COPPER-CLAD LAMINATE
To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a...
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| creator | ORITA TAKAHIRO IWASAKO YASUSHI UENO SUKETSUGU |
| description | To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a matrix of a silicone resin in which methyl groups and ethyl groups account for 80% or more of a total functional groups, and the insulating layer 2 is directly bonded to the copper layer 1 and the substrate 4.SELECTED DRAWING: Figure 3
【課題】放熱性と耐電圧とを両立させることのできる銅張積層板を提供する。【解決手段】銅層１、絶縁層２および基板４をこの順に有し、絶縁層２は、メチル基およびエチル基が全体の官能基のうち８０％以上を占めるシリコーンレジンのマトリックス中に無機フィラーが分散した組織を有し、絶縁層２が銅層１と基板４にそれぞれ直接接合されている、銅張積層板。【選択図】図３ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021142723A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021142723A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021142723A3</originalsourceid><addsrcrecordid>eNrjZBBx9g8IcA3SdfZxdFHwcfT19HMMceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoaGJkbmRsaOxkQpAgCkQx7U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COPPER-CLAD LAMINATE</title><source>esp@cenet</source><creator>ORITA TAKAHIRO ; IWASAKO YASUSHI ; UENO SUKETSUGU</creator><creatorcontrib>ORITA TAKAHIRO ; IWASAKO YASUSHI ; UENO SUKETSUGU</creatorcontrib><description>To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a matrix of a silicone resin in which methyl groups and ethyl groups account for 80% or more of a total functional groups, and the insulating layer 2 is directly bonded to the copper layer 1 and the substrate 4.SELECTED DRAWING: Figure 3
【課題】放熱性と耐電圧とを両立させることのできる銅張積層板を提供する。【解決手段】銅層１、絶縁層２および基板４をこの順に有し、絶縁層２は、メチル基およびエチル基が全体の官能基のうち８０％以上を占めるシリコーンレジンのマトリックス中に無機フィラーが分散した組織を有し、絶縁層２が銅層１と基板４にそれぞれ直接接合されている、銅張積層板。【選択図】図３</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210924&DB=EPODOC&CC=JP&NR=2021142723A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210924&DB=EPODOC&CC=JP&NR=2021142723A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ORITA TAKAHIRO</creatorcontrib><creatorcontrib>IWASAKO YASUSHI</creatorcontrib><creatorcontrib>UENO SUKETSUGU</creatorcontrib><title>COPPER-CLAD LAMINATE</title><description>To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a matrix of a silicone resin in which methyl groups and ethyl groups account for 80% or more of a total functional groups, and the insulating layer 2 is directly bonded to the copper layer 1 and the substrate 4.SELECTED DRAWING: Figure 3
【課題】放熱性と耐電圧とを両立させることのできる銅張積層板を提供する。【解決手段】銅層１、絶縁層２および基板４をこの順に有し、絶縁層２は、メチル基およびエチル基が全体の官能基のうち８０％以上を占めるシリコーンレジンのマトリックス中に無機フィラーが分散した組織を有し、絶縁層２が銅層１と基板４にそれぞれ直接接合されている、銅張積層板。【選択図】図３</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBx9g8IcA3SdfZxdFHwcfT19HMMceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoaGJkbmRsaOxkQpAgCkQx7U</recordid><startdate>20210924</startdate><enddate>20210924</enddate><creator>ORITA TAKAHIRO</creator><creator>IWASAKO YASUSHI</creator><creator>UENO SUKETSUGU</creator><scope>EVB</scope></search><sort><creationdate>20210924</creationdate><title>COPPER-CLAD LAMINATE</title><author>ORITA TAKAHIRO ; IWASAKO YASUSHI ; UENO SUKETSUGU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021142723A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ORITA TAKAHIRO</creatorcontrib><creatorcontrib>IWASAKO YASUSHI</creatorcontrib><creatorcontrib>UENO SUKETSUGU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ORITA TAKAHIRO</au><au>IWASAKO YASUSHI</au><au>UENO SUKETSUGU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER-CLAD LAMINATE</title><date>2021-09-24</date><risdate>2021</risdate><abstract>To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a matrix of a silicone resin in which methyl groups and ethyl groups account for 80% or more of a total functional groups, and the insulating layer 2 is directly bonded to the copper layer 1 and the substrate 4.SELECTED DRAWING: Figure 3
【課題】放熱性と耐電圧とを両立させることのできる銅張積層板を提供する。【解決手段】銅層１、絶縁層２および基板４をこの順に有し、絶縁層２は、メチル基およびエチル基が全体の官能基のうち８０％以上を占めるシリコーンレジンのマトリックス中に無機フィラーが分散した組織を有し、絶縁層２が銅層１と基板４にそれぞれ直接接合されている、銅張積層板。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | COPPER-CLAD LAMINATE |
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