THERMAL CONDUCTIVITY SHEET
To provide a thermal conductivity sheet that has high thermal conductivity, strong adhesive strength, and does not deteriorate thermal conductivity or adhesive strength even when stored under high temperature and high humidity.SOLUTION: A thermal conductivity sheet includes a first adhesive layer, a...
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| creator | YOSHIKI TAKENOBU |
| description | To provide a thermal conductivity sheet that has high thermal conductivity, strong adhesive strength, and does not deteriorate thermal conductivity or adhesive strength even when stored under high temperature and high humidity.SOLUTION: A thermal conductivity sheet includes a first adhesive layer, and a thermal conductive layer and a second adhesive layer on the first adhesive layer in this order, The first adhesive layer or the second adhesive layer contains an acrylic adhesive having an acid value of at least 2 mgKOH/g, the thermal conductive layer contains at least zinc oxide and an acrylic adhesive, and further, the ratio of thermal conductivity filler in the conductive layer is 60 volume% or more.SELECTED DRAWING: None
【課題】高い熱伝導性を有し、粘着力が強く、高温高湿下で保管しても熱伝導性や粘着力の劣化のない熱伝導性シートを提供する。【解決手段】第一の粘着層と、該第一の粘着層上に熱伝導層と第二の粘着層とをこの順に有し、該第一の粘着層あるいは該第二の粘着層が少なくとも酸価が２ｍｇＫＯＨ／ｇ以下のアクリル粘着剤を含有し、該熱伝導層が少なくとも酸化亜鉛とアクリル粘着剤を含有し、更に該熱伝導層中の熱伝導性フィラー比率が６０体積％以上であることを特徴とする熱伝導性シート。【選択図】なし |
| format | Patent |
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【課題】高い熱伝導性を有し、粘着力が強く、高温高湿下で保管しても熱伝導性や粘着力の劣化のない熱伝導性シートを提供する。【解決手段】第一の粘着層と、該第一の粘着層上に熱伝導層と第二の粘着層とをこの順に有し、該第一の粘着層あるいは該第二の粘着層が少なくとも酸価が２ｍｇＫＯＨ／ｇ以下のアクリル粘着剤を含有し、該熱伝導層が少なくとも酸化亜鉛とアクリル粘着剤を含有し、更に該熱伝導層中の熱伝導性フィラー比率が６０体積％以上であることを特徴とする熱伝導性シート。【選択図】なし</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211202&DB=EPODOC&CC=JP&NR=2021184434A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211202&DB=EPODOC&CC=JP&NR=2021184434A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIKI TAKENOBU</creatorcontrib><title>THERMAL CONDUCTIVITY SHEET</title><description>To provide a thermal conductivity sheet that has high thermal conductivity, strong adhesive strength, and does not deteriorate thermal conductivity or adhesive strength even when stored under high temperature and high humidity.SOLUTION: A thermal conductivity sheet includes a first adhesive layer, and a thermal conductive layer and a second adhesive layer on the first adhesive layer in this order, The first adhesive layer or the second adhesive layer contains an acrylic adhesive having an acid value of at least 2 mgKOH/g, the thermal conductive layer contains at least zinc oxide and an acrylic adhesive, and further, the ratio of thermal conductivity filler in the conductive layer is 60 volume% or more.SELECTED DRAWING: None
【課題】高い熱伝導性を有し、粘着力が強く、高温高湿下で保管しても熱伝導性や粘着力の劣化のない熱伝導性シートを提供する。【解決手段】第一の粘着層と、該第一の粘着層上に熱伝導層と第二の粘着層とをこの順に有し、該第一の粘着層あるいは該第二の粘着層が少なくとも酸価が２ｍｇＫＯＨ／ｇ以下のアクリル粘着剤を含有し、該熱伝導層が少なくとも酸化亜鉛とアクリル粘着剤を含有し、更に該熱伝導層中の熱伝導性フィラー比率が６０体積％以上であることを特徴とする熱伝導性シート。【選択図】なし</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAK8XAN8nX0UXD293MJdQ7xDPMMiVQI9nB1DeFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoaGFiYmxiaOxkQpAgCDiiDa</recordid><startdate>20211202</startdate><enddate>20211202</enddate><creator>YOSHIKI TAKENOBU</creator><scope>EVB</scope></search><sort><creationdate>20211202</creationdate><title>THERMAL CONDUCTIVITY SHEET</title><author>YOSHIKI TAKENOBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021184434A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIKI TAKENOBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIKI TAKENOBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL CONDUCTIVITY SHEET</title><date>2021-12-02</date><risdate>2021</risdate><abstract>To provide a thermal conductivity sheet that has high thermal conductivity, strong adhesive strength, and does not deteriorate thermal conductivity or adhesive strength even when stored under high temperature and high humidity.SOLUTION: A thermal conductivity sheet includes a first adhesive layer, and a thermal conductive layer and a second adhesive layer on the first adhesive layer in this order, The first adhesive layer or the second adhesive layer contains an acrylic adhesive having an acid value of at least 2 mgKOH/g, the thermal conductive layer contains at least zinc oxide and an acrylic adhesive, and further, the ratio of thermal conductivity filler in the conductive layer is 60 volume% or more.SELECTED DRAWING: None
【課題】高い熱伝導性を有し、粘着力が強く、高温高湿下で保管しても熱伝導性や粘着力の劣化のない熱伝導性シートを提供する。【解決手段】第一の粘着層と、該第一の粘着層上に熱伝導層と第二の粘着層とをこの順に有し、該第一の粘着層あるいは該第二の粘着層が少なくとも酸価が２ｍｇＫＯＨ／ｇ以下のアクリル粘着剤を含有し、該熱伝導層が少なくとも酸化亜鉛とアクリル粘着剤を含有し、更に該熱伝導層中の熱伝導性フィラー比率が６０体積％以上であることを特徴とする熱伝導性シート。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | THERMAL CONDUCTIVITY SHEET |
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