CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER, AND METHOD FOR POLISHING TUNGSTEN PATTERN WAFER BY USING THE SAME

To provide a CMP slurry composition for polishing a tungsten pattern wafer, which can improve the polishing rate and flatness and eliminate a defect in a tungsten pattern wafer surface when polishing the tungsten pattern wafer.SOLUTION: A CMP slurry composition for polishing a tungsten pattern wafer...

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Bibliographische Detailangaben
Hauptverfasser:	KIM WON JUNG, PARK TAE WON, CHO YOUN JIN, LEE EUI RANG, LEE JONG-WON, KOO YOON YOUNG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY COMPOUNDS THEREOF DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INORGANIC CHEMISTRY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-METALLIC ELEMENTS PAINTS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES THEIR RELEVANT APPARATUS TRANSPORTING
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