HEAT-CONDUCTIVE RESIN COMPOSITION, AND COMPACT COMPRISING THE SAME
To provide a resin composition capable of manufacturing a compact excellent in fog resistance, while heat conductivity in a flow direction is 2 W/(m-K) or greater.SOLUTION: A heat-conductive resin composition contains a thermoplastic resin (A) and a heat-conductive filler (B). In the heat-conductive...
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| creator | OHATA WATARU MASAI YUYA |
| description | To provide a resin composition capable of manufacturing a compact excellent in fog resistance, while heat conductivity in a flow direction is 2 W/(m-K) or greater.SOLUTION: A heat-conductive resin composition contains a thermoplastic resin (A) and a heat-conductive filler (B). In the heat-conductive resin composition, a mass ratio between the thermoplastic resin (A) and the heat-conductive filler (B) is 38/62 to 85/15, a haze value of a glass sheet after a fogging test of 200 hours at 125°C is 8 or lower, and heat conductivity in a flow direction of a compact obtained by molding the heat-conductive resin composition is 2 W/(m-K) or greater.SELECTED DRAWING: None
【課題】流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上でありながら、耐フォギング性に優れた成形体を製造することができる樹脂組成物を提供すること。【解決手段】熱可塑性樹脂（Ａ）および熱伝導性充填材（Ｂ）を含有する熱伝導性樹脂組成物であって、前記熱可塑性樹脂（Ａ）と前記熱伝導性充填材（Ｂ）との質量比率が３８／６２〜８５／１５であり、１２５℃で２００時間のフォギング試験後のガラス板のヘイズ値が８以下であり、 前記熱伝導性樹脂組成物を成形してなる成形体の流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上である、熱伝導性樹脂組成物。【選択図】なし |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021181541A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021181541A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021181541A3</originalsourceid><addsrcrecordid>eNrjZHDycHUM0XX293MJdQ7xDHNVCHIN9vRTcPb3DfAP9gzx9PfTUXD0cwELODqHgOkgT6ASd4UQD1eFYEdfVx4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgZGhoYWhqYuhoTJQiAFV3K48</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT-CONDUCTIVE RESIN COMPOSITION, AND COMPACT COMPRISING THE SAME</title><source>esp@cenet</source><creator>OHATA WATARU ; MASAI YUYA</creator><creatorcontrib>OHATA WATARU ; MASAI YUYA</creatorcontrib><description>To provide a resin composition capable of manufacturing a compact excellent in fog resistance, while heat conductivity in a flow direction is 2 W/(m-K) or greater.SOLUTION: A heat-conductive resin composition contains a thermoplastic resin (A) and a heat-conductive filler (B). In the heat-conductive resin composition, a mass ratio between the thermoplastic resin (A) and the heat-conductive filler (B) is 38/62 to 85/15, a haze value of a glass sheet after a fogging test of 200 hours at 125°C is 8 or lower, and heat conductivity in a flow direction of a compact obtained by molding the heat-conductive resin composition is 2 W/(m-K) or greater.SELECTED DRAWING: None
【課題】流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上でありながら、耐フォギング性に優れた成形体を製造することができる樹脂組成物を提供すること。【解決手段】熱可塑性樹脂（Ａ）および熱伝導性充填材（Ｂ）を含有する熱伝導性樹脂組成物であって、前記熱可塑性樹脂（Ａ）と前記熱伝導性充填材（Ｂ）との質量比率が３８／６２〜８５／１５であり、１２５℃で２００時間のフォギング試験後のガラス板のヘイズ値が８以下であり、 前記熱伝導性樹脂組成物を成形してなる成形体の流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上である、熱伝導性樹脂組成物。【選択図】なし</description><language>eng ; jpn</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211125&DB=EPODOC&CC=JP&NR=2021181541A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211125&DB=EPODOC&CC=JP&NR=2021181541A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHATA WATARU</creatorcontrib><creatorcontrib>MASAI YUYA</creatorcontrib><title>HEAT-CONDUCTIVE RESIN COMPOSITION, AND COMPACT COMPRISING THE SAME</title><description>To provide a resin composition capable of manufacturing a compact excellent in fog resistance, while heat conductivity in a flow direction is 2 W/(m-K) or greater.SOLUTION: A heat-conductive resin composition contains a thermoplastic resin (A) and a heat-conductive filler (B). In the heat-conductive resin composition, a mass ratio between the thermoplastic resin (A) and the heat-conductive filler (B) is 38/62 to 85/15, a haze value of a glass sheet after a fogging test of 200 hours at 125°C is 8 or lower, and heat conductivity in a flow direction of a compact obtained by molding the heat-conductive resin composition is 2 W/(m-K) or greater.SELECTED DRAWING: None
【課題】流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上でありながら、耐フォギング性に優れた成形体を製造することができる樹脂組成物を提供すること。【解決手段】熱可塑性樹脂（Ａ）および熱伝導性充填材（Ｂ）を含有する熱伝導性樹脂組成物であって、前記熱可塑性樹脂（Ａ）と前記熱伝導性充填材（Ｂ）との質量比率が３８／６２〜８５／１５であり、１２５℃で２００時間のフォギング試験後のガラス板のヘイズ値が８以下であり、 前記熱伝導性樹脂組成物を成形してなる成形体の流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上である、熱伝導性樹脂組成物。【選択図】なし</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDycHUM0XX293MJdQ7xDHNVCHIN9vRTcPb3DfAP9gzx9PfTUXD0cwELODqHgOkgT6ASd4UQD1eFYEdfVx4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgZGhoYWhqYuhoTJQiAFV3K48</recordid><startdate>20211125</startdate><enddate>20211125</enddate><creator>OHATA WATARU</creator><creator>MASAI YUYA</creator><scope>EVB</scope></search><sort><creationdate>20211125</creationdate><title>HEAT-CONDUCTIVE RESIN COMPOSITION, AND COMPACT COMPRISING THE SAME</title><author>OHATA WATARU ; MASAI YUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021181541A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>OHATA WATARU</creatorcontrib><creatorcontrib>MASAI YUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHATA WATARU</au><au>MASAI YUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT-CONDUCTIVE RESIN COMPOSITION, AND COMPACT COMPRISING THE SAME</title><date>2021-11-25</date><risdate>2021</risdate><abstract>To provide a resin composition capable of manufacturing a compact excellent in fog resistance, while heat conductivity in a flow direction is 2 W/(m-K) or greater.SOLUTION: A heat-conductive resin composition contains a thermoplastic resin (A) and a heat-conductive filler (B). In the heat-conductive resin composition, a mass ratio between the thermoplastic resin (A) and the heat-conductive filler (B) is 38/62 to 85/15, a haze value of a glass sheet after a fogging test of 200 hours at 125°C is 8 or lower, and heat conductivity in a flow direction of a compact obtained by molding the heat-conductive resin composition is 2 W/(m-K) or greater.SELECTED DRAWING: None
【課題】流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上でありながら、耐フォギング性に優れた成形体を製造することができる樹脂組成物を提供すること。【解決手段】熱可塑性樹脂（Ａ）および熱伝導性充填材（Ｂ）を含有する熱伝導性樹脂組成物であって、前記熱可塑性樹脂（Ａ）と前記熱伝導性充填材（Ｂ）との質量比率が３８／６２〜８５／１５であり、１２５℃で２００時間のフォギング試験後のガラス板のヘイズ値が８以下であり、 前記熱伝導性樹脂組成物を成形してなる成形体の流動方向の熱伝導率が２Ｗ／（ｍ・Ｋ）以上である、熱伝導性樹脂組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | HEAT-CONDUCTIVE RESIN COMPOSITION, AND COMPACT COMPRISING THE SAME |
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