POLISHING METHOD, POLISHING DEVICE, AND COMPUTER READABLE RECORDING MEDIUM RECORDING PROGRAM

To provide a polishing method capable of measuring film thickness of a substrate such as a semiconductor wafer having various structural elements thereon with high accuracy.SOLUTION: A polishing method generates a plurality of spectra of reflecting light from a plurality of measurement points on a s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NACHIKETA CHAUHAN, YAGI KEITA, SHIOKAWA YOICHI, WATANABE YUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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