LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
To provide an LED light-emitting device and a manufacturing method of the same that can reduce the number of components and the manufacturing processes while maintaining the accuracy related to the thickness of the sealing resin.SOLUTION: An LED light-emitting device 10 has a mounting substrate 11 w...
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| creator | KURIKI SHINGO |
| description | To provide an LED light-emitting device and a manufacturing method of the same that can reduce the number of components and the manufacturing processes while maintaining the accuracy related to the thickness of the sealing resin.SOLUTION: An LED light-emitting device 10 has a mounting substrate 11 with high thermal conductivity. A resist 12, which covers the top of the mounting substrate 11, has an opening 12a in the center. The light-emitting area 13a, which is divided by the opening 12a of the resist 12 and the upper surface of the mounting substrate 11, is mounted with an LED die 15 and filled with a sealing resin 13. The resist 12 damps the sealing resin 13 at the inner surface of the opening 12a.SELECTED DRAWING: Figure 2
【課題】封止樹脂の厚さに係る精度を維持しながら、部材点数及び製造工程を削減できるＬＥＤ発光装置及びその製造方法を提供する。【解決手段】ＬＥＤ発光装置１０は、熱伝導性の高い実装基板１１を備えている。この実装基板１１の上部を覆うレジスト１２は、中央部に開口１２ａを有する。レジスト１２の開口１２ａと実装基板１１の上面で区画される発光部１３ａには、ＬＥＤダイ１５が実装されるとともに、封止樹脂１３が充填される。レジスト１２は、開口１２ａの内周面で封止樹脂１３を堰き止めている。【選択図】図２ |
| format | Patent |
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【課題】封止樹脂の厚さに係る精度を維持しながら、部材点数及び製造工程を削減できるＬＥＤ発光装置及びその製造方法を提供する。【解決手段】ＬＥＤ発光装置１０は、熱伝導性の高い実装基板１１を備えている。この実装基板１１の上部を覆うレジスト１２は、中央部に開口１２ａを有する。レジスト１２の開口１２ａと実装基板１１の上面で区画される発光部１３ａには、ＬＥＤダイ１５が実装されるとともに、封止樹脂１３が充填される。レジスト１２は、開口１２ａの内周面で封止樹脂１３を堰き止めている。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; NON-PORTABLE LIGHTING DEVICES ; SEMICONDUCTOR DEVICES ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; SYSTEMS THEREOF ; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS ; WEAPONS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211213&DB=EPODOC&CC=JP&NR=2021190581A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211213&DB=EPODOC&CC=JP&NR=2021190581A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KURIKI SHINGO</creatorcontrib><title>LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME</title><description>To provide an LED light-emitting device and a manufacturing method of the same that can reduce the number of components and the manufacturing processes while maintaining the accuracy related to the thickness of the sealing resin.SOLUTION: An LED light-emitting device 10 has a mounting substrate 11 with high thermal conductivity. A resist 12, which covers the top of the mounting substrate 11, has an opening 12a in the center. The light-emitting area 13a, which is divided by the opening 12a of the resist 12 and the upper surface of the mounting substrate 11, is mounted with an LED die 15 and filled with a sealing resin 13. The resist 12 damps the sealing resin 13 at the inner surface of the opening 12a.SELECTED DRAWING: Figure 2
【課題】封止樹脂の厚さに係る精度を維持しながら、部材点数及び製造工程を削減できるＬＥＤ発光装置及びその製造方法を提供する。【解決手段】ＬＥＤ発光装置１０は、熱伝導性の高い実装基板１１を備えている。この実装基板１１の上部を覆うレジスト１２は、中央部に開口１２ａを有する。レジスト１２の開口１２ａと実装基板１１の上面で区画される発光部１３ａには、ＬＥＤダイ１５が実装されるとともに、封止樹脂１３が充填される。レジスト１２は、開口１２ａの内周面で封止樹脂１３を堰き止めている。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-PORTABLE LIGHTING DEVICES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>SYSTEMS THEREOF</subject><subject>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDzcXVR8PF09wjRdfX1DAnx9HNXcHEN83R2VXD0c1HwdfQLdXN0DgkNAkn4uoZ4-Lso-LsphHi4KgQ7-rryMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNDQ0sDUwtDR2OiFAEAfT0qIg</recordid><startdate>20211213</startdate><enddate>20211213</enddate><creator>KURIKI SHINGO</creator><scope>EVB</scope></search><sort><creationdate>20211213</creationdate><title>LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME</title><author>KURIKI SHINGO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021190581A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-PORTABLE LIGHTING DEVICES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>SYSTEMS THEREOF</topic><topic>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>KURIKI SHINGO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KURIKI SHINGO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME</title><date>2021-12-13</date><risdate>2021</risdate><abstract>To provide an LED light-emitting device and a manufacturing method of the same that can reduce the number of components and the manufacturing processes while maintaining the accuracy related to the thickness of the sealing resin.SOLUTION: An LED light-emitting device 10 has a mounting substrate 11 with high thermal conductivity. A resist 12, which covers the top of the mounting substrate 11, has an opening 12a in the center. The light-emitting area 13a, which is divided by the opening 12a of the resist 12 and the upper surface of the mounting substrate 11, is mounted with an LED die 15 and filled with a sealing resin 13. The resist 12 damps the sealing resin 13 at the inner surface of the opening 12a.SELECTED DRAWING: Figure 2
【課題】封止樹脂の厚さに係る精度を維持しながら、部材点数及び製造工程を削減できるＬＥＤ発光装置及びその製造方法を提供する。【解決手段】ＬＥＤ発光装置１０は、熱伝導性の高い実装基板１１を備えている。この実装基板１１の上部を覆うレジスト１２は、中央部に開口１２ａを有する。レジスト１２の開口１２ａと実装基板１１の上面で区画される発光部１３ａには、ＬＥＤダイ１５が実装されるとともに、封止樹脂１３が充填される。レジスト１２は、開口１２ａの内周面で封止樹脂１３を堰き止めている。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS |
| title | LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME |
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