection device 10 for detecting the crack depth of a crack formed inside a workpiece, comprises: a refractive index acquisition unit 521 for acquiring the real refractive index of the workpiece; an upper surface detection unit 522 for detecting the upper surface height position of the workpiece in which the crack is formed, on the basis of reflected light of detection light having been reflected by the workpiece when the workpiece is irradiated with detection light; an undersurface detection unit 522 for detecting the undersurface height position of the workpiece, on the basis of the real refractive index acquired by the refractive index acquisition unit 521 and the upper surface height position detected by the upper surface detection unit 522; and a crack detection unit 524 for detecting the crack depth of the crack formed inside the workpiece, with respect to the undersurface height position detected by the undersurface detection unit 522 taken as a reference position.SELECTED DRAWING: Figure 10
【課題】亀裂がある位置であっても、被加工物の下面の位置を正確に検出することができる亀裂検出装置及び方法を提供する。【解決手段】 被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出装置１０は、被加工物の実質屈折率を取得する屈折率取得部５２１と、被加工物に検出光を照射したときに被加工物にて反射された検出光の反射光に基づき、亀裂が形成された被加工物の上面高さ位置を検出する上面検出部５２２と、屈折率取得部５２１が取得した実質屈折率と上面検出部５２２が検出した上面高さ位置とに基づき、被加工物の下面高さ位置を検出する下面検出部５２２と、下面検出部５２２が検出した下面高さ位置を基準位置として、被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出部５２４と、を備える。【選択図】図１０ |
| format | Patent |
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【課題】亀裂がある位置であっても、被加工物の下面の位置を正確に検出することができる亀裂検出装置及び方法を提供する。【解決手段】 被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出装置１０は、被加工物の実質屈折率を取得する屈折率取得部５２１と、被加工物に検出光を照射したときに被加工物にて反射された検出光の反射光に基づき、亀裂が形成された被加工物の上面高さ位置を検出する上面検出部５２２と、屈折率取得部５２１が取得した実質屈折率と上面検出部５２２が検出した上面高さ位置とに基づき、被加工物の下面高さ位置を検出する下面検出部５２２と、下面検出部５２２が検出した下面高さ位置を基準位置として、被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出部５２４と、を備える。【選択図】図１０</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220810&DB=EPODOC&CC=JP&NR=2022117056A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220810&DB=EPODOC&CC=JP&NR=2022117056A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAI RYUTARO</creatorcontrib><title>CRACK DETECTION DEVICE AND METHOD</title><description>To provide a crack detection device and method with which it is possible to accurately detect the position of an underside of a workpiece even when the position is where a crack exists.SOLUTION: A crack detection device 10 for detecting the crack depth of a crack formed inside a workpiece, comprises: a refractive index acquisition unit 521 for acquiring the real refractive index of the workpiece; an upper surface detection unit 522 for detecting the upper surface height position of the workpiece in which the crack is formed, on the basis of reflected light of detection light having been reflected by the workpiece when the workpiece is irradiated with detection light; an undersurface detection unit 522 for detecting the undersurface height position of the workpiece, on the basis of the real refractive index acquired by the refractive index acquisition unit 521 and the upper surface height position detected by the upper surface detection unit 522; and a crack detection unit 524 for detecting the crack depth of the crack formed inside the workpiece, with respect to the undersurface height position detected by the undersurface detection unit 522 taken as a reference position.SELECTED DRAWING: Figure 10
【課題】亀裂がある位置であっても、被加工物の下面の位置を正確に検出することができる亀裂検出装置及び方法を提供する。【解決手段】 被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出装置１０は、被加工物の実質屈折率を取得する屈折率取得部５２１と、被加工物に検出光を照射したときに被加工物にて反射された検出光の反射光に基づき、亀裂が形成された被加工物の上面高さ位置を検出する上面検出部５２２と、屈折率取得部５２１が取得した実質屈折率と上面検出部５２２が検出した上面高さ位置とに基づき、被加工物の下面高さ位置を検出する下面検出部５２２と、下面検出部５２２が検出した下面高さ位置を基準位置として、被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出部５２４と、を備える。【選択図】図１０</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB0DnJ09lZwcQ1xdQ7x9PcDssI8nV0VHP1cFHxdQzz8XXgYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkZGhobmBqZmjMVGKADMlIjc</recordid><startdate>20220810</startdate><enddate>20220810</enddate><creator>NAGAI RYUTARO</creator><scope>EVB</scope></search><sort><creationdate>20220810</creationdate><title>CRACK DETECTION DEVICE AND METHOD</title><author>NAGAI RYUTARO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022117056A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAI RYUTARO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAI RYUTARO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CRACK DETECTION DEVICE AND METHOD</title><date>2022-08-10</date><risdate>2022</risdate><abstract>To provide a crack detection device and method with which it is possible to accurately detect the position of an underside of a workpiece even when the position is where a crack exists.SOLUTION: A crack detection device 10 for detecting the crack depth of a crack formed inside a workpiece, comprises: a refractive index acquisition unit 521 for acquiring the real refractive index of the workpiece; an upper surface detection unit 522 for detecting the upper surface height position of the workpiece in which the crack is formed, on the basis of reflected light of detection light having been reflected by the workpiece when the workpiece is irradiated with detection light; an undersurface detection unit 522 for detecting the undersurface height position of the workpiece, on the basis of the real refractive index acquired by the refractive index acquisition unit 521 and the upper surface height position detected by the upper surface detection unit 522; and a crack detection unit 524 for detecting the crack depth of the crack formed inside the workpiece, with respect to the undersurface height position detected by the undersurface detection unit 522 taken as a reference position.SELECTED DRAWING: Figure 10
【課題】亀裂がある位置であっても、被加工物の下面の位置を正確に検出することができる亀裂検出装置及び方法を提供する。【解決手段】 被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出装置１０は、被加工物の実質屈折率を取得する屈折率取得部５２１と、被加工物に検出光を照射したときに被加工物にて反射された検出光の反射光に基づき、亀裂が形成された被加工物の上面高さ位置を検出する上面検出部５２２と、屈折率取得部５２１が取得した実質屈折率と上面検出部５２２が検出した上面高さ位置とに基づき、被加工物の下面高さ位置を検出する下面検出部５２２と、下面検出部５２２が検出した下面高さ位置を基準位置として、被加工物の内部に形成された亀裂の亀裂深さを検出する亀裂検出部５２４と、を備える。【選択図】図１０</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | CRACK DETECTION DEVICE AND METHOD |
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