TREATMENT LIQUID SUPPLY DEVICE AND SOLID REMOVAL METHOD FOR TREATMENT LIQUID SUPPLY DEVICE
To provide a treatment liquid supply device, and a solid removal method for the treatment liquid supply device.SOLUTION: A treatment liquid supply device according to the present invention supplies a treatment liquid to a substrate processing device and recovers and regenerates the treatment liquid,...
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| creator | LEE MU HYEON |
| description | To provide a treatment liquid supply device, and a solid removal method for the treatment liquid supply device.SOLUTION: A treatment liquid supply device according to the present invention supplies a treatment liquid to a substrate processing device and recovers and regenerates the treatment liquid, and has a flushing function that removes a solid such as a silica precipitated by the supply of the treatment liquid, and there is also provided a method for removing a solid such as a solid silica in the treatment liquid supply device.SELECTED DRAWING: Figure 7
【課題】処理液供給装置及び処理液供給装置の固形除去方法を提供すること。【解決手段】本発明は、基板処理装置へ処理液を供給し、回収して再生する処理液供給装置であって、処理液の供給によって析出するシリカなどの固形を除去するフラッシング機能を有する処理液供給装置、及び処理液供給装置において固体シリカなどの固形を除去する方法を提供する。【選択図】図７ |
| format | Patent |
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【課題】処理液供給装置及び処理液供給装置の固形除去方法を提供すること。【解決手段】本発明は、基板処理装置へ処理液を供給し、回収して再生する処理液供給装置であって、処理液の供給によって析出するシリカなどの固形を除去するフラッシング機能を有する処理液供給装置、及び処理液供給装置において固体シリカなどの固形を除去する方法を提供する。【選択図】図７</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220720&DB=EPODOC&CC=JP&NR=2022106653A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220720&DB=EPODOC&CC=JP&NR=2022106653A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE MU HYEON</creatorcontrib><title>TREATMENT LIQUID SUPPLY DEVICE AND SOLID REMOVAL METHOD FOR TREATMENT LIQUID SUPPLY DEVICE</title><description>To provide a treatment liquid supply device, and a solid removal method for the treatment liquid supply device.SOLUTION: A treatment liquid supply device according to the present invention supplies a treatment liquid to a substrate processing device and recovers and regenerates the treatment liquid, and has a flushing function that removes a solid such as a silica precipitated by the supply of the treatment liquid, and there is also provided a method for removing a solid such as a solid silica in the treatment liquid supply device.SELECTED DRAWING: Figure 7
【課題】処理液供給装置及び処理液供給装置の固形除去方法を提供すること。【解決手段】本発明は、基板処理装置へ処理液を供給し、回収して再生する処理液供給装置であって、処理液の供給によって析出するシリカなどの固形を除去するフラッシング機能を有する処理液供給装置、及び処理液供給装置において固体シリカなどの固形を除去する方法を提供する。【選択図】図７</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgKCXJ1DPF19QtR8PEMDPV0UQgODQjwiVRwcQ3zdHZVcPQDivj7AMWDXH39wxx9FHxdQzz8XRTc_IMU8OvlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkZGhgZmZqbGjsZEKQIA1YgyaQ</recordid><startdate>20220720</startdate><enddate>20220720</enddate><creator>LEE MU HYEON</creator><scope>EVB</scope></search><sort><creationdate>20220720</creationdate><title>TREATMENT LIQUID SUPPLY DEVICE AND SOLID REMOVAL METHOD FOR TREATMENT LIQUID SUPPLY DEVICE</title><author>LEE MU HYEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022106653A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE MU HYEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE MU HYEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TREATMENT LIQUID SUPPLY DEVICE AND SOLID REMOVAL METHOD FOR TREATMENT LIQUID SUPPLY DEVICE</title><date>2022-07-20</date><risdate>2022</risdate><abstract>To provide a treatment liquid supply device, and a solid removal method for the treatment liquid supply device.SOLUTION: A treatment liquid supply device according to the present invention supplies a treatment liquid to a substrate processing device and recovers and regenerates the treatment liquid, and has a flushing function that removes a solid such as a silica precipitated by the supply of the treatment liquid, and there is also provided a method for removing a solid such as a solid silica in the treatment liquid supply device.SELECTED DRAWING: Figure 7
【課題】処理液供給装置及び処理液供給装置の固形除去方法を提供すること。【解決手段】本発明は、基板処理装置へ処理液を供給し、回収して再生する処理液供給装置であって、処理液の供給によって析出するシリカなどの固形を除去するフラッシング機能を有する処理液供給装置、及び処理液供給装置において固体シリカなどの固形を除去する方法を提供する。【選択図】図７</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | TREATMENT LIQUID SUPPLY DEVICE AND SOLID REMOVAL METHOD FOR TREATMENT LIQUID SUPPLY DEVICE |
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