CUTTING BLADE AND CUTTING BLADE MANUFACTURING METHOD
To provide a cutting blade and a cutting blade manufacturing method capable of reducing a width dimensional difference in a vertical direction of a cut groove in cutting of a workpiece.SOLUTION: A cutting blade 100 to rotate around an axis O includes: a blade body 10 having a metal bond phase 20 for...
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| creator | HOSHI JUNJI |
| description | To provide a cutting blade and a cutting blade manufacturing method capable of reducing a width dimensional difference in a vertical direction of a cut groove in cutting of a workpiece.SOLUTION: A cutting blade 100 to rotate around an axis O includes: a blade body 10 having a metal bond phase 20 formed in a disk shape centered at the axis O and diamond super-abrasive grains 30 dispersed in the metal bond phase 20; and a cutting edge 11A formed on an outer peripheral surface 11 of the blade body 10. On the side surfaces on both sides in the axial O direction, an abrasive grain flat surface 30S formed on the diamond super-abrasive grains 30 is exposed flush with the metal bond phase 20.SELECTED DRAWING: Figure 3
【課題】被加工材を切断した際の切断溝の上下方向による幅寸法差を小さくすることが可能な切断用ブレード及び切断用ブレード製造方法を提供すること。【解決手段】軸線Ｏ周りに回転する切断用ブレード１００であって、軸線Ｏを中心とする円板状に形成されメタルボンド相２０と、前記メタルボンド相２０に分散されたダイヤモンド超砥粒３０と、を有するブレード本体１０と、前記ブレード本体１０の外周面１１に形成された切れ刃１１Ａと、を備え、前記軸線Ｏ方向における両側の側面において、前記ダイヤモンド超砥粒３０に形成された砥粒平坦面３０Ｓが前記メタルボンド相２０と面一に露出していることを特徴とする。【選択図】図３ |
| format | Patent |
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【課題】被加工材を切断した際の切断溝の上下方向による幅寸法差を小さくすることが可能な切断用ブレード及び切断用ブレード製造方法を提供すること。【解決手段】軸線Ｏ周りに回転する切断用ブレード１００であって、軸線Ｏを中心とする円板状に形成されメタルボンド相２０と、前記メタルボンド相２０に分散されたダイヤモンド超砥粒３０と、を有するブレード本体１０と、前記ブレード本体１０の外周面１１に形成された切れ刃１１Ａと、を備え、前記軸線Ｏ方向における両側の側面において、前記ダイヤモンド超砥粒３０に形成された砥粒平坦面３０Ｓが前記メタルボンド相２０と面一に露出していることを特徴とする。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220203&DB=EPODOC&CC=JP&NR=2022021605A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220203&DB=EPODOC&CC=JP&NR=2022021605A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSHI JUNJI</creatorcontrib><title>CUTTING BLADE AND CUTTING BLADE MANUFACTURING METHOD</title><description>To provide a cutting blade and a cutting blade manufacturing method capable of reducing a width dimensional difference in a vertical direction of a cut groove in cutting of a workpiece.SOLUTION: A cutting blade 100 to rotate around an axis O includes: a blade body 10 having a metal bond phase 20 formed in a disk shape centered at the axis O and diamond super-abrasive grains 30 dispersed in the metal bond phase 20; and a cutting edge 11A formed on an outer peripheral surface 11 of the blade body 10. On the side surfaces on both sides in the axial O direction, an abrasive grain flat surface 30S formed on the diamond super-abrasive grains 30 is exposed flush with the metal bond phase 20.SELECTED DRAWING: Figure 3
【課題】被加工材を切断した際の切断溝の上下方向による幅寸法差を小さくすることが可能な切断用ブレード及び切断用ブレード製造方法を提供すること。【解決手段】軸線Ｏ周りに回転する切断用ブレード１００であって、軸線Ｏを中心とする円板状に形成されメタルボンド相２０と、前記メタルボンド相２０に分散されたダイヤモンド超砥粒３０と、を有するブレード本体１０と、前記ブレード本体１０の外周面１１に形成された切れ刃１１Ａと、を備え、前記軸線Ｏ方向における両側の側面において、前記ダイヤモンド超砥粒３０に形成された砥粒平坦面３０Ｓが前記メタルボンド相２０と面一に露出していることを特徴とする。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBxDg0J8fRzV3DycXRxVXD0c1FAFfF19At1c3QOCQ0Cifm6hnj4u_AwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDIyAyNDMwdTQmShEA-c4niw</recordid><startdate>20220203</startdate><enddate>20220203</enddate><creator>HOSHI JUNJI</creator><scope>EVB</scope></search><sort><creationdate>20220203</creationdate><title>CUTTING BLADE AND CUTTING BLADE MANUFACTURING METHOD</title><author>HOSHI JUNJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022021605A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSHI JUNJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSHI JUNJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CUTTING BLADE AND CUTTING BLADE MANUFACTURING METHOD</title><date>2022-02-03</date><risdate>2022</risdate><abstract>To provide a cutting blade and a cutting blade manufacturing method capable of reducing a width dimensional difference in a vertical direction of a cut groove in cutting of a workpiece.SOLUTION: A cutting blade 100 to rotate around an axis O includes: a blade body 10 having a metal bond phase 20 formed in a disk shape centered at the axis O and diamond super-abrasive grains 30 dispersed in the metal bond phase 20; and a cutting edge 11A formed on an outer peripheral surface 11 of the blade body 10. On the side surfaces on both sides in the axial O direction, an abrasive grain flat surface 30S formed on the diamond super-abrasive grains 30 is exposed flush with the metal bond phase 20.SELECTED DRAWING: Figure 3
【課題】被加工材を切断した際の切断溝の上下方向による幅寸法差を小さくすることが可能な切断用ブレード及び切断用ブレード製造方法を提供すること。【解決手段】軸線Ｏ周りに回転する切断用ブレード１００であって、軸線Ｏを中心とする円板状に形成されメタルボンド相２０と、前記メタルボンド相２０に分散されたダイヤモンド超砥粒３０と、を有するブレード本体１０と、前記ブレード本体１０の外周面１１に形成された切れ刃１１Ａと、を備え、前記軸線Ｏ方向における両側の側面において、前記ダイヤモンド超砥粒３０に形成された砥粒平坦面３０Ｓが前記メタルボンド相２０と面一に露出していることを特徴とする。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | CUTTING BLADE AND CUTTING BLADE MANUFACTURING METHOD |
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