ELECTRONIC COMPONENT

To provide an electronic component with improved bonding strength of a terminal electrode to an element body.SOLUTION: An electronic component according to the present invention includes an element body containing metal particles and resin, and a resin electrode layer formed on an electrode facing portion which is a part of the outer surface of the element body. The resin electrode layer contains a resin component and a conductor powder. Further, the electrode facing portion has an exposed portion in which the resin is removed on the outermost surface thereof and a part of the outer peripheral edge of the metal particles located on the outermost surface is exposed. Then, the resin electrode layer and the exposed portion of the electrode facing portion are joined to each other.SELECTED DRAWING: Figure 4B 【課題】素体に対する端子電極の接合強度を向上させた電子部品を提供すること。【解決手段】本発明に係る電子部品は、金属粒子と樹脂とを含む素体と、素体の外面の一部である電極対向部に形成してある樹脂電極層と、を有する。樹脂電極層は、樹脂成分と導体粉末とを含んでいる。また、電極対向部は、その最表面において樹脂が除去されて、最表面に位置する金属粒子の外周縁の一部が露出している露出部を有している。そして、樹脂電極層と、電極対向部の前記露出部と、が接合してある。【選択図】図４Ｂ