CHIP COMPONENT MOUNTING METHOD AND PRINTED CIRCUIT BOARD

To provide a chip component mounting method that can apply solder to second chip components that are stacked in multiple layers on a first chip component on a printed circuit board.SOLUTION: A solder 23 is applied to second component pads 20, which are formed on a printed circuit board 10 and to whi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGAMINE TAKAHIRO, KASHIMA MASANORI, SHIBATA YOSHIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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