LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

To provide an LED light-emitting device and a manufacturing method thereof that can efficiently transfer heat accumulated in a sealing resin due to heat generation of a phosphor to the mounting substrate side while maintaining and improving the optical characteristics.SOLUTION: A sealing resin 15 includes a deposition layer 26 including a first phosphor 23 and a second phosphor 24 having small particle sizes and a third phosphor 25 having a large particle size. In the deposition layer 26, the first phosphor 23 and the second phosphor 24 are packed between the third phosphor 25. Further, in an LED light-emitting device 10 is manufactured after a first fluorescent resin in which first fluorescent particles 23 are kneaded is applied to a light emitting portion, the first phosphor 23 is precipitated, a second fluorescent resin in which a second phosphor 24 is kneaded is applied, the second phosphor 24 is precipitated, a third fluorescent resin in which a third phosphor 25 is kneaded is kneaded, and then the third phosphor 25 is precipitated.SELECTED DRAWING: Figure 2 【課題】光学的な特性を維持向上させながら、蛍光体の発熱などで封止樹脂に蓄積された熱を効率よく実装基板側に伝達することができるＬＥＤ発光装置及びその製造方法を提供する。【解決手段】封止樹脂１５は、小粒径の第１蛍光体２３及び第２蛍光体２４と、大粒径の第３蛍光体２５とを含む堆積層２６を備えている。堆積層２６では、第１蛍光体２３及び第２蛍光体２４が第３蛍光体２５の間に充填されている。また、ＬＥＤ発光装置１０は、第１蛍光粒子２３が混練された第１蛍光樹脂を発光部に塗布し、第１蛍光体２３を沈降させ、その後、第２蛍光体２４が混練された第２蛍光樹脂の塗布、第２蛍光体２４の沈降、第３蛍光体２５が混練された第３蛍光樹脂の塗布、第３蛍光体２５の沈降を経て製造される。【選択図】図２