MULTILAYER ELECTRONIC COMPONENT
To provide a multilayer electronic component having improved capacitance per unit volume and improved reliability.SOLUTION: A multilayer electronic component includes: a rectangular parallelepiped body 110 including a first internal electrode 121 and a second internal electrode 122 alternately dispo...
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creator | KIM JUN HYEON KANG YEON SONG PARK KYU SIK KIM EUN JIN PARK MYUN-JUN PARK JIN SOO LEE KANG HA |
description | To provide a multilayer electronic component having improved capacitance per unit volume and improved reliability.SOLUTION: A multilayer electronic component includes: a rectangular parallelepiped body 110 including a first internal electrode 121 and a second internal electrode 122 alternately disposed in a first direction with a dielectric layer 111 interposed therebetween, the body having first to sixth faces; a first connection portion 131 including a first conductive layer 131a connected to the first internal electrode and a first insulating layer 131b disposed on the first conductive layer; a second connection portion 132 including a second conductive layer 132a connected to the second internal electrode and a second insulating layer 132b disposed on the second conductive layer; a first external electrode 141 including a first electrode layer 141a connected to the first conductive layer, and a first plating layer 141b disposed on the first electrode layer, the first external electrode disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode 142 including a second electrode layer 142a connected to the second conductive layer and a second plating layer 142b disposed on the second electrode layer, the second external electrode disposed away from the first external electrode, on a surface where the first external electrode is disposed.SELECTED DRAWING: Figure 3
【課題】単位体積当たりの容量及び信頼性が向上した積層型電子部品を提供する。【解決手段】積層型電子部品は、誘電体層111を間に挟んで第1方向に交互に配置される第1内部電極121と第2内部電極122を含み、第1面から第6面を有する直方体状の本体110と、第1内部電極と連結する第1導電層131aとその上に配置される第1絶縁層131bを含む第1連結部131と、第2内部電極と連結する第2導電層132aとその上に配置される第2絶縁層132bを含む第2連結部132と、第1導電層と連結される第1電極層141aとその上に配置される第1めっき層141bを含み、第1、第2、第5、第6面のうち何れか一面に配置される第1外部電極141及び第2導電層と連結される第2電極層142aとその上に配置される第2めっき層142bを含み、第1外部電極が配置された面に第1外部電極と離隔して配置される第2外部電極142と、を含む。【選択図】図3 |
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【課題】単位体積当たりの容量及び信頼性が向上した積層型電子部品を提供する。【解決手段】積層型電子部品は、誘電体層111を間に挟んで第1方向に交互に配置される第1内部電極121と第2内部電極122を含み、第1面から第6面を有する直方体状の本体110と、第1内部電極と連結する第1導電層131aとその上に配置される第1絶縁層131bを含む第1連結部131と、第2内部電極と連結する第2導電層132aとその上に配置される第2絶縁層132bを含む第2連結部132と、第1導電層と連結される第1電極層141aとその上に配置される第1めっき層141bを含み、第1、第2、第5、第6面のうち何れか一面に配置される第1外部電極141及び第2導電層と連結される第2電極層142aとその上に配置される第2めっき層142bを含み、第1外部電極が配置された面に第1外部電極と離隔して配置される第2外部電極142と、を含む。【選択図】図3</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRICITY</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220706&DB=EPODOC&CC=JP&NR=2022101469A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220706&DB=EPODOC&CC=JP&NR=2022101469A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM JUN HYEON</creatorcontrib><creatorcontrib>KANG YEON SONG</creatorcontrib><creatorcontrib>PARK KYU SIK</creatorcontrib><creatorcontrib>KIM EUN JIN</creatorcontrib><creatorcontrib>PARK MYUN-JUN</creatorcontrib><creatorcontrib>PARK JIN SOO</creatorcontrib><creatorcontrib>LEE KANG HA</creatorcontrib><title>MULTILAYER ELECTRONIC COMPONENT</title><description>To provide a multilayer electronic component having improved capacitance per unit volume and improved reliability.SOLUTION: A multilayer electronic component includes: a rectangular parallelepiped body 110 including a first internal electrode 121 and a second internal electrode 122 alternately disposed in a first direction with a dielectric layer 111 interposed therebetween, the body having first to sixth faces; a first connection portion 131 including a first conductive layer 131a connected to the first internal electrode and a first insulating layer 131b disposed on the first conductive layer; a second connection portion 132 including a second conductive layer 132a connected to the second internal electrode and a second insulating layer 132b disposed on the second conductive layer; a first external electrode 141 including a first electrode layer 141a connected to the first conductive layer, and a first plating layer 141b disposed on the first electrode layer, the first external electrode disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode 142 including a second electrode layer 142a connected to the second conductive layer and a second plating layer 142b disposed on the second electrode layer, the second external electrode disposed away from the first external electrode, on a surface where the first external electrode is disposed.SELECTED DRAWING: Figure 3
【課題】単位体積当たりの容量及び信頼性が向上した積層型電子部品を提供する。【解決手段】積層型電子部品は、誘電体層111を間に挟んで第1方向に交互に配置される第1内部電極121と第2内部電極122を含み、第1面から第6面を有する直方体状の本体110と、第1内部電極と連結する第1導電層131aとその上に配置される第1絶縁層131bを含む第1連結部131と、第2内部電極と連結する第2導電層132aとその上に配置される第2絶縁層132bを含む第2連結部132と、第1導電層と連結される第1電極層141aとその上に配置される第1めっき層141bを含み、第1、第2、第5、第6面のうち何れか一面に配置される第1外部電極141及び第2導電層と連結される第2電極層142aとその上に配置される第2めっき層142bを含み、第1外部電極が配置された面に第1外部電極と離隔して配置される第2外部電極142と、を含む。【選択図】図3</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3DfUJ8fRxjHQNUnD1cXUOCfL383RWcPb3DfD3c_UL4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGRoYGhiZmlo7GRCkCADUfIlM</recordid><startdate>20220706</startdate><enddate>20220706</enddate><creator>KIM JUN HYEON</creator><creator>KANG YEON SONG</creator><creator>PARK KYU SIK</creator><creator>KIM EUN JIN</creator><creator>PARK MYUN-JUN</creator><creator>PARK JIN SOO</creator><creator>LEE KANG HA</creator><scope>EVB</scope></search><sort><creationdate>20220706</creationdate><title>MULTILAYER ELECTRONIC COMPONENT</title><author>KIM JUN HYEON ; KANG YEON SONG ; PARK KYU SIK ; KIM EUN JIN ; PARK MYUN-JUN ; PARK JIN SOO ; LEE KANG HA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022101469A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM JUN HYEON</creatorcontrib><creatorcontrib>KANG YEON SONG</creatorcontrib><creatorcontrib>PARK KYU SIK</creatorcontrib><creatorcontrib>KIM EUN JIN</creatorcontrib><creatorcontrib>PARK MYUN-JUN</creatorcontrib><creatorcontrib>PARK JIN SOO</creatorcontrib><creatorcontrib>LEE KANG HA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM JUN HYEON</au><au>KANG YEON SONG</au><au>PARK KYU SIK</au><au>KIM EUN JIN</au><au>PARK MYUN-JUN</au><au>PARK JIN SOO</au><au>LEE KANG HA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER ELECTRONIC COMPONENT</title><date>2022-07-06</date><risdate>2022</risdate><abstract>To provide a multilayer electronic component having improved capacitance per unit volume and improved reliability.SOLUTION: A multilayer electronic component includes: a rectangular parallelepiped body 110 including a first internal electrode 121 and a second internal electrode 122 alternately disposed in a first direction with a dielectric layer 111 interposed therebetween, the body having first to sixth faces; a first connection portion 131 including a first conductive layer 131a connected to the first internal electrode and a first insulating layer 131b disposed on the first conductive layer; a second connection portion 132 including a second conductive layer 132a connected to the second internal electrode and a second insulating layer 132b disposed on the second conductive layer; a first external electrode 141 including a first electrode layer 141a connected to the first conductive layer, and a first plating layer 141b disposed on the first electrode layer, the first external electrode disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode 142 including a second electrode layer 142a connected to the second conductive layer and a second plating layer 142b disposed on the second electrode layer, the second external electrode disposed away from the first external electrode, on a surface where the first external electrode is disposed.SELECTED DRAWING: Figure 3
【課題】単位体積当たりの容量及び信頼性が向上した積層型電子部品を提供する。【解決手段】積層型電子部品は、誘電体層111を間に挟んで第1方向に交互に配置される第1内部電極121と第2内部電極122を含み、第1面から第6面を有する直方体状の本体110と、第1内部電極と連結する第1導電層131aとその上に配置される第1絶縁層131bを含む第1連結部131と、第2内部電極と連結する第2導電層132aとその上に配置される第2絶縁層132bを含む第2連結部132と、第1導電層と連結される第1電極層141aとその上に配置される第1めっき層141bを含み、第1、第2、第5、第6面のうち何れか一面に配置される第1外部電極141及び第2導電層と連結される第2電極層142aとその上に配置される第2めっき層142bを含み、第1外部電極が配置された面に第1外部電極と離隔して配置される第2外部電極142と、を含む。【選択図】図3</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY |
title | MULTILAYER ELECTRONIC COMPONENT |
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