SURFACE TREATMENT DEVICE
To reduce the restriction of a member conducting a power source part and a conductor layer.SOLUTION: A surface treatment device comprises: an electrode; a mounting base capable of mounting the object to be treated formed with a conductor layer on the surface; a housing arranged so as to face the mou...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SATO TOYOKI TERAYAMA TAKAO |
| description | To reduce the restriction of a member conducting a power source part and a conductor layer.SOLUTION: A surface treatment device comprises: an electrode; a mounting base capable of mounting the object to be treated formed with a conductor layer on the surface; a housing arranged so as to face the mounting base and formable a liquid chamber at the inside; a solution feed part capable of feeding an electrolytic solution into the liquid chamber; an ion conductive film arranged between the liquid chamber and the mounting base; a foil-shaped member arranged between the ion conductive film and the object to be treated and having an insulator layer and an energization layer; and a power source part applying voltage to a space between the electrode and the conductive layer, and the foil-shaped member is arranged in such a manner that the energization layer is contactable to a part of the conductor layer.SELECTED DRAWING: Figure 1A
【課題】 電源部と導体層とを導通する部材の制約を低減させる。【解決手段】 表面処理装置は、電極と、導体層が表面に形成された被処理物を載置可能な載置基台と、載置基台に対して対向配置されて、内部に液室を形成可能なハウジングと、電解液を液室内に供給可能な溶液供給部と、液室と載置基台との間に配置されたイオン伝導膜と、イオン伝導膜と被処理物との間に配置された絶縁層及び通電層を有する箔状部材と、電極と導体層との間に電圧を印加する電源部と、を備え、箔状部材は、通電層が導体層の一部に接触可能に配置されるように構成されるものとする。【選択図】図１Ａ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2022046180A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2022046180A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2022046180A3</originalsourceid><addsrcrecordid>eNrjZJAIDg1yc3R2VQgJcnUM8XX1C1FwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkZGBiZmhhYGjsZEKQIAL4kgEg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE TREATMENT DEVICE</title><source>esp@cenet</source><creator>SATO TOYOKI ; TERAYAMA TAKAO</creator><creatorcontrib>SATO TOYOKI ; TERAYAMA TAKAO</creatorcontrib><description>To reduce the restriction of a member conducting a power source part and a conductor layer.SOLUTION: A surface treatment device comprises: an electrode; a mounting base capable of mounting the object to be treated formed with a conductor layer on the surface; a housing arranged so as to face the mounting base and formable a liquid chamber at the inside; a solution feed part capable of feeding an electrolytic solution into the liquid chamber; an ion conductive film arranged between the liquid chamber and the mounting base; a foil-shaped member arranged between the ion conductive film and the object to be treated and having an insulator layer and an energization layer; and a power source part applying voltage to a space between the electrode and the conductive layer, and the foil-shaped member is arranged in such a manner that the energization layer is contactable to a part of the conductor layer.SELECTED DRAWING: Figure 1A
【課題】 電源部と導体層とを導通する部材の制約を低減させる。【解決手段】 表面処理装置は、電極と、導体層が表面に形成された被処理物を載置可能な載置基台と、載置基台に対して対向配置されて、内部に液室を形成可能なハウジングと、電解液を液室内に供給可能な溶液供給部と、液室と載置基台との間に配置されたイオン伝導膜と、イオン伝導膜と被処理物との間に配置された絶縁層及び通電層を有する箔状部材と、電極と導体層との間に電圧を印加する電源部と、を備え、箔状部材は、通電層が導体層の一部に接触可能に配置されるように構成されるものとする。【選択図】図１Ａ</description><language>eng ; jpn</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220323&DB=EPODOC&CC=JP&NR=2022046180A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220323&DB=EPODOC&CC=JP&NR=2022046180A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SATO TOYOKI</creatorcontrib><creatorcontrib>TERAYAMA TAKAO</creatorcontrib><title>SURFACE TREATMENT DEVICE</title><description>To reduce the restriction of a member conducting a power source part and a conductor layer.SOLUTION: A surface treatment device comprises: an electrode; a mounting base capable of mounting the object to be treated formed with a conductor layer on the surface; a housing arranged so as to face the mounting base and formable a liquid chamber at the inside; a solution feed part capable of feeding an electrolytic solution into the liquid chamber; an ion conductive film arranged between the liquid chamber and the mounting base; a foil-shaped member arranged between the ion conductive film and the object to be treated and having an insulator layer and an energization layer; and a power source part applying voltage to a space between the electrode and the conductive layer, and the foil-shaped member is arranged in such a manner that the energization layer is contactable to a part of the conductor layer.SELECTED DRAWING: Figure 1A
【課題】 電源部と導体層とを導通する部材の制約を低減させる。【解決手段】 表面処理装置は、電極と、導体層が表面に形成された被処理物を載置可能な載置基台と、載置基台に対して対向配置されて、内部に液室を形成可能なハウジングと、電解液を液室内に供給可能な溶液供給部と、液室と載置基台との間に配置されたイオン伝導膜と、イオン伝導膜と被処理物との間に配置された絶縁層及び通電層を有する箔状部材と、電極と導体層との間に電圧を印加する電源部と、を備え、箔状部材は、通電層が導体層の一部に接触可能に配置されるように構成されるものとする。【選択図】図１Ａ</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAIDg1yc3R2VQgJcnUM8XX1C1FwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkZGBiZmhhYGjsZEKQIAL4kgEg</recordid><startdate>20220323</startdate><enddate>20220323</enddate><creator>SATO TOYOKI</creator><creator>TERAYAMA TAKAO</creator><scope>EVB</scope></search><sort><creationdate>20220323</creationdate><title>SURFACE TREATMENT DEVICE</title><author>SATO TOYOKI ; TERAYAMA TAKAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022046180A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>SATO TOYOKI</creatorcontrib><creatorcontrib>TERAYAMA TAKAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SATO TOYOKI</au><au>TERAYAMA TAKAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATMENT DEVICE</title><date>2022-03-23</date><risdate>2022</risdate><abstract>To reduce the restriction of a member conducting a power source part and a conductor layer.SOLUTION: A surface treatment device comprises: an electrode; a mounting base capable of mounting the object to be treated formed with a conductor layer on the surface; a housing arranged so as to face the mounting base and formable a liquid chamber at the inside; a solution feed part capable of feeding an electrolytic solution into the liquid chamber; an ion conductive film arranged between the liquid chamber and the mounting base; a foil-shaped member arranged between the ion conductive film and the object to be treated and having an insulator layer and an energization layer; and a power source part applying voltage to a space between the electrode and the conductive layer, and the foil-shaped member is arranged in such a manner that the energization layer is contactable to a part of the conductor layer.SELECTED DRAWING: Figure 1A
【課題】 電源部と導体層とを導通する部材の制約を低減させる。【解決手段】 表面処理装置は、電極と、導体層が表面に形成された被処理物を載置可能な載置基台と、載置基台に対して対向配置されて、内部に液室を形成可能なハウジングと、電解液を液室内に供給可能な溶液供給部と、液室と載置基台との間に配置されたイオン伝導膜と、イオン伝導膜と被処理物との間に配置された絶縁層及び通電層を有する箔状部材と、電極と導体層との間に電圧を印加する電源部と、を備え、箔状部材は、通電層が導体層の一部に接触可能に配置されるように構成されるものとする。【選択図】図１Ａ</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2022046180A |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | SURFACE TREATMENT DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T19%3A03%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SATO%20TOYOKI&rft.date=2022-03-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2022046180A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |