GRID ARRAY CONNECTOR SYSTEM
To provide a connector system enabling connection to a chip package with low loss and enabling easy assembly.SOLUTION: Provided is a grid array connector system that includes cables 220 mounted on a substrate 250 having a chip packaged and mounted thereon. The cables 220 include conductors that are...
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| creator | SAGAR DALVI BRIAN KEITH LLOYD GREGORY WALZ KAREN HILLE COLBY WAGGENER TSAI CHITAOU BRUCE REED |
| description | To provide a connector system enabling connection to a chip package with low loss and enabling easy assembly.SOLUTION: Provided is a grid array connector system that includes cables 220 mounted on a substrate 250 having a chip packaged and mounted thereon. The cables 220 include conductors that are connected to support vias positioned in openings in the substrate 250, and the conductors are connected to the support vias. The substrate 250 can be connected to a second substrate 1010 which provides a stiffening ring. The substrate 250 can be connected to the second substrate 1010 by deflectable terminals 1080 which are press-fit into the second substrate 1010.SELECTED DRAWING: Figure 49
【課題】低い損失を有するチップパッケージへの接続を可能にし、かつ組み立ての容易さを可能にするコネクタシステムを提供する。【解決手段】その上にパッケージされて実装されたチップを有する基板２５０上に実装されたケーブル２２０を含む、グリッドアレイコネクタシステムが提供される。ケーブル２２０は、基板２５０内の開口部内に位置付けられた支持ビアに接続された導体を含み、導体は、支持ビアに接続されている。基板２５０は、補剛リングを提供する第２の基板１０１０に接続することができる。基板２５０は、第２の基板１０１０に圧入される偏向可能な端子１０８０によって、第２の基板１０１０に接続することができる。【選択図】図４９ |
| format | Patent |
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【課題】低い損失を有するチップパッケージへの接続を可能にし、かつ組み立ての容易さを可能にするコネクタシステムを提供する。【解決手段】その上にパッケージされて実装されたチップを有する基板２５０上に実装されたケーブル２２０を含む、グリッドアレイコネクタシステムが提供される。ケーブル２２０は、基板２５０内の開口部内に位置付けられた支持ビアに接続された導体を含み、導体は、支持ビアに接続されている。基板２５０は、補剛リングを提供する第２の基板１０１０に接続することができる。基板２５０は、第２の基板１０１０に圧入される偏向可能な端子１０８０によって、第２の基板１０１０に接続することができる。【選択図】図４９</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210830&DB=EPODOC&CC=JP&NR=2021125462A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210830&DB=EPODOC&CC=JP&NR=2021125462A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAGAR DALVI</creatorcontrib><creatorcontrib>BRIAN KEITH LLOYD</creatorcontrib><creatorcontrib>GREGORY WALZ</creatorcontrib><creatorcontrib>KAREN HILLE</creatorcontrib><creatorcontrib>COLBY WAGGENER</creatorcontrib><creatorcontrib>TSAI CHITAOU</creatorcontrib><creatorcontrib>BRUCE REED</creatorcontrib><title>GRID ARRAY CONNECTOR SYSTEM</title><description>To provide a connector system enabling connection to a chip package with low loss and enabling easy assembly.SOLUTION: Provided is a grid array connector system that includes cables 220 mounted on a substrate 250 having a chip packaged and mounted thereon. The cables 220 include conductors that are connected to support vias positioned in openings in the substrate 250, and the conductors are connected to the support vias. The substrate 250 can be connected to a second substrate 1010 which provides a stiffening ring. The substrate 250 can be connected to the second substrate 1010 by deflectable terminals 1080 which are press-fit into the second substrate 1010.SELECTED DRAWING: Figure 49
【課題】低い損失を有するチップパッケージへの接続を可能にし、かつ組み立ての容易さを可能にするコネクタシステムを提供する。【解決手段】その上にパッケージされて実装されたチップを有する基板２５０上に実装されたケーブル２２０を含む、グリッドアレイコネクタシステムが提供される。ケーブル２２０は、基板２５０内の開口部内に位置付けられた支持ビアに接続された導体を含み、導体は、支持ビアに接続されている。基板２５０は、補剛リングを提供する第２の基板１０１０に接続することができる。基板２５０は、第２の基板１０１０に圧入される偏向可能な端子１０８０によって、第２の基板１０１０に接続することができる。【選択図】図４９</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2D_J0UXAMCnKMVHD29_NzdQ7xD1IIjgwOcfXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkaGhkamJmZGjsZEKQIAleog_Q</recordid><startdate>20210830</startdate><enddate>20210830</enddate><creator>SAGAR DALVI</creator><creator>BRIAN KEITH LLOYD</creator><creator>GREGORY WALZ</creator><creator>KAREN HILLE</creator><creator>COLBY WAGGENER</creator><creator>TSAI CHITAOU</creator><creator>BRUCE REED</creator><scope>EVB</scope></search><sort><creationdate>20210830</creationdate><title>GRID ARRAY CONNECTOR SYSTEM</title><author>SAGAR DALVI ; BRIAN KEITH LLOYD ; GREGORY WALZ ; KAREN HILLE ; COLBY WAGGENER ; TSAI CHITAOU ; BRUCE REED</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021125462A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAGAR DALVI</creatorcontrib><creatorcontrib>BRIAN KEITH LLOYD</creatorcontrib><creatorcontrib>GREGORY WALZ</creatorcontrib><creatorcontrib>KAREN HILLE</creatorcontrib><creatorcontrib>COLBY WAGGENER</creatorcontrib><creatorcontrib>TSAI CHITAOU</creatorcontrib><creatorcontrib>BRUCE REED</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAGAR DALVI</au><au>BRIAN KEITH LLOYD</au><au>GREGORY WALZ</au><au>KAREN HILLE</au><au>COLBY WAGGENER</au><au>TSAI CHITAOU</au><au>BRUCE REED</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GRID ARRAY CONNECTOR SYSTEM</title><date>2021-08-30</date><risdate>2021</risdate><abstract>To provide a connector system enabling connection to a chip package with low loss and enabling easy assembly.SOLUTION: Provided is a grid array connector system that includes cables 220 mounted on a substrate 250 having a chip packaged and mounted thereon. The cables 220 include conductors that are connected to support vias positioned in openings in the substrate 250, and the conductors are connected to the support vias. The substrate 250 can be connected to a second substrate 1010 which provides a stiffening ring. The substrate 250 can be connected to the second substrate 1010 by deflectable terminals 1080 which are press-fit into the second substrate 1010.SELECTED DRAWING: Figure 49
【課題】低い損失を有するチップパッケージへの接続を可能にし、かつ組み立ての容易さを可能にするコネクタシステムを提供する。【解決手段】その上にパッケージされて実装されたチップを有する基板２５０上に実装されたケーブル２２０を含む、グリッドアレイコネクタシステムが提供される。ケーブル２２０は、基板２５０内の開口部内に位置付けられた支持ビアに接続された導体を含み、導体は、支持ビアに接続されている。基板２５０は、補剛リングを提供する第２の基板１０１０に接続することができる。基板２５０は、第２の基板１０１０に圧入される偏向可能な端子１０８０によって、第２の基板１０１０に接続することができる。【選択図】図４９</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | GRID ARRAY CONNECTOR SYSTEM |
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