SUBSTRATE PROCESSING APPARATUS AND OPERATION METHOD FOR SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing apparatus and an operation method for the substrate processing apparatus, where the substrate processing apparatus is capable of removing a fluorine/silicon-containing substance deposited on an inner wall of a chamber.SOLUTION: Provided in one embodiment is a method...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG BONG JU, KANG KYU WAN, YANG SEUNG KOOK
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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