MANUFACTURING METHOD OF SOLDER CHIP, SOLDER CHIP AND JUNCTION LAYER EVALUATION DEVICE USING THE SAME

To evaluate the deterioration and lifetime of a junction layer by quantitatively evaluating the junction layer.SOLUTION: On a SiC substrate 106, a thin film heater 117 consisting of Ni-P is formed between a terminal electrode 115a and a terminal electrode 115b, and a temperature probe 116 consisting...

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Bibliographische Detailangaben

1. Verfasser:	OYA REIJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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